
Alexander O. Williams
Examiner (ID: 4421)
| Most Active Art Unit | 2826 |
| Art Unit(s) | 2508, 2826, 2811 |
| Total Applications | 2764 |
| Issued Applications | 2318 |
| Pending Applications | 64 |
| Abandoned Applications | 383 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 54131
[patent_doc_number] => 07772686
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-10
[patent_title] => 'Memory card fabricated using SiP/SMT hybrid technology'
[patent_app_type] => utility
[patent_app_number] => 11/769954
[patent_app_country] => US
[patent_app_date] => 2007-06-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 15
[patent_no_of_words] => 4339
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/772/07772686.pdf
[firstpage_image] =>[orig_patent_app_number] => 11769954
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/769954 | Memory card fabricated using SiP/SMT hybrid technology | Jun 27, 2007 | Issued |
Array
(
[id] => 4749327
[patent_doc_number] => 20080157398
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-03
[patent_title] => 'Semiconductor device package having pseudo chips'
[patent_app_type] => utility
[patent_app_number] => 11/819193
[patent_app_country] => US
[patent_app_date] => 2007-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3688
[patent_no_of_claims] => 23
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0157/20080157398.pdf
[firstpage_image] =>[orig_patent_app_number] => 11819193
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/819193 | Semiconductor device package having pseudo chips | Jun 25, 2007 | Abandoned |
Array
(
[id] => 5208251
[patent_doc_number] => 20070246835
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-25
[patent_title] => 'SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/768424
[patent_app_country] => US
[patent_app_date] => 2007-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 3546
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0246/20070246835.pdf
[firstpage_image] =>[orig_patent_app_number] => 11768424
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768424 | SEMICONDUCTOR DEVICE | Jun 25, 2007 | Abandoned |
Array
(
[id] => 4849663
[patent_doc_number] => 20080315405
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'HEAT SPREADER IN A FLIP CHIP PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 11/767634
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2678
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0315/20080315405.pdf
[firstpage_image] =>[orig_patent_app_number] => 11767634
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/767634 | Heat spreader in a flip chip package | Jun 24, 2007 | Issued |
Array
(
[id] => 7545898
[patent_doc_number] => 08053872
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2011-11-08
[patent_title] => 'Integrated shield for a no-lead semiconductor device package'
[patent_app_type] => utility
[patent_app_number] => 11/768014
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 15
[patent_no_of_words] => 3825
[patent_no_of_claims] => 21
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 156
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/053/08053872.pdf
[firstpage_image] =>[orig_patent_app_number] => 11768014
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/768014 | Integrated shield for a no-lead semiconductor device package | Jun 24, 2007 | Issued |
Array
(
[id] => 4685704
[patent_doc_number] => 20080029885
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-02-07
[patent_title] => 'Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques'
[patent_app_type] => utility
[patent_app_number] => 11/767534
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3258
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0029/20080029885.pdf
[firstpage_image] =>[orig_patent_app_number] => 11767534
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/767534 | Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques | Jun 24, 2007 | Abandoned |
Array
(
[id] => 5223901
[patent_doc_number] => 20070253167
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-01
[patent_title] => 'Transparent substrate heat dissipater'
[patent_app_type] => utility
[patent_app_number] => 11/819124
[patent_app_country] => US
[patent_app_date] => 2007-06-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2470
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0253/20070253167.pdf
[firstpage_image] =>[orig_patent_app_number] => 11819124
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/819124 | Transparent substrate heat dissipater | Jun 24, 2007 | Abandoned |
Array
(
[id] => 4472451
[patent_doc_number] => 07944034
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-05-17
[patent_title] => 'Array molded package-on-package having redistribution lines'
[patent_app_type] => utility
[patent_app_number] => 11/767294
[patent_app_country] => US
[patent_app_date] => 2007-06-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 16
[patent_no_of_words] => 5261
[patent_no_of_claims] => 14
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/944/07944034.pdf
[firstpage_image] =>[orig_patent_app_number] => 11767294
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/767294 | Array molded package-on-package having redistribution lines | Jun 21, 2007 | Issued |
Array
(
[id] => 4849696
[patent_doc_number] => 20080315438
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-25
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER'
[patent_app_type] => utility
[patent_app_number] => 11/766404
[patent_app_country] => US
[patent_app_date] => 2007-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4067
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 5
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0315/20080315438.pdf
[firstpage_image] =>[orig_patent_app_number] => 11766404
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/766404 | Semiconductor device including a stress buffer | Jun 20, 2007 | Issued |
Array
(
[id] => 7752717
[patent_doc_number] => 08110930
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-02-07
[patent_title] => 'Die backside metallization and surface activated bonding for stacked die packages'
[patent_app_type] => utility
[patent_app_number] => 11/820454
[patent_app_country] => US
[patent_app_date] => 2007-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 3146
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 125
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/110/08110930.pdf
[firstpage_image] =>[orig_patent_app_number] => 11820454
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/820454 | Die backside metallization and surface activated bonding for stacked die packages | Jun 18, 2007 | Issued |
Array
(
[id] => 23388
[patent_doc_number] => 07800237
