
Alexander O Williams
Examiner (ID: 4421, Phone: (571)272-1924 , Office: P/2826 )
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9013937
[patent_doc_number] => 20130228901
[patent_country] => US
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[patent_issue_date] => 2013-09-05
[patent_title] => 'MATERIALS AND METHODS FOR STRESS REDUCTION IN SEMICONDUCTOR WAFER PASSIVATION LAYERS'
[patent_app_type] => utility
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Array
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[patent_issue_date] => 2014-09-18
[patent_title] => 'SYSTEM-IN-PACKAGE WITH INTERPOSER PITCH ADAPTER'
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Array
(
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[patent_title] => 'INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF'
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Array
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/789107 | Semiconductor device including a first wiring having a bending portion a via | Mar 6, 2013 | Issued |
Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/780396 | Semiconductor device including two groove-shaped patterns | Feb 27, 2013 | Issued |
Array
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Array
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Array
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Array
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Array
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Array
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