Search

Alexander O. Williams

Examiner (ID: 4421)

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 4558521 [patent_doc_number] => 07821124 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-26 [patent_title] => 'Thin, thermally enhanced flip chip in a leaded molded package' [patent_app_type] => utility [patent_app_number] => 11/961589 [patent_app_country] => US [patent_app_date] => 2007-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 13 [patent_no_of_words] => 4139 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/821/07821124.pdf [firstpage_image] =>[orig_patent_app_number] => 11961589 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/961589
Thin, thermally enhanced flip chip in a leaded molded package Dec 19, 2007 Issued
Array ( [id] => 8148292 [patent_doc_number] => 08165307 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-04-24 [patent_title] => 'Audio electronic device' [patent_app_type] => utility [patent_app_number] => 11/957414 [patent_app_country] => US [patent_app_date] => 2007-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 1908 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/165/08165307.pdf [firstpage_image] =>[orig_patent_app_number] => 11957414 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/957414
Audio electronic device Dec 14, 2007 Issued
Array ( [id] => 4743417 [patent_doc_number] => 20080088018 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-17 [patent_title] => 'SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING' [patent_app_type] => utility [patent_app_number] => 11/954707 [patent_app_country] => US [patent_app_date] => 2007-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 3889 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0088/20080088018.pdf [firstpage_image] =>[orig_patent_app_number] => 11954707 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/954707
Stacked semiconductor package having fan-out structure through wire bonding Dec 11, 2007 Issued
Array ( [id] => 8214967 [patent_doc_number] => 08193627 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-06-05 [patent_title] => 'IC chip mounting package provided with IC chip located in device hole formed within a package base member' [patent_app_type] => utility [patent_app_number] => 12/448106 [patent_app_country] => US [patent_app_date] => 2007-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 9384 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/193/08193627.pdf [firstpage_image] =>[orig_patent_app_number] => 12448106 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/448106
IC chip mounting package provided with IC chip located in device hole formed within a package base member Nov 29, 2007 Issued
Array ( [id] => 5276103 [patent_doc_number] => 20090128235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-05-21 [patent_title] => 'Power save mode for audio interface drive amplifier' [patent_app_type] => utility [patent_app_number] => 11/986575 [patent_app_country] => US [patent_app_date] => 2007-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3346 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0128/20090128235.pdf [firstpage_image] =>[orig_patent_app_number] => 11986575 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/986575
Power save mode for audio interface drive amplifier Nov 19, 2007 Abandoned
Array ( [id] => 7599484 [patent_doc_number] => 07582964 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-09-01 [patent_title] => 'Semiconductor package having non-ceramic based window frame' [patent_app_type] => utility [patent_app_number] => 11/942675 [patent_app_country] => US [patent_app_date] => 2007-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 3502 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/582/07582964.pdf [firstpage_image] =>[orig_patent_app_number] => 11942675 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/942675
Semiconductor package having non-ceramic based window frame Nov 18, 2007 Issued
Array ( [id] => 203435 [patent_doc_number] => 07633142 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-12-15 [patent_title] => 'Flexible core for enhancement of package interconnect reliability' [patent_app_type] => utility [patent_app_number] => 11/977980 [patent_app_country] => US [patent_app_date] => 2007-10-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4500 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/633/07633142.pdf [firstpage_image] =>[orig_patent_app_number] => 11977980 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/977980
Flexible core for enhancement of package interconnect reliability Oct 25, 2007 Issued
Array ( [id] => 4462380 [patent_doc_number] => 07880265 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-02-01 [patent_title] => 'Packaged integrated circuit' [patent_app_type] => utility [patent_app_number] => 11/974360 [patent_app_country] => US [patent_app_date] => 2007-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4941 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/880/07880265.pdf [firstpage_image] =>[orig_patent_app_number] => 11974360 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/974360
Packaged integrated circuit Oct 11, 2007 Issued
Array ( [id] => 55035 [patent_doc_number] => 07768110 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-03 [patent_title] => 'Nonvolatile memory apparatus' [patent_app_type] => utility [patent_app_number] => 11/865721 [patent_app_country] => US [patent_app_date] => 2007-10-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 33 [patent_no_of_words] => 14579 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/768/07768110.pdf [firstpage_image] =>[orig_patent_app_number] => 11865721 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/865721
Nonvolatile memory apparatus Sep 30, 2007 Issued
Array ( [id] => 8270861 [patent_doc_number] => 08212370 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-07-03 [patent_title] => 'Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste' [patent_app_type] => utility [patent_app_number] => 12/444230 [patent_app_country] => US [patent_app_date] => 2007-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 6262 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 26 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12444230 [rel_patent_id] =>[rel_patent_doc_number] =>)
12/444230
Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste Sep 27, 2007 Issued
