
Alonzo Chambliss
Examiner (ID: 15572)
| Most Active Art Unit | 2897 |
| Art Unit(s) | 2897, 2827, 2814, 2892 |
| Total Applications | 2378 |
| Issued Applications | 2104 |
| Pending Applications | 102 |
| Abandoned Applications | 209 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 17070920
[patent_doc_number] => 20210273137
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2021-09-02
[patent_title] => LIGHT-EMITTING DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/321078
[patent_app_country] => US
[patent_app_date] => 2021-05-14
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/321078 | Light-emitting device with a plurality of electrodes on a semiconductor stack | May 13, 2021 | Issued |
Array
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[patent_doc_number] => 20220246499
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[patent_kind] => A1
[patent_issue_date] => 2022-08-04
[patent_title] => LEAD FRAMES FOR SEMICONDUCTOR PACKAGES WITH INCREASED RELIABILITY AND RELATED SEMICONDUCTOR DEVICE PACKAGES AND METHODS
[patent_app_type] => utility
[patent_app_number] => 17/314535
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Array
(
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[patent_title] => Connection structure embedded substrate
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Array
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[patent_title] => Ground wing portion for electronic package device
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Array
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[patent_title] => Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
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Array
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Array
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[patent_title] => Pixel regions having curved surfaces between first and second definition layers
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Array
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[rel_patent_id] =>[rel_patent_doc_number] =>) 17/233786 | Wiring structure having stacked first and second electrodes | Apr 18, 2021 | Issued |
Array
(
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[patent_doc_number] => 11581235
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[patent_title] => IC package including multi-chip unit with bonded integrated heat spreader
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Array
(
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[patent_title] => Silicon rich nitride layer between a plurality of semiconductor layers
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Array
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Array
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Array
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Array
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Array
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Array
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Array
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