
Alexander O. Williams
Examiner (ID: 4421)
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 9303935
[patent_doc_number] => 20140042609
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2014-02-13
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 14/110935
[patent_app_country] => US
[patent_app_date] => 2012-05-11
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[patent_drawing_sheets_cnt] => 10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 14/110935 | Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same | May 10, 2012 | Issued |
Array
(
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[patent_kind] => B2
[patent_issue_date] => 2015-07-21
[patent_title] => 'Semiconductor device with stacked semiconductor chips'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/462499 | Semiconductor device with stacked semiconductor chips | May 1, 2012 | Issued |
Array
(
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[patent_issue_date] => 2016-04-05
[patent_title] => 'Support mounted electrically interconnected die assembly'
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[patent_app_number] => 13/456126
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[patent_app_date] => 2012-04-25
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/456126 | Support mounted electrically interconnected die assembly | Apr 24, 2012 | Issued |
Array
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[patent_doc_number] => 20120201395
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[patent_kind] => A1
[patent_issue_date] => 2012-08-09
[patent_title] => 'METHOD AND SYSTEM FOR CONTROLLING A MAXIMUM SIGNAL LEVEL OUTPUT TO HEADPHONES COUPLED TO A WIRELESS DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/450349
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/450349 | Method and system for controlling a maximum signal level output to headphones coupled to a wireless device | Apr 17, 2012 | Issued |
Array
(
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[patent_doc_number] => 08749055
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[patent_issue_date] => 2014-06-10
[patent_title] => 'Semiconductor device with resin mold'
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Array
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[patent_doc_number] => 20120168932
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[patent_issue_date] => 2012-07-05
[patent_title] => 'SEMICONDUCTOR ASSEMBLY THAT INCLUDES A POWER SEMICONDUCTOR DIE LOCATED ON A CELL DEFINED BY FIRST AND SECOND PATTERNED POLYMER LAYERS'
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Array
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[patent_title] => 'Method for processing semiconductors using a combination of electron beam and optical lithography'
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Array
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[patent_doc_number] => 08796832
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[patent_issue_date] => 2014-08-05
[patent_title] => 'Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device'
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Array
(
[id] => 9951790
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[patent_issue_date] => 2015-04-07
[patent_title] => 'Power semiconductor module and power conversion device'
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Array
(
[id] => 8426740
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[patent_title] => 'MEMS DEVICE AND MANUFACTURING PROCESS THEREOF'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/401075 | MEMS device with simplified electrical conducting paths | Feb 20, 2012 | Issued |
Array
(
[id] => 8987119
[patent_doc_number] => 20130214400
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[patent_issue_date] => 2013-08-22
[patent_title] => 'MICRO-ELECTRO MECHANICAL SYSTEMS (MEMS) STRUCTURES AND METHODS OF FORMING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/399903 | Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same | Feb 16, 2012 | Issued |
Array
(
[id] => 9428304
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Array
(
[id] => 8987125
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[patent_title] => 'Flexible Heat Sink With Lateral Compliance'
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Array
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[patent_title] => 'Semiconductor packaging method and structure thereof'
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Array
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/398372 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | Feb 15, 2012 | Abandoned |
Array
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Array
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Array
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