Search

Alexander O. Williams

Examiner (ID: 4421)

Most Active Art Unit
2826
Art Unit(s)
2508, 2826, 2811
Total Applications
2764
Issued Applications
2318
Pending Applications
64
Abandoned Applications
383

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 54131 [patent_doc_number] => 07772686 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-10 [patent_title] => 'Memory card fabricated using SiP/SMT hybrid technology' [patent_app_type] => utility [patent_app_number] => 11/769954 [patent_app_country] => US [patent_app_date] => 2007-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 4339 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/772/07772686.pdf [firstpage_image] =>[orig_patent_app_number] => 11769954 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/769954
Memory card fabricated using SiP/SMT hybrid technology Jun 27, 2007 Issued
Array ( [id] => 4749327 [patent_doc_number] => 20080157398 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-07-03 [patent_title] => 'Semiconductor device package having pseudo chips' [patent_app_type] => utility [patent_app_number] => 11/819193 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3688 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0157/20080157398.pdf [firstpage_image] =>[orig_patent_app_number] => 11819193 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819193
Semiconductor device package having pseudo chips Jun 25, 2007 Abandoned
Array ( [id] => 5208251 [patent_doc_number] => 20070246835 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-10-25 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 11/768424 [patent_app_country] => US [patent_app_date] => 2007-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 3546 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0246/20070246835.pdf [firstpage_image] =>[orig_patent_app_number] => 11768424 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768424
SEMICONDUCTOR DEVICE Jun 25, 2007 Abandoned
Array ( [id] => 4849663 [patent_doc_number] => 20080315405 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-25 [patent_title] => 'HEAT SPREADER IN A FLIP CHIP PACKAGE' [patent_app_type] => utility [patent_app_number] => 11/767634 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2678 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0315/20080315405.pdf [firstpage_image] =>[orig_patent_app_number] => 11767634 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/767634
Heat spreader in a flip chip package Jun 24, 2007 Issued
Array ( [id] => 7545898 [patent_doc_number] => 08053872 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2011-11-08 [patent_title] => 'Integrated shield for a no-lead semiconductor device package' [patent_app_type] => utility [patent_app_number] => 11/768014 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 15 [patent_no_of_words] => 3825 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/053/08053872.pdf [firstpage_image] =>[orig_patent_app_number] => 11768014 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/768014
Integrated shield for a no-lead semiconductor device package Jun 24, 2007 Issued
Array ( [id] => 4685704 [patent_doc_number] => 20080029885 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-02-07 [patent_title] => 'Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques' [patent_app_type] => utility [patent_app_number] => 11/767534 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3258 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0029/20080029885.pdf [firstpage_image] =>[orig_patent_app_number] => 11767534 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/767534
Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques Jun 24, 2007 Abandoned
Array ( [id] => 5223901 [patent_doc_number] => 20070253167 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-11-01 [patent_title] => 'Transparent substrate heat dissipater' [patent_app_type] => utility [patent_app_number] => 11/819124 [patent_app_country] => US [patent_app_date] => 2007-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2470 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0253/20070253167.pdf [firstpage_image] =>[orig_patent_app_number] => 11819124 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/819124
Transparent substrate heat dissipater Jun 24, 2007 Abandoned
Array ( [id] => 4472451 [patent_doc_number] => 07944034 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-05-17 [patent_title] => 'Array molded package-on-package having redistribution lines' [patent_app_type] => utility [patent_app_number] => 11/767294 [patent_app_country] => US [patent_app_date] => 2007-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 16 [patent_no_of_words] => 5261 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/944/07944034.pdf [firstpage_image] =>[orig_patent_app_number] => 11767294 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/767294
Array molded package-on-package having redistribution lines Jun 21, 2007 Issued
Array ( [id] => 4849696 [patent_doc_number] => 20080315438 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-25 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER' [patent_app_type] => utility [patent_app_number] => 11/766404 [patent_app_country] => US [patent_app_date] => 2007-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 4067 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0315/20080315438.pdf [firstpage_image] =>[orig_patent_app_number] => 11766404 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/766404
Semiconductor device including a stress buffer Jun 20, 2007 Issued
Array ( [id] => 7752717 [patent_doc_number] => 08110930 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2012-02-07 [patent_title] => 'Die backside metallization and surface activated bonding for stacked die packages' [patent_app_type] => utility [patent_app_number] => 11/820454 [patent_app_country] => US [patent_app_date] => 2007-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 5 [patent_no_of_words] => 3146 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/08/110/08110930.pdf [firstpage_image] =>[orig_patent_app_number] => 11820454 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/820454
Die backside metallization and surface activated bonding for stacked die packages Jun 18, 2007 Issued
