Search

Alexander O. Williams

Examiner (ID: 4421)

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 8071605 [patent_doc_number] => 20110241222 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-06 [patent_title] => 'Semiconductor Package and Manufacturing Method' [patent_app_type] => utility [patent_app_number] => 12/750969 [patent_app_country] => US [patent_app_date] => 2010-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 8247 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20110241222.pdf [firstpage_image] =>[orig_patent_app_number] => 12750969 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/750969
Semiconductor package and multichip arrangement having a polymer layer and an encapsulant Mar 30, 2010 Issued
Array ( [id] => 8190303 [patent_doc_number] => 08183696 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-05-22 [patent_title] => 'Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads' [patent_app_type] => utility [patent_app_number] => 12/750946 [patent_app_country] => US [patent_app_date] => 2010-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 17 [patent_no_of_words] => 8265 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/183/08183696.pdf [firstpage_image] =>[orig_patent_app_number] => 12750946 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/750946
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads Mar 30, 2010 Issued
Array ( [id] => 9608913 [patent_doc_number] => 08786084 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-07-22 [patent_title] => 'Semiconductor package and method of forming' [patent_app_type] => utility [patent_app_number] => 12/751088 [patent_app_country] => US [patent_app_date] => 2010-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2417 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12751088 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/751088
Semiconductor package and method of forming Mar 30, 2010 Issued
Array ( [id] => 6321616 [patent_doc_number] => 20100244281 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-30 [patent_title] => 'FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/750597 [patent_app_country] => US [patent_app_date] => 2010-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 6945 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0244/20100244281.pdf [firstpage_image] =>[orig_patent_app_number] => 12750597 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/750597
FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME Mar 29, 2010 Abandoned
Array ( [id] => 8071641 [patent_doc_number] => 20110241202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-10-06 [patent_title] => 'Dummy Metal Design for Packaging Structures' [patent_app_type] => utility [patent_app_number] => 12/750468 [patent_app_country] => US [patent_app_date] => 2010-03-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 2772 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0241/20110241202.pdf [firstpage_image] =>[orig_patent_app_number] => 12750468 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/750468
Dummy metal design for packaging structures Mar 29, 2010 Issued
Array ( [id] => 8410751 [patent_doc_number] => 08274149 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-09-25 [patent_title] => 'Semiconductor device package having a buffer structure and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/749191 [patent_app_country] => US [patent_app_date] => 2010-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3211 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12749191 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/749191
Semiconductor device package having a buffer structure and method of fabricating the same Mar 28, 2010 Issued
Array ( [id] => 6321603 [patent_doc_number] => 20100244280 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-09-30 [patent_title] => 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE' [patent_app_type] => utility [patent_app_number] => 12/749117 [patent_app_country] => US [patent_app_date] => 2010-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5578 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0244/20100244280.pdf [firstpage_image] =>[orig_patent_app_number] => 12749117 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/749117
Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch Mar 28, 2010 Issued
Array ( [id] => 8294938 [patent_doc_number] => 08222726 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-17 [patent_title] => 'Semiconductor device package having a jumper chip and method of fabricating the same' [patent_app_type] => utility [patent_app_number] => 12/748843 [patent_app_country] => US [patent_app_date] => 2010-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 16 [patent_no_of_words] => 2075 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12748843 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/748843
Semiconductor device package having a jumper chip and method of fabricating the same Mar 28, 2010 Issued
Array ( [id] => 6161415 [patent_doc_number] => 20110193227 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-08-11 [patent_title] => 'Methods and Apparatus for Robust Flip Chip Interconnections' [patent_app_type] => utility [patent_app_number] => 12/729021 [patent_app_country] => US [patent_app_date] => 2010-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5128 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0193/20110193227.pdf [firstpage_image] =>[orig_patent_app_number] => 12729021 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/729021
Lead free solder interconnections for integrated circuits Mar 21, 2010 Issued
Array ( [id] => 8458601 [patent_doc_number] => 08294272 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-10-23 [patent_title] => 'Power module' [patent_app_type] => utility [patent_app_number] => 12/728442 [patent_app_country] => US [patent_app_date] => 2010-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 10163 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 183 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12728442 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/728442
Power module Mar 21, 2010 Issued
