Search

Alexander O Williams

Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9013937 [patent_doc_number] => 20130228901 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-05 [patent_title] => 'MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS' [patent_app_type] => utility [patent_app_number] => 13/838426 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 15503 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13838426 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/838426
Materials and methods for stress reduction in semiconductor wafer passivation layers Mar 14, 2013 Issued
Array ( [id] => 9729129 [patent_doc_number] => 20140264836 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'SYSTEM-IN-PACKAGE WITH INTERPOSER PITCH ADAPTER' [patent_app_type] => utility [patent_app_number] => 13/839816 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5325 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13839816 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/839816
System-in-package with interposer pitch adapter Mar 14, 2013 Issued
Array ( [id] => 9178540 [patent_doc_number] => 20130320525 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-12-05 [patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF' [patent_app_type] => utility [patent_app_number] => 13/842582 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4595 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13842582 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/842582
Integrated circuit packaging system with substrate and method of manufacture thereof Mar 14, 2013 Issued
Array ( [id] => 9274042 [patent_doc_number] => 08637976 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-28 [patent_title] => 'Semiconductor device with lead terminals having portions thereof extending obliquely' [patent_app_type] => utility [patent_app_number] => 13/832377 [patent_app_country] => US [patent_app_date] => 2013-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4150 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 206 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13832377 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/832377
Semiconductor device with lead terminals having portions thereof extending obliquely Mar 14, 2013 Issued
Array ( [id] => 10864597 [patent_doc_number] => 08890303 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-18 [patent_title] => 'Three-dimensional integrated circuit' [patent_app_type] => utility [patent_app_number] => 13/831150 [patent_app_country] => US [patent_app_date] => 2013-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 5044 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13831150 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/831150
Three-dimensional integrated circuit Mar 13, 2013 Issued
Array ( [id] => 9220194 [patent_doc_number] => 20140014969 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-01-16 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/803515 [patent_app_country] => US [patent_app_date] => 2013-03-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3413 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13803515 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/803515
Semiconductor device including transistor chips having oblique gate electrode fingers Mar 13, 2013 Issued
Array ( [id] => 8925598 [patent_doc_number] => 20130181358 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-18 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A FIRST WIRING HAVING A BENDING PORTION A VIA' [patent_app_type] => utility [patent_app_number] => 13/789107 [patent_app_country] => US [patent_app_date] => 2013-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 11457 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13789107 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/789107
Semiconductor device including a first wiring having a bending portion a via Mar 6, 2013 Issued
Array ( [id] => 8901362 [patent_doc_number] => 20130168865 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-04 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE' [patent_app_type] => utility [patent_app_number] => 13/780396 [patent_app_country] => US [patent_app_date] => 2013-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 39 [patent_no_of_words] => 16260 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13780396 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/780396
Semiconductor device including two groove-shaped patterns Feb 27, 2013 Issued
Array ( [id] => 10845172 [patent_doc_number] => 08872353 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-28 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/780311 [patent_app_country] => US [patent_app_date] => 2013-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16268 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13780311 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/780311
Semiconductor device having groove-shaped via-hole Feb 27, 2013 Issued
Array ( [id] => 9778653 [patent_doc_number] => 08853861 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-07 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/780174 [patent_app_country] => US [patent_app_date] => 2013-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16268 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13780174 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/780174
Semiconductor device having groove-shaped via-hole Feb 27, 2013 Issued
Array ( [id] => 10845171 [patent_doc_number] => 08872352 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-28 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/780236 [patent_app_country] => US [patent_app_date] => 2013-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16268 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13780236 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/780236
Semiconductor device having groove-shaped via-hole Feb 27, 2013 Issued
Array ( [id] => 10599064 [patent_doc_number] => 09320173 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Semiconductor device having a bulge portion and manufacturing method therefor' [patent_app_type] => utility [patent_app_number] => 14/374363 [patent_app_country] => US [patent_app_date] => 2013-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 17 [patent_no_of_words] => 9472 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14374363 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/374363
Semiconductor device having a bulge portion and manufacturing method therefor Feb 17, 2013 Issued
Array ( [id] => 10544548 [patent_doc_number] => 09269681 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-23 [patent_title] => 'Surface finish on trace for a thermal compression flip chip (TCFC)' [patent_app_type] => utility [patent_app_number] => 13/741810 [patent_app_country] => US [patent_app_date] => 2013-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 7309 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13741810 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/741810
Surface finish on trace for a thermal compression flip chip (TCFC) Jan 14, 2013 Issued
Array ( [id] => 8825988 [patent_doc_number] => 20130127033 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-05-23 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 13/741879 [patent_app_country] => US [patent_app_date] => 2013-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 9548 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13741879 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/741879
Semiconductor device Jan 14, 2013 Issued
Array ( [id] => 9600859 [patent_doc_number] => 20140197541 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-17 [patent_title] => 'MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE' [patent_app_type] => utility [patent_app_number] => 13/741743 [patent_app_country] => US [patent_app_date] => 2013-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8756 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13741743 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/741743
Microelectronic assembly having a heat spreader for a plurality of die Jan 14, 2013 Issued
Array ( [id] => 10016107 [patent_doc_number] => 09059128 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-16 [patent_title] => 'Semiconductor device having improved thermal properties' [patent_app_type] => utility [patent_app_number] => 13/742079 [patent_app_country] => US [patent_app_date] => 2013-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 2503 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13742079 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/742079
Semiconductor device having improved thermal properties Jan 14, 2013 Issued
Array ( [id] => 9923580 [patent_doc_number] => 08981550 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-17 [patent_title] => 'Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same' [patent_app_type] => utility [patent_app_number] => 13/725645 [patent_app_country] => US [patent_app_date] => 2012-12-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 2360 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13725645 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/725645
Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same Dec 20, 2012 Issued
Array ( [id] => 10845148 [patent_doc_number] => 08872328 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-28 [patent_title] => 'Integrated power module package' [patent_app_type] => utility [patent_app_number] => 13/720351 [patent_app_country] => US [patent_app_date] => 2012-12-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 4251 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13720351 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/720351
Integrated power module package Dec 18, 2012 Issued
Array ( [id] => 8925576 [patent_doc_number] => 20130181336 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-07-18 [patent_title] => 'SEMICONDUCTOR PACKAGE WITH IMPROVED THERMAL PROPERTIES' [patent_app_type] => utility [patent_app_number] => 13/718856 [patent_app_country] => US [patent_app_date] => 2012-12-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3965 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13718856 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/718856
Semiconductor package with improved thermal properties Dec 17, 2012 Issued
Array ( [id] => 9414236 [patent_doc_number] => 08698273 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-15 [patent_title] => 'Semiconductor integrated circuit device having improved interconnect accuracy near cell boundaries' [patent_app_type] => utility [patent_app_number] => 13/714020 [patent_app_country] => US [patent_app_date] => 2012-12-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 6650 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13714020 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/714020
Semiconductor integrated circuit device having improved interconnect accuracy near cell boundaries Dec 12, 2012 Issued
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