Array ( [id] => 5507461 [patent_doc_number] => 20090080668 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2009-03-26 [patent_title] => 'Apparatus and method for testing sound input and output of sound card' [patent_app_type] => utility [patent_app_number] => 11/902297 [patent_app_country] => US [patent_app_date] => 2007-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3898 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0080/20090080668.pdf [firstpage_image] =>[orig_patent_app_number] => 11902297 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/902297
Apparatus and method for testing sound input and output of sound card Sep 19, 2007 Issued
Array ( [id] => 65132 [patent_doc_number] => 07759801 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2010-07-20 [patent_title] => 'Tapered signal lines' [patent_app_type] => utility [patent_app_number] => 11/903016 [patent_app_country] => US [patent_app_date] => 2007-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 16 [patent_no_of_words] => 3820 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/759/07759801.pdf [firstpage_image] =>[orig_patent_app_number] => 11903016 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/903016
Tapered signal lines Sep 18, 2007 Issued
Array ( [id] => 4800560 [patent_doc_number] => 20080012147 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-01-17 [patent_title] => 'Semiconductor device for preventing defective filling of interconnection and cracking of insulating film' [patent_app_type] => utility [patent_app_number] => 11/898548 [patent_app_country] => US [patent_app_date] => 2007-09-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 39 [patent_figures_cnt] => 39 [patent_no_of_words] => 16203 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0012/20080012147.pdf [firstpage_image] =>[orig_patent_app_number] => 11898548 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/898548
Semiconductor device having groove-shaped via-hole Sep 12, 2007 Issued
Array ( [id] => 5228211 [patent_doc_number] => 20070290318 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-20 [patent_title] => 'MULTI-CHIP PACKAGE STRUCTURE' [patent_app_type] => utility [patent_app_number] => 11/845305 [patent_app_country] => US [patent_app_date] => 2007-08-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 5253 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20070290318.pdf [firstpage_image] =>[orig_patent_app_number] => 11845305 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/845305
MULTI-CHIP PACKAGE STRUCTURE Aug 26, 2007 Abandoned
Array ( [id] => 322994 [patent_doc_number] => 07518227 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2009-04-14 [patent_title] => 'Multiple die stack apparatus employing T-shaped interposer elements' [patent_app_type] => utility [patent_app_number] => 11/840815 [patent_app_country] => US [patent_app_date] => 2007-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 3864 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 180 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/518/07518227.pdf [firstpage_image] =>[orig_patent_app_number] => 11840815 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/840815
Multiple die stack apparatus employing T-shaped interposer elements Aug 16, 2007 Issued
Array ( [id] => 4762764 [patent_doc_number] => 20080173973 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-24 [patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE' [patent_app_type] => utility [patent_app_number] => 11/837573 [patent_app_country] => US [patent_app_date] => 2007-08-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 14586 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0173/20080173973.pdf [firstpage_image] =>[orig_patent_app_number] => 11837573 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/837573
Semiconductor integrated circuit device including wiring lines and interconnections Aug 12, 2007 Issued
Array ( [id] => 5008169 [patent_doc_number] => 20070278646 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-06 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/835493 [patent_app_country] => US [patent_app_date] => 2007-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2881 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0278/20070278646.pdf [firstpage_image] =>[orig_patent_app_number] => 11835493 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/835493
Semiconductor device having a bonding wire and method for manufacturing the same Aug 7, 2007 Issued
Array ( [id] => 4648842 [patent_doc_number] => 20080036097 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-14 [patent_title] => 'SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN' [patent_app_type] => utility [patent_app_number] => 11/835774 [patent_app_country] => US [patent_app_date] => 2007-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 14536 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0036/20080036097.pdf [firstpage_image] =>[orig_patent_app_number] => 11835774 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/835774
SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN Aug 7, 2007 Abandoned
Array ( [id] => 63659 [patent_doc_number] => 07763959 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-07-27 [patent_title] => 'Heat slug for package structure' [patent_app_type] => utility [patent_app_number] => 11/834863 [patent_app_country] => US [patent_app_date] => 2007-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3306 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/763/07763959.pdf [firstpage_image] =>[orig_patent_app_number] => 11834863 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/834863
Heat slug for package structure Aug 6, 2007 Issued
Array ( [id] => 4943832 [patent_doc_number] => 20080081157 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-04-03 [patent_title] => 'ELECTRONIC DEVICE AND PRODUCTION METHODS' [patent_app_type] => utility [patent_app_number] => 11/835123 [patent_app_country] => US [patent_app_date] => 2007-08-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 6009 [patent_no_of_claims] => 31 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0081/20080081157.pdf [firstpage_image] =>[orig_patent_app_number] => 11835123 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/835123
Electronic device including a nickel-palladium alloy layer Aug 6, 2007 Issued
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