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-21
[patent_title] => 'Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/764898
[patent_app_country] => US
[patent_app_date] => 2007-06-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 28
[patent_no_of_words] => 6463
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 165
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/800/07800237.pdf
[firstpage_image] =>[orig_patent_app_number] => 11764898
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/764898 | Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device | Jun 18, 2007 | Issued |
Array
(
[id] => 5228195
[patent_doc_number] => 20070290302
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'IC chip package, and image display apparatus using same'
[patent_app_type] => utility
[patent_app_number] => 11/808834
[patent_app_country] => US
[patent_app_date] => 2007-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 10730
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0290/20070290302.pdf
[firstpage_image] =>[orig_patent_app_number] => 11808834
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/808834 | IC chip package, and image display apparatus using same | Jun 12, 2007 | Abandoned |
Array
(
[id] => 5228234
[patent_doc_number] => 20070290341
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-20
[patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/762604
[patent_app_country] => US
[patent_app_date] => 2007-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2831
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0290/20070290341.pdf
[firstpage_image] =>[orig_patent_app_number] => 11762604
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/762604 | SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME | Jun 12, 2007 | Abandoned |
Array
(
[id] => 4583341
[patent_doc_number] => 07834453
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-11-16
[patent_title] => 'Contact structure having a compliant bump and a test pad'
[patent_app_type] => utility
[patent_app_number] => 11/762729
[patent_app_country] => US
[patent_app_date] => 2007-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 12
[patent_no_of_words] => 2278
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 83
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/834/07834453.pdf
[firstpage_image] =>[orig_patent_app_number] => 11762729
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/762729 | Contact structure having a compliant bump and a test pad | Jun 12, 2007 | Issued |
Array
(
[id] => 45194
[patent_doc_number] => 07777331
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-08-17
[patent_title] => 'Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip'
[patent_app_type] => utility
[patent_app_number] => 11/761764
[patent_app_country] => US
[patent_app_date] => 2007-06-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 4976
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 130
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/777/07777331.pdf
[firstpage_image] =>[orig_patent_app_number] => 11761764
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/761764 | Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip | Jun 11, 2007 | Issued |
Array
(
[id] => 4518017
[patent_doc_number] => 07911059
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-03-22
[patent_title] => 'High thermal conductivity substrate for a semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/760369
[patent_app_country] => US
[patent_app_date] => 2007-06-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 14
[patent_no_of_words] => 4514
[patent_no_of_claims] => 29
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 66
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/911/07911059.pdf
[firstpage_image] =>[orig_patent_app_number] => 11760369
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/760369 | High thermal conductivity substrate for a semiconductor device | Jun 7, 2007 | Issued |
Array
(
[id] => 14495
[patent_doc_number] => 07808088
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-05
[patent_title] => 'Semiconductor device with improved high current performance'
[patent_app_type] => utility
[patent_app_number] => 11/757514
[patent_app_country] => US
[patent_app_date] => 2007-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 15
[patent_no_of_words] => 1918
[patent_no_of_claims] => 6
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/808/07808088.pdf
[firstpage_image] =>[orig_patent_app_number] => 11757514
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/757514 | Semiconductor device with improved high current performance | Jun 3, 2007 | Issued |
Array
(
[id] => 4477349
[patent_doc_number] => 07868465
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-01-11
[patent_title] => 'Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier'
[patent_app_type] => utility
[patent_app_number] => 11/757649
[patent_app_country] => US
[patent_app_date] => 2007-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 13
[patent_no_of_words] => 4597
[patent_no_of_claims] => 15
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 126
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/868/07868465.pdf
[firstpage_image] =>[orig_patent_app_number] => 11757649
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/757649 | Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier | Jun 3, 2007 | Issued |
Array
(
[id] => 4708233
[patent_doc_number] => 20080296759
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-12-04
[patent_title] => 'SEMICONDUCTOR PACKAGES'
[patent_app_type] => utility
[patent_app_number] => 11/757869
[patent_app_country] => US
[patent_app_date] => 2007-06-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 4717
[patent_no_of_claims] => 28
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0296/20080296759.pdf
[firstpage_image] =>[orig_patent_app_number] => 11757869
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/757869 | Semiconductor packaging system with stacking and method of manufacturing thereof | Jun 3, 2007 | Issued |
Array
(
[id] => 191328
[patent_doc_number] => 07642641
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-05
[patent_title] => 'Integrated circuit component with passivation layer'
[patent_app_type] => utility
[patent_app_number] => 11/756303
[patent_app_country] => US
[patent_app_date] => 2007-05-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 6
[patent_no_of_words] => 5188
[patent_no_of_claims] => 11
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/642/07642641.pdf
[firstpage_image] =>[orig_patent_app_number] => 11756303
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/756303 | Integrated circuit component with passivation layer | May 30, 2007 | Issued |