
Alexander O. Williams
Examiner (ID: 4421)
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 4558521
[patent_doc_number] => 07821124
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-26
[patent_title] => 'Thin, thermally enhanced flip chip in a leaded molded package'
[patent_app_type] => utility
[patent_app_number] => 11/961589
[patent_app_country] => US
[patent_app_date] => 2007-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 13
[patent_no_of_words] => 4139
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/821/07821124.pdf
[firstpage_image] =>[orig_patent_app_number] => 11961589
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/961589 | Thin, thermally enhanced flip chip in a leaded molded package | Dec 19, 2007 | Issued |
Array
(
[id] => 8148292
[patent_doc_number] => 08165307
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-04-24
[patent_title] => 'Audio electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/957414
[patent_app_country] => US
[patent_app_date] => 2007-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[patent_no_of_words] => 1908
[patent_no_of_claims] => 8
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[patent_words_short_claim] => 49
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/165/08165307.pdf
[firstpage_image] =>[orig_patent_app_number] => 11957414
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/957414 | Audio electronic device | Dec 14, 2007 | Issued |
Array
(
[id] => 4743417
[patent_doc_number] => 20080088018
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-17
[patent_title] => 'SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING'
[patent_app_type] => utility
[patent_app_number] => 11/954707
[patent_app_country] => US
[patent_app_date] => 2007-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
[patent_figures_cnt] => 15
[patent_no_of_words] => 3889
[patent_no_of_claims] => 10
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0088/20080088018.pdf
[firstpage_image] =>[orig_patent_app_number] => 11954707
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/954707 | Stacked semiconductor package having fan-out structure through wire bonding | Dec 11, 2007 | Issued |
Array
(
[id] => 8214967
[patent_doc_number] => 08193627
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-06-05
[patent_title] => 'IC chip mounting package provided with IC chip located in device hole formed within a package base member'
[patent_app_type] => utility
[patent_app_number] => 12/448106
[patent_app_country] => US
[patent_app_date] => 2007-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 9384
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 201
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/193/08193627.pdf
[firstpage_image] =>[orig_patent_app_number] => 12448106
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/448106 | IC chip mounting package provided with IC chip located in device hole formed within a package base member | Nov 29, 2007 | Issued |
Array
(
[id] => 5276103
[patent_doc_number] => 20090128235
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-21
[patent_title] => 'Power save mode for audio interface drive amplifier'
[patent_app_type] => utility
[patent_app_number] => 11/986575
[patent_app_country] => US
[patent_app_date] => 2007-11-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 3346
[patent_no_of_claims] => 25
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0128/20090128235.pdf
[firstpage_image] =>[orig_patent_app_number] => 11986575
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/986575 | Power save mode for audio interface drive amplifier | Nov 19, 2007 | Abandoned |
Array
(
[id] => 7599484
[patent_doc_number] => 07582964
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-01
[patent_title] => 'Semiconductor package having non-ceramic based window frame'
[patent_app_type] => utility
[patent_app_number] => 11/942675
[patent_app_country] => US
[patent_app_date] => 2007-11-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 3502
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/582/07582964.pdf
[firstpage_image] =>[orig_patent_app_number] => 11942675
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/942675 | Semiconductor package having non-ceramic based window frame | Nov 18, 2007 | Issued |
Array
(
[id] => 203435
[patent_doc_number] => 07633142
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-12-15
[patent_title] => 'Flexible core for enhancement of package interconnect reliability'
[patent_app_type] => utility
[patent_app_number] => 11/977980
[patent_app_country] => US
[patent_app_date] => 2007-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 5
[patent_no_of_words] => 4500
[patent_no_of_claims] => 6
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/633/07633142.pdf
[firstpage_image] =>[orig_patent_app_number] => 11977980
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/977980 | Flexible core for enhancement of package interconnect reliability | Oct 25, 2007 | Issued |
Array
(
[id] => 4462380
[patent_doc_number] => 07880265
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-02-01
[patent_title] => 'Packaged integrated circuit'
[patent_app_type] => utility
[patent_app_number] => 11/974360
[patent_app_country] => US
[patent_app_date] => 2007-10-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 9
[patent_no_of_words] => 4941
[patent_no_of_claims] => 8
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 106
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/880/07880265.pdf
[firstpage_image] =>[orig_patent_app_number] => 11974360
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/974360 | Packaged integrated circuit | Oct 11, 2007 | Issued |
Array
(
[id] => 55035
[patent_doc_number] => 07768110
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-03
[patent_title] => 'Nonvolatile memory apparatus'
[patent_app_type] => utility
[patent_app_number] => 11/865721
[patent_app_country] => US
[patent_app_date] => 2007-10-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 24
[patent_figures_cnt] => 33
[patent_no_of_words] => 14579
