
Alexander O Williams
Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 10525557
[patent_doc_number] => 09252077
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-02-02
[patent_title] => 'Package vias for radio frequency antenna connections'
[patent_app_type] => utility
[patent_app_number] => 14/037213
[patent_app_country] => US
[patent_app_date] => 2013-09-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 15
[patent_no_of_words] => 6448
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037213
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/037213 | Package vias for radio frequency antenna connections | Sep 24, 2013 | Issued |
Array
(
[id] => 10125324
[patent_doc_number] => 09159690
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-10-13
[patent_title] => 'Tall solders for through-mold interconnect'
[patent_app_type] => utility
[patent_app_number] => 14/036755
[patent_app_country] => US
[patent_app_date] => 2013-09-25
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/036755 | Tall solders for through-mold interconnect | Sep 24, 2013 | Issued |
Array
(
[id] => 10066754
[patent_doc_number] => 09105612
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-08-11
[patent_title] => 'Microelectronic packages having cavities for receiving microelectronic elements'
[patent_app_type] => utility
[patent_app_number] => 14/034265
[patent_app_country] => US
[patent_app_date] => 2013-09-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 56
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/034265 | Microelectronic packages having cavities for receiving microelectronic elements | Sep 22, 2013 | Issued |
Array
(
[id] => 10531232
[patent_doc_number] => 09257372
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-02-09
[patent_title] => 'Surface mount package for a semiconductor integrated device, related assembly and manufacturing process'
[patent_app_type] => utility
[patent_app_number] => 14/032075
[patent_app_country] => US
[patent_app_date] => 2013-09-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/032075 | Surface mount package for a semiconductor integrated device, related assembly and manufacturing process | Sep 18, 2013 | Issued |
Array
(
[id] => 10178951
[patent_doc_number] => 09209164
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-12-08
[patent_title] => 'Interconnection structure of package structure and method of forming the same'
[patent_app_type] => utility
[patent_app_number] => 14/020045
[patent_app_country] => US
[patent_app_date] => 2013-09-06
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/020045 | Interconnection structure of package structure and method of forming the same | Sep 5, 2013 | Issued |
Array
(
[id] => 10184753
[patent_doc_number] => 09214434
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2015-12-15
[patent_title] => 'Fan-out semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 14/017802
[patent_app_country] => US
[patent_app_date] => 2013-09-04
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/017802 | Fan-out semiconductor package | Sep 3, 2013 | Issued |
Array
(
[id] => 10531195
[patent_doc_number] => 09257335
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2016-02-09
[patent_title] => 'Electronic devices utilizing contact pads with protrusions and methods for fabrication'
[patent_app_type] => utility
[patent_app_number] => 14/426302
[patent_app_country] => US
[patent_app_date] => 2013-09-04
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[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14426302
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/426302 | Electronic devices utilizing contact pads with protrusions and methods for fabrication | Sep 3, 2013 | Issued |
Array
(
[id] => 10053689
[patent_doc_number] => 09093575
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode'
[patent_app_type] => utility
[patent_app_number] => 14/017816
[patent_app_country] => US
[patent_app_date] => 2013-09-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 47
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/017816 | Semiconductor device and solid-state imaging device with tantalum oxide layer formed by diffusing a material of an electrode of necessity or a counter electrode | Sep 3, 2013 | Issued |
Array
(
[id] => 10053270
[patent_doc_number] => 09093150
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-07-28
[patent_title] => 'Multi-chip packaged integrated circuit with flash memory and slave memory controller'
[patent_app_type] => utility
[patent_app_number] => 14/016224
[patent_app_country] => US
[patent_app_date] => 2013-09-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/016224 | Multi-chip packaged integrated circuit with flash memory and slave memory controller | Sep 2, 2013 | Issued |
Array
(
[id] => 9832412
[patent_doc_number] => 08941230
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-01-27
[patent_title] => 'Semiconductor package and manufacturing method'
[patent_app_type] => utility
[patent_app_number] => 14/010245
[patent_app_country] => US
[patent_app_date] => 2013-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14010245
[rel_patent_id] =>[rel_patent_doc_number] =>) 14/010245 | Semiconductor package and manufacturing method | Aug 25, 2013 | Issued |
Array
(
[id] => 10093117
[patent_doc_number] => 09129947
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2015-09-08
[patent_title] => 'Multi-chip packaging structure and method'
[patent_app_type] => utility
[patent_app_number] => 13/973132
[patent_app_country] => US
[patent_app_date] => 2013-08-22
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/973132 | Multi-chip packaging structure and method | Aug 21, 2013 | Issued |
Array
(
[id] => 9455858
[patent_doc_number] => 08716872
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-05-06
[patent_title] => 'Stacked semiconductor package including connections electrically connecting first and second semiconductor packages'
[patent_app_type] => utility
[patent_app_number] => 13/970071
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/970071 | Stacked semiconductor package including connections electrically connecting first and second semiconductor packages | Aug 18, 2013 | Issued |
Array
(
[id] => 9303942
[patent_doc_number] => 20140042617
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[patent_kind] => A1
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[patent_title] => 'SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE'
[patent_app_type] => utility
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13961225
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/961225 | SEMICONDUCTOR DEVICE HAVING PENETRATION ELECTRODE | Aug 6, 2013 | Abandoned |
Array
(
[id] => 9291498
[patent_doc_number] => 20140035132
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-02-06
[patent_title] => 'SURFACE MOUNT CHIP'
[patent_app_type] => utility
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13955325
[rel_patent_id] =>[rel_patent_doc_number] =>) 13/955325 | SURFACE MOUNT CHIP | Jul 30, 2013 | Abandoned |
Array
(
[id] => 9542590
[patent_doc_number] => 20140167237
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-06-19
[patent_title] => 'POWER MODULE PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 13/950205
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/950205 | POWER MODULE PACKAGE | Jul 23, 2013 | Abandoned |
Array
(
[id] => 9266687
[patent_doc_number] => 20140021603
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[patent_kind] => A1
[patent_issue_date] => 2014-01-23
[patent_title] => 'USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER OF A SEMICONDUCTOR DIE'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/948516 | USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER OF A SEMICONDUCTOR DIE | Jul 22, 2013 | Abandoned |
Array
(
[id] => 10010563
[patent_doc_number] => 09054089
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[patent_kind] => B2
[patent_issue_date] => 2015-06-09
[patent_title] => 'Lead frame package having discharge holes and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 13/949186
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/949186 | Lead frame package having discharge holes and method of manufacturing the same | Jul 22, 2013 | Issued |
Array
(
[id] => 9303934
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Array
(
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[patent_title] => 'AIR CAVITY PACKAGES HAVING HIGH THERMAL CONDUCTIVITY BASE PLATES AND METHODS OF MAKING'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/930105 | Semiconductor packages having metal composite base plates | Jun 27, 2013 | Issued |
Array
(
[id] => 10145084
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[patent_issue_date] => 2015-11-03
[patent_title] => 'Integrated circuit packaging system with trace protection layer and method of manufacture thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/930319 | Integrated circuit packaging system with trace protection layer and method of manufacture thereof | Jun 27, 2013 | Issued |