Array ( [id] => 7699378 [patent_doc_number] => 20110227212 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-09-22 [patent_title] => 'SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/729034 [patent_app_country] => US [patent_app_date] => 2010-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2435 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0227/20110227212.pdf [firstpage_image] =>[orig_patent_app_number] => 12729034 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/729034
Semiconductor device package Mar 21, 2010 Issued
Array ( [id] => 6264336 [patent_doc_number] => 20100252935 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-10-07 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 12/728683 [patent_app_country] => US [patent_app_date] => 2010-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 38 [patent_figures_cnt] => 38 [patent_no_of_words] => 12394 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0252/20100252935.pdf [firstpage_image] =>[orig_patent_app_number] => 12728683 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/728683
Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same Mar 21, 2010 Issued
Array ( [id] => 7523432 [patent_doc_number] => 08026591 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-09-27 [patent_title] => 'Semiconductor device with lead terminals having portions thereof extending obliquely' [patent_app_type] => utility [patent_app_number] => 12/659733 [patent_app_country] => US [patent_app_date] => 2010-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 4096 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/026/08026591.pdf [firstpage_image] =>[orig_patent_app_number] => 12659733 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/659733
Semiconductor device with lead terminals having portions thereof extending obliquely Mar 18, 2010 Issued
Array ( [id] => 4629801 [patent_doc_number] => 08008699 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-08-30 [patent_title] => 'Semiconductor device with circuit for reduced parasitic inductance' [patent_app_type] => utility [patent_app_number] => 12/721201 [patent_app_country] => US [patent_app_date] => 2010-03-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 18 [patent_no_of_words] => 5904 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/008/08008699.pdf [firstpage_image] =>[orig_patent_app_number] => 12721201 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/721201
Semiconductor device with circuit for reduced parasitic inductance Mar 9, 2010 Issued
Array ( [id] => 8294934 [patent_doc_number] => 08222723 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-17 [patent_title] => 'Electric module having a conductive pattern layer' [patent_app_type] => utility [patent_app_number] => 12/699628 [patent_app_country] => US [patent_app_date] => 2010-02-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 14 [patent_no_of_words] => 7227 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12699628 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/699628
Electric module having a conductive pattern layer Feb 2, 2010 Issued
Array ( [id] => 6240027 [patent_doc_number] => 20100133535 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-06-03 [patent_title] => 'SEMICONDUCTOR DEVICE WITH REDUCED PAD PITCH' [patent_app_type] => utility [patent_app_number] => 12/697626 [patent_app_country] => US [patent_app_date] => 2010-02-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6581 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0133/20100133535.pdf [firstpage_image] =>[orig_patent_app_number] => 12697626 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/697626
Semiconductor device with reduced pad pitch Jan 31, 2010 Issued
Array ( [id] => 6553490 [patent_doc_number] => 20100127683 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2010-05-27 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A DC-DC CONVERTER' [patent_app_type] => utility [patent_app_number] => 12/695657 [patent_app_country] => US [patent_app_date] => 2010-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 71 [patent_figures_cnt] => 71 [patent_no_of_words] => 38504 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0127/20100127683.pdf [firstpage_image] =>[orig_patent_app_number] => 12695657 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/695657
Semiconductor device including a DC-DC converter having a metal plate Jan 27, 2010 Issued
Array ( [id] => 7750643 [patent_doc_number] => 20120025405 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2012-02-02 [patent_title] => 'LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME' [patent_app_type] => utility [patent_app_number] => 13/259056 [patent_app_country] => US [patent_app_date] => 2010-01-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7852 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0025/20120025405.pdf [firstpage_image] =>[orig_patent_app_number] => 13259056 [rel_patent_id] =>[rel_patent_doc_number] =>)
13/259056
LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME Jan 27, 2010 Abandoned
Array ( [id] => 5955903 [patent_doc_number] => 20110180925 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2011-07-28 [patent_title] => 'Microfabricated Pillar Fins For Thermal Management' [patent_app_type] => utility [patent_app_number] => 12/693760 [patent_app_country] => US [patent_app_date] => 2010-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5883 [patent_no_of_claims] => 33 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0180/20110180925.pdf [firstpage_image] =>[orig_patent_app_number] => 12693760 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/693760
Microfabricated pillar fins for thermal management Jan 25, 2010 Issued
Array ( [id] => 8233273 [patent_doc_number] => 08198718 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-12 [patent_title] => 'Semiconductor device with stacked semiconductor chips' [patent_app_type] => utility [patent_app_number] => 12/693921 [patent_app_country] => US [patent_app_date] => 2010-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 3510 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/198/08198718.pdf [firstpage_image] =>[orig_patent_app_number] => 12693921 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/693921
Semiconductor device with stacked semiconductor chips Jan 25, 2010 Issued
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