Alexander O. Williams

Array ( [id] => 9582947 [patent_doc_number] => 08772950 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-08 [patent_title] => 'Methods and apparatus for flip chip substrate with guard rings outside of a die attach region' [patent_app_type] => utility [patent_app_number] => 13/671284 [patent_app_country] => US [patent_app_date] => 2012-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4421 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13671284 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8863334 [patent_doc_number] => 20130147037 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-06-13 [patent_title] => 'SEMICONDUCTOR STRUCTURE' [patent_app_type] => utility [patent_app_number] => 13/671202 [patent_app_country] => US [patent_app_date] => 2012-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2588 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13671202 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8838948 [patent_doc_number] => 20130134576 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-05-30 [patent_title] => 'SEMICONDUCTOR APPARATUS, SEMICONDUCTOR-APPARATUS MANUFACTURING METHOD AND ELECTRONIC EQUIPMENT' [patent_app_type] => utility [patent_app_number] => 13/671130 [patent_app_country] => US [patent_app_date] => 2012-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 29 [patent_figures_cnt] => 29 [patent_no_of_words] => 14585 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13671130 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9828158 [patent_doc_number] => 08937387 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-01-20 [patent_title] => 'Semiconductor device with conductive vias' [patent_app_type] => utility [patent_app_number] => 13/671409 [patent_app_country] => US [patent_app_date] => 2012-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 24 [patent_no_of_words] => 6293 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13671409 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10004123 [patent_doc_number] => 09048221 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-06-02 [patent_title] => 'Device having electrodes formed from bumps with different diameters' [patent_app_type] => utility [patent_app_number] => 13/671033 [patent_app_country] => US [patent_app_date] => 2012-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 21 [patent_no_of_words] => 10334 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13671033 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9104726 [patent_doc_number] => 20130277857 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-10-24 [patent_title] => 'STACK TYPE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING AND TESTING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/601097 [patent_app_country] => US [patent_app_date] => 2012-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2830 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13601097 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9711534 [patent_doc_number] => 08836110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-16 [patent_title] => 'Heat spreader for use within a packaged semiconductor device' [patent_app_type] => utility [patent_app_number] => 13/600364 [patent_app_country] => US [patent_app_date] => 2012-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 7 [patent_no_of_words] => 3389 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13600364 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9621398 [patent_doc_number] => 08791573 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-07-29 [patent_title] => 'Skewed partial column input/output floorplan' [patent_app_type] => utility [patent_app_number] => 13/601894 [patent_app_country] => US [patent_app_date] => 2012-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 5168 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13601894 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9497234 [patent_doc_number] => 08736056 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-05-27 [patent_title] => 'Device for reducing contact resistance of a metal' [patent_app_type] => utility [patent_app_number] => 13/601223 [patent_app_country] => US [patent_app_date] => 2012-08-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 5251 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13601223 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9576028 [patent_doc_number] => 08766446 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-01 [patent_title] => 'Semiconductor memory device' [patent_app_type] => utility [patent_app_number] => 13/599053 [patent_app_country] => US [patent_app_date] => 2012-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 28 [patent_no_of_words] => 7404 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13599053 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9051393 [patent_doc_number] => 20130249107 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-09-26 [patent_title] => 'MULTI-CHIP SEMICONDUCTOR APPARATUS' [patent_app_type] => utility [patent_app_number] => 13/600164 [patent_app_country] => US [patent_app_date] => 2012-08-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4012 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13600164 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9552925 [patent_doc_number] => 08759979 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-24 [patent_title] => 'Semiconductor memory device having dummy conductive patterns on interconnection' [patent_app_type] => utility [patent_app_number] => 13/598303 [patent_app_country] => US [patent_app_date] => 2012-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2157 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13598303 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9996590 [patent_doc_number] => 09041192 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-05-26 [patent_title] => 'Hybrid thermal interface material for IC packages with integrated heat spreader' [patent_app_type] => utility [patent_app_number] => 13/598291 [patent_app_country] => US [patent_app_date] => 2012-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 14 [patent_no_of_words] => 7939 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13598291 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9335131 [patent_doc_number] => 20140061913 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-03-06 [patent_title] => 'Aluminum Interconnection Apparatus' [patent_app_type] => utility [patent_app_number] => 13/596893 [patent_app_country] => US [patent_app_date] => 2012-08-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3859 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13596893 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 8680927 [patent_doc_number] => 20130049211 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-02-28 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/593992 [patent_app_country] => US [patent_app_date] => 2012-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 3817 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13593992 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9327999 [patent_doc_number] => 20140054781 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-27 [patent_title] => 'Copper Ball Bond Features and Structure' [patent_app_type] => utility [patent_app_number] => 13/594732 [patent_app_country] => US [patent_app_date] => 2012-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 12592 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13594732 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9328002 [patent_doc_number] => 20140054784 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-27 [patent_title] => 'Integrated Circuit Connector Access Region and Method for Making' [patent_app_type] => utility [patent_app_number] => 13/594372 [patent_app_country] => US [patent_app_date] => 2012-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 27 [patent_no_of_words] => 4762 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13594372 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9328007 [patent_doc_number] => 20140054789 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-02-27 [patent_title] => 'Multi-Level Vertical Plug Formation With Stop Layers of Increasing Thicknesses' [patent_app_type] => utility [patent_app_number] => 13/593328 [patent_app_country] => US [patent_app_date] => 2012-08-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 33 [patent_figures_cnt] => 33 [patent_no_of_words] => 6794 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13593328 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9428282 [patent_doc_number] => 08704362 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-22 [patent_title] => 'Resin-diamagnetic material composite structure' [patent_app_type] => utility [patent_app_number] => 13/591294 [patent_app_country] => US [patent_app_date] => 2012-08-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 6585 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13591294 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9889487 [patent_doc_number] => 08975747 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-03-10 [patent_title] => 'Wiring material and semiconductor module using the same' [patent_app_type] => utility [patent_app_number] => 14/238376 [patent_app_country] => US [patent_app_date] => 2012-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 21 [patent_no_of_words] => 9791 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 166 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14238376 [rel_patent_id] =>[rel_patent_doc_number] =>)