
Alexander O. Williams
Examiner (ID: 4421)
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 8071605
[patent_doc_number] => 20110241222
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-06
[patent_title] => 'Semiconductor Package and Manufacturing Method'
[patent_app_type] => utility
[patent_app_number] => 12/750969
[patent_app_country] => US
[patent_app_date] => 2010-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 8247
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0241/20110241222.pdf
[firstpage_image] =>[orig_patent_app_number] => 12750969
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/750969 | Semiconductor package and multichip arrangement having a polymer layer and an encapsulant | Mar 30, 2010 | Issued |
Array
(
[id] => 8190303
[patent_doc_number] => 08183696
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-05-22
[patent_title] => 'Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads'
[patent_app_type] => utility
[patent_app_number] => 12/750946
[patent_app_country] => US
[patent_app_date] => 2010-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 8265
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 79
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/183/08183696.pdf
[firstpage_image] =>[orig_patent_app_number] => 12750946
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/750946 | Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads | Mar 30, 2010 | Issued |
Array
(
[id] => 9608913
[patent_doc_number] => 08786084
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-07-22
[patent_title] => 'Semiconductor package and method of forming'
[patent_app_type] => utility
[patent_app_number] => 12/751088
[patent_app_country] => US
[patent_app_date] => 2010-03-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2417
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12751088
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/751088 | Semiconductor package and method of forming | Mar 30, 2010 | Issued |
Array
(
[id] => 6321616
[patent_doc_number] => 20100244281
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-30
[patent_title] => 'FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/750597
[patent_app_country] => US
[patent_app_date] => 2010-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 6945
[patent_no_of_claims] => 9
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[pdf_file] => publications/A1/0244/20100244281.pdf
[firstpage_image] =>[orig_patent_app_number] => 12750597
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/750597 | FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME | Mar 29, 2010 | Abandoned |
Array
(
[id] => 8071641
[patent_doc_number] => 20110241202
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-10-06
[patent_title] => 'Dummy Metal Design for Packaging Structures'
[patent_app_type] => utility
[patent_app_number] => 12/750468
[patent_app_country] => US
[patent_app_date] => 2010-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 2772
[patent_no_of_claims] => 20
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[pdf_file] => publications/A1/0241/20110241202.pdf
[firstpage_image] =>[orig_patent_app_number] => 12750468
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/750468 | Dummy metal design for packaging structures | Mar 29, 2010 | Issued |
Array
(
[id] => 8410751
[patent_doc_number] => 08274149
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-09-25
[patent_title] => 'Semiconductor device package having a buffer structure and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 12/749191
[patent_app_country] => US
[patent_app_date] => 2010-03-29
[patent_effective_date] => 0000-00-00
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12749191
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/749191 | Semiconductor device package having a buffer structure and method of fabricating the same | Mar 28, 2010 | Issued |
Array
(
[id] => 6321603
[patent_doc_number] => 20100244280
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-09-30
[patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/749117
[patent_app_country] => US
[patent_app_date] => 2010-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 5578
[patent_no_of_claims] => 19
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[pdf_file] => publications/A1/0244/20100244280.pdf
[firstpage_image] =>[orig_patent_app_number] => 12749117
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/749117 | Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch | Mar 28, 2010 | Issued |
Array
(
[id] => 8294938
[patent_doc_number] => 08222726
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-17
[patent_title] => 'Semiconductor device package having a jumper chip and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 12/748843
[patent_app_country] => US
[patent_app_date] => 2010-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 16
[patent_no_of_words] => 2075
[patent_no_of_claims] => 16
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12748843
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/748843 | Semiconductor device package having a jumper chip and method of fabricating the same | Mar 28, 2010 | Issued |
Array
(
[id] => 6161415
[patent_doc_number] => 20110193227
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-08-11
[patent_title] => 'Methods and Apparatus for Robust Flip Chip Interconnections'
[patent_app_type] => utility
[patent_app_number] => 12/729021
[patent_app_country] => US
[patent_app_date] => 2010-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => publications/A1/0193/20110193227.pdf
[firstpage_image] =>[orig_patent_app_number] => 12729021
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/729021 | Lead free solder interconnections for integrated circuits | Mar 21, 2010 | Issued |
Array
(
[id] => 8458601
[patent_doc_number] => 08294272
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-10-23
[patent_title] => 'Power module'
[patent_app_type] => utility
[patent_app_number] => 12/728442
[patent_app_country] => US
[patent_app_date] => 2010-03-22
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/728442 | Power module | Mar 21, 2010 | Issued |
Array
(
[id] => 7699378
[patent_doc_number] => 20110227212
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[patent_kind] => A1
[patent_issue_date] => 2011-09-22
[patent_title] => 'SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME'
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[patent_app_number] => 12/729034
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[pdf_file] => publications/A1/0227/20110227212.pdf
[firstpage_image] =>[orig_patent_app_number] => 12729034
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/729034 | Semiconductor device package | Mar 21, 2010 | Issued |
Array
(
[id] => 6264336
[patent_doc_number] => 20100252935
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[patent_issue_date] => 2010-10-07
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME'
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[firstpage_image] =>[orig_patent_app_number] => 12728683
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/728683 | Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same | Mar 21, 2010 | Issued |
Array
(
[id] => 7523432
[patent_doc_number] => 08026591
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[patent_kind] => B2
[patent_issue_date] => 2011-09-27
[patent_title] => 'Semiconductor device with lead terminals having portions thereof extending obliquely'
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[patent_app_number] => 12/659733
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/659733 | Semiconductor device with lead terminals having portions thereof extending obliquely | Mar 18, 2010 | Issued |
Array
(
[id] => 4629801
[patent_doc_number] => 08008699
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-08-30
[patent_title] => 'Semiconductor device with circuit for reduced parasitic inductance'
[patent_app_type] => utility
[patent_app_number] => 12/721201
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[patent_app_date] => 2010-03-10
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/721201 | Semiconductor device with circuit for reduced parasitic inductance | Mar 9, 2010 | Issued |
Array
(
[id] => 8294934
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/699628 | Electric module having a conductive pattern layer | Feb 2, 2010 | Issued |
Array
(
[id] => 6240027
[patent_doc_number] => 20100133535
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[patent_title] => 'SEMICONDUCTOR DEVICE WITH REDUCED PAD PITCH'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/697626 | Semiconductor device with reduced pad pitch | Jan 31, 2010 | Issued |
Array
(
[id] => 6553490
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[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A DC-DC CONVERTER'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/695657 | Semiconductor device including a DC-DC converter having a metal plate | Jan 27, 2010 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/693760 | Microfabricated pillar fins for thermal management | Jan 25, 2010 | Issued |
Array
(
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[patent_title] => 'Semiconductor device with stacked semiconductor chips'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/693921 | Semiconductor device with stacked semiconductor chips | Jan 25, 2010 | Issued |