
Alexander O. Williams
Examiner (ID: 4421)
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
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[patent_doc_number] => 08686566
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-04-01
[patent_title] => 'In situ-built pin-grid arrays for coreless substrates, and methods of making same'
[patent_app_type] => utility
[patent_app_number] => 13/174109
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Array
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Array
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[patent_issue_date] => 2012-09-06
[patent_title] => 'Package 3D Interconnection and Method of Making Same'
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Array
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[patent_issue_date] => 2013-04-16
[patent_title] => 'Semiconductor device with heat spreaders'
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Array
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[patent_doc_number] => 08513806
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[patent_issue_date] => 2013-08-20
[patent_title] => 'Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device'
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Array
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[patent_issue_date] => 2013-08-20
[patent_title] => 'Film for flip chip type semiconductor back surface containing thermoconductive filler'
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[patent_app_number] => 13/173226
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/171801 | Semiconductor device with exposed thermal conductivity part | Jun 28, 2011 | Issued |
Array
(
[id] => 7506864
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[patent_issue_date] => 2011-10-20
[patent_title] => 'SEMICONDUCTOR MEMORY DEVICE'
[patent_app_type] => utility
[patent_app_number] => 13/172571
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/172571 | Semiconductor memory device | Jun 28, 2011 | Issued |
Array
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[id] => 8802851
[patent_doc_number] => 08441127
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[patent_issue_date] => 2013-05-14
[patent_title] => 'Bump-on-trace structures with wide and narrow portions'
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Array
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[patent_issue_date] => 2013-08-20
[patent_title] => 'Semiconductor package having main stamp and sub-stamp'
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Array
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[id] => 8713829
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[patent_title] => 'Semiconductor device attached to island having protrusion'
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Array
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[id] => 7738919
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Array
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[patent_title] => 'SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/171382 | Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same | Jun 27, 2011 | Issued |
Array
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[patent_title] => 'Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 13/153930 | Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices | Jun 5, 2011 | Issued |
Array
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[patent_title] => 'POWER PACKAGE MODULE AND METHOD FOR FABRICATING THE SAME'
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Array
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Array
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Array
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