[patent_no_of_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/768/07768110.pdf
[firstpage_image] =>[orig_patent_app_number] => 11865721
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/865721 | Nonvolatile memory apparatus | Sep 30, 2007 | Issued |
Array
(
[id] => 8270861
[patent_doc_number] => 08212370
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-07-03
[patent_title] => 'Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste'
[patent_app_type] => utility
[patent_app_number] => 12/444230
[patent_app_country] => US
[patent_app_date] => 2007-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 1
[patent_no_of_words] => 6262
[patent_no_of_claims] => 9
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12444230
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/444230 | Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste | Sep 27, 2007 | Issued |
Array
(
[id] => 5507461
[patent_doc_number] => 20090080668
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-03-26
[patent_title] => 'Apparatus and method for testing sound input and output of sound card'
[patent_app_type] => utility
[patent_app_number] => 11/902297
[patent_app_country] => US
[patent_app_date] => 2007-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3898
[patent_no_of_claims] => 13
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0080/20090080668.pdf
[firstpage_image] =>[orig_patent_app_number] => 11902297
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/902297 | Apparatus and method for testing sound input and output of sound card | Sep 19, 2007 | Issued |
Array
(
[id] => 65132
[patent_doc_number] => 07759801
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2010-07-20
[patent_title] => 'Tapered signal lines'
[patent_app_type] => utility
[patent_app_number] => 11/903016
[patent_app_country] => US
[patent_app_date] => 2007-09-19
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/759/07759801.pdf
[firstpage_image] =>[orig_patent_app_number] => 11903016
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/903016 | Tapered signal lines | Sep 18, 2007 | Issued |
Array
(
[id] => 4800560
[patent_doc_number] => 20080012147
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-17
[patent_title] => 'Semiconductor device for preventing defective filling of interconnection and cracking of insulating film'
[patent_app_type] => utility
[patent_app_number] => 11/898548
[patent_app_country] => US
[patent_app_date] => 2007-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 39
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[patent_no_of_words] => 16203
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0012/20080012147.pdf
[firstpage_image] =>[orig_patent_app_number] => 11898548
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/898548 | Semiconductor device having groove-shaped via-hole | Sep 12, 2007 | Issued |
Array
(
[id] => 5228211
[patent_doc_number] => 20070290318
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'MULTI-CHIP PACKAGE STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 11/845305
[patent_app_country] => US
[patent_app_date] => 2007-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
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[pdf_file] => publications/A1/0290/20070290318.pdf
[firstpage_image] =>[orig_patent_app_number] => 11845305
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/845305 | MULTI-CHIP PACKAGE STRUCTURE | Aug 26, 2007 | Abandoned |
Array
(
[id] => 322994
[patent_doc_number] => 07518227
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-14
[patent_title] => 'Multiple die stack apparatus employing T-shaped interposer elements'
[patent_app_type] => utility
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[pdf_file] => patents/07/518/07518227.pdf
[firstpage_image] =>[orig_patent_app_number] => 11840815
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/840815 | Multiple die stack apparatus employing T-shaped interposer elements | Aug 16, 2007 | Issued |
Array
(
[id] => 4762764
[patent_doc_number] => 20080173973
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-24
[patent_title] => 'SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/837573
[patent_app_country] => US
[patent_app_date] => 2007-08-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
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[pdf_file] => publications/A1/0173/20080173973.pdf
[firstpage_image] =>[orig_patent_app_number] => 11837573
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/837573 | Semiconductor integrated circuit device including wiring lines and interconnections | Aug 12, 2007 | Issued |
Array
(
[id] => 5008169
[patent_doc_number] => 20070278646
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-06
[patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/835493
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0278/20070278646.pdf
[firstpage_image] =>[orig_patent_app_number] => 11835493
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/835493 | Semiconductor device having a bonding wire and method for manufacturing the same | Aug 7, 2007 | Issued |
Array
(
[id] => 4648842
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[patent_title] => 'SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN'
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Array
(
[id] => 63659
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[patent_title] => 'Heat slug for package structure'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/834863 | Heat slug for package structure | Aug 6, 2007 | Issued |
Array
(
[id] => 4943832
[patent_doc_number] => 20080081157
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[patent_title] => 'ELECTRONIC DEVICE AND PRODUCTION METHODS'
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[patent_app_country] => US
[patent_app_date] => 2007-08-07
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[pdf_file] => publications/A1/0081/20080081157.pdf
[firstpage_image] =>[orig_patent_app_number] => 11835123
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/835123 | Electronic device including a nickel-palladium alloy layer | Aug 6, 2007 | Issued |