Search

Alexander O. Williams

Examiner (ID: 4421)

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9389967 [patent_doc_number] => 08686571 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-01 [patent_title] => 'Bonding layer structure and method for wafer to wafer bonding' [patent_app_type] => utility [patent_app_number] => 13/571260 [patent_app_country] => US [patent_app_date] => 2012-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 2684 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13571260 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/571260
Bonding layer structure and method for wafer to wafer bonding Aug 8, 2012 Issued
Array ( [id] => 9965412 [patent_doc_number] => 09013029 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-04-21 [patent_title] => 'Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same' [patent_app_type] => utility [patent_app_number] => 13/882436 [patent_app_country] => US [patent_app_date] => 2012-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 5156 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13882436 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/882436
Joined body having an anti-corrosion film formed around a junction portion, and a semiconductor device having the same Aug 7, 2012 Issued
Array ( [id] => 8777405 [patent_doc_number] => 20130099380 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-04-25 [patent_title] => 'WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF' [patent_app_type] => utility [patent_app_number] => 13/569729 [patent_app_country] => US [patent_app_date] => 2012-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 2813 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13569729 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/569729
WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF Aug 7, 2012 Abandoned
Array ( [id] => 8863359 [patent_doc_number] => 20130147062 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-06-13 [patent_title] => 'MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/567046 [patent_app_country] => US [patent_app_date] => 2012-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 5650 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13567046 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/567046
Multi-chip package with a supporting member and method of manufacturing the same Aug 3, 2012 Issued
Array ( [id] => 10099842 [patent_doc_number] => 09136160 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-09-15 [patent_title] => 'Solid hole array and method for forming the same' [patent_app_type] => utility [patent_app_number] => 13/697372 [patent_app_country] => US [patent_app_date] => 2012-07-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 2342 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 203 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13697372 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/697372
Solid hole array and method for forming the same Jul 30, 2012 Issued
Array ( [id] => 9441546 [patent_doc_number] => 08710660 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-29 [patent_title] => 'Hybrid interconnect scheme including aluminum metal line in low-k dielectric' [patent_app_type] => utility [patent_app_number] => 13/554817 [patent_app_country] => US [patent_app_date] => 2012-07-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3110 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13554817 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/554817
Hybrid interconnect scheme including aluminum metal line in low-k dielectric Jul 19, 2012 Issued
Array ( [id] => 9286858 [patent_doc_number] => 08643189 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2014-02-04 [patent_title] => 'Packaged semiconductor die with power rail pads' [patent_app_type] => utility [patent_app_number] => 13/550627 [patent_app_country] => US [patent_app_date] => 2012-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 12 [patent_no_of_words] => 3984 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13550627 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/550627
Packaged semiconductor die with power rail pads Jul 16, 2012 Issued
Array ( [id] => 9504259 [patent_doc_number] => 08742577 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-06-03 [patent_title] => 'Semiconductor package having an anti-contact layer' [patent_app_type] => utility [patent_app_number] => 13/550949 [patent_app_country] => US [patent_app_date] => 2012-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 8337 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13550949 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/550949
Semiconductor package having an anti-contact layer Jul 16, 2012 Issued
Array ( [id] => 8615409 [patent_doc_number] => 20130020721 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2013-01-24 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/549789 [patent_app_country] => US [patent_app_date] => 2012-07-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6470 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13549789 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/549789
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Jul 15, 2012 Abandoned
Array ( [id] => 10845167 [patent_doc_number] => 08872347 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-10-28 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/548857 [patent_app_country] => US [patent_app_date] => 2012-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16268 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13548857 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/548857
Semiconductor device having groove-shaped via-hole Jul 12, 2012 Issued
Array ( [id] => 8480990 [patent_doc_number] => 20120280396 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-08 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE' [patent_app_type] => utility [patent_app_number] => 13/548911 [patent_app_country] => US [patent_app_date] => 2012-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 39 [patent_no_of_words] => 16258 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13548911 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/548911
Semiconductor device having groove-shaped via-hole Jul 12, 2012 Issued
Array ( [id] => 9704611 [patent_doc_number] => 08829681 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-09-09 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/549006 [patent_app_country] => US [patent_app_date] => 2012-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16268 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13549006 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/549006
Semiconductor device having groove-shaped via-hole Jul 12, 2012 Issued
Array ( [id] => 8474562 [patent_doc_number] => 20120273969 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-01 [patent_title] => 'SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE' [patent_app_type] => utility [patent_app_number] => 13/548792 [patent_app_country] => US [patent_app_date] => 2012-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 39 [patent_no_of_words] => 16260 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13548792 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/548792
Semiconductor device having groove-shaped via-hole Jul 12, 2012 Issued
Array ( [id] => 9227925 [patent_doc_number] => 08633595 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-01-21 [patent_title] => 'Semiconductor device having groove-shaped via-hole' [patent_app_type] => utility [patent_app_number] => 13/548966 [patent_app_country] => US [patent_app_date] => 2012-07-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 64 [patent_no_of_words] => 16260 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13548966 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/548966
Semiconductor device having groove-shaped via-hole Jul 12, 2012 Issued
Array ( [id] => 8474485 [patent_doc_number] => 20120273892 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-11-01 [patent_title] => 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME' [patent_app_type] => utility [patent_app_number] => 13/546524 [patent_app_country] => US [patent_app_date] => 2012-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 71 [patent_figures_cnt] => 71 [patent_no_of_words] => 38543 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13546524 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/546524
Semiconductor device and manufacturing method of the same Jul 10, 2012 Issued
Array ( [id] => 9441541 [patent_doc_number] => 08710655 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-29 [patent_title] => 'Die packages and systems having the die packages' [patent_app_type] => utility [patent_app_number] => 13/546517 [patent_app_country] => US [patent_app_date] => 2012-07-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4308 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13546517 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/546517
Die packages and systems having the die packages Jul 10, 2012 Issued
Array ( [id] => 9590035 [patent_doc_number] => 08779578 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-15 [patent_title] => 'Multi-chip socket' [patent_app_type] => utility [patent_app_number] => 13/537404 [patent_app_country] => US [patent_app_date] => 2012-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 3622 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13537404 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/537404
Multi-chip socket Jun 28, 2012 Issued
Array ( [id] => 8404989 [patent_doc_number] => 20120237046 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-20 [patent_title] => 'INTERCOM HEADSET CONNECTION AND DISCONNECTION RESPONSES' [patent_app_type] => utility [patent_app_number] => 13/488781 [patent_app_country] => US [patent_app_date] => 2012-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 10305 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13488781 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/488781
Intercom headset connection and disconnection responses Jun 4, 2012 Issued
Array ( [id] => 9441567 [patent_doc_number] => 08710681 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-04-29 [patent_title] => 'Isolation rings for blocking the interface between package components and the respective molding compound' [patent_app_type] => utility [patent_app_number] => 13/485527 [patent_app_country] => US [patent_app_date] => 2012-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 2383 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13485527 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/485527
Isolation rings for blocking the interface between package components and the respective molding compound May 30, 2012 Issued
Array ( [id] => 8390874 [patent_doc_number] => 20120228712 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-09-13 [patent_title] => 'NONVOLATILE MEMORY DEVICES' [patent_app_type] => utility [patent_app_number] => 13/478482 [patent_app_country] => US [patent_app_date] => 2012-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5083 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 13478482 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/478482
Nonvolatile memory devices having a three dimensional structure May 22, 2012 Issued
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