Array ( [id] => 23388 [patent_doc_number] => 07800237 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-09-21 [patent_title] => 'Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device' [patent_app_type] => utility [patent_app_number] => 11/764898 [patent_app_country] => US [patent_app_date] => 2007-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 28 [patent_no_of_words] => 6463 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 165 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/800/07800237.pdf [firstpage_image] =>[orig_patent_app_number] => 11764898 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/764898
Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device Jun 18, 2007 Issued
Array ( [id] => 5228195 [patent_doc_number] => 20070290302 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-20 [patent_title] => 'IC chip package, and image display apparatus using same' [patent_app_type] => utility [patent_app_number] => 11/808834 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 10730 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20070290302.pdf [firstpage_image] =>[orig_patent_app_number] => 11808834 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/808834
IC chip package, and image display apparatus using same Jun 12, 2007 Abandoned
Array ( [id] => 5228234 [patent_doc_number] => 20070290341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2007-12-20 [patent_title] => 'SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME' [patent_app_type] => utility [patent_app_number] => 11/762604 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2831 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0290/20070290341.pdf [firstpage_image] =>[orig_patent_app_number] => 11762604 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/762604
SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME Jun 12, 2007 Abandoned
Array ( [id] => 4583341 [patent_doc_number] => 07834453 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-11-16 [patent_title] => 'Contact structure having a compliant bump and a test pad' [patent_app_type] => utility [patent_app_number] => 11/762729 [patent_app_country] => US [patent_app_date] => 2007-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 12 [patent_no_of_words] => 2278 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/834/07834453.pdf [firstpage_image] =>[orig_patent_app_number] => 11762729 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/762729
Contact structure having a compliant bump and a test pad Jun 12, 2007 Issued
Array ( [id] => 45194 [patent_doc_number] => 07777331 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-08-17 [patent_title] => 'Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip' [patent_app_type] => utility [patent_app_number] => 11/761764 [patent_app_country] => US [patent_app_date] => 2007-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 4976 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/777/07777331.pdf [firstpage_image] =>[orig_patent_app_number] => 11761764 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/761764
Semiconductor apparatus comprising a semiconductor chip with a power supply circuit and a smoothing circuit disposed outside the semiconductor chip Jun 11, 2007 Issued
Array ( [id] => 4518017 [patent_doc_number] => 07911059 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-03-22 [patent_title] => 'High thermal conductivity substrate for a semiconductor device' [patent_app_type] => utility [patent_app_number] => 11/760369 [patent_app_country] => US [patent_app_date] => 2007-06-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 14 [patent_no_of_words] => 4514 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/911/07911059.pdf [firstpage_image] =>[orig_patent_app_number] => 11760369 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/760369
High thermal conductivity substrate for a semiconductor device Jun 7, 2007 Issued
Array ( [id] => 14495 [patent_doc_number] => 07808088 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-10-05 [patent_title] => 'Semiconductor device with improved high current performance' [patent_app_type] => utility [patent_app_number] => 11/757514 [patent_app_country] => US [patent_app_date] => 2007-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 1918 [patent_no_of_claims] => 6 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/808/07808088.pdf [firstpage_image] =>[orig_patent_app_number] => 11757514 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/757514
Semiconductor device with improved high current performance Jun 3, 2007 Issued
Array ( [id] => 4477349 [patent_doc_number] => 07868465 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2011-01-11 [patent_title] => 'Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier' [patent_app_type] => utility [patent_app_number] => 11/757649 [patent_app_country] => US [patent_app_date] => 2007-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 4597 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/868/07868465.pdf [firstpage_image] =>[orig_patent_app_number] => 11757649 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/757649
Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier Jun 3, 2007 Issued
Array ( [id] => 4708233 [patent_doc_number] => 20080296759 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-12-04 [patent_title] => 'SEMICONDUCTOR PACKAGES' [patent_app_type] => utility [patent_app_number] => 11/757869 [patent_app_country] => US [patent_app_date] => 2007-06-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 4717 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0296/20080296759.pdf [firstpage_image] =>[orig_patent_app_number] => 11757869 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/757869
Semiconductor packaging system with stacking and method of manufacturing thereof Jun 3, 2007 Issued
Array ( [id] => 191328 [patent_doc_number] => 07642641 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2010-01-05 [patent_title] => 'Integrated circuit component with passivation layer' [patent_app_type] => utility [patent_app_number] => 11/756303 [patent_app_country] => US [patent_app_date] => 2007-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 5188 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/07/642/07642641.pdf [firstpage_image] =>[orig_patent_app_number] => 11756303 [rel_patent_id] =>[rel_patent_doc_number] =>)
11/756303
Integrated circuit component with passivation layer May 30, 2007 Issued
Menu