Search

Alonzo Chambliss

Examiner (ID: 15572)

Most Active Art Unit
2897
Art Unit(s)
2897, 2827, 2814, 2892
Total Applications
2378
Issued Applications
2104
Pending Applications
102
Abandoned Applications
209

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17070920 [patent_doc_number] => 20210273137 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-02 [patent_title] => LIGHT-EMITTING DEVICE [patent_app_type] => utility [patent_app_number] => 17/321078 [patent_app_country] => US [patent_app_date] => 2021-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 21359 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17321078 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/321078
Light-emitting device with a plurality of electrodes on a semiconductor stack May 13, 2021 Issued
Array ( [id] => 17780149 [patent_doc_number] => 20220246499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-04 [patent_title] => LEAD FRAMES FOR SEMICONDUCTOR PACKAGES WITH INCREASED RELIABILITY AND RELATED SEMICONDUCTOR DEVICE PACKAGES AND METHODS [patent_app_type] => utility [patent_app_number] => 17/314535 [patent_app_country] => US [patent_app_date] => 2021-05-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6126 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17314535 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/314535
Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods May 6, 2021 Issued
Array ( [id] => 18387331 [patent_doc_number] => 11658124 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-05-23 [patent_title] => Connection structure embedded substrate [patent_app_type] => utility [patent_app_number] => 17/313310 [patent_app_country] => US [patent_app_date] => 2021-05-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 12 [patent_no_of_words] => 7612 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 142 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17313310 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/313310
Connection structure embedded substrate May 5, 2021 Issued
Array ( [id] => 17956362 [patent_doc_number] => 11482475 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-10-25 [patent_title] => Ground wing portion for electronic package device [patent_app_type] => utility [patent_app_number] => 17/306955 [patent_app_country] => US [patent_app_date] => 2021-05-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6512 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17306955 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/306955
Ground wing portion for electronic package device May 3, 2021 Issued
Array ( [id] => 18431654 [patent_doc_number] => 11676884 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-06-13 [patent_title] => Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies [patent_app_type] => utility [patent_app_number] => 17/242121 [patent_app_country] => US [patent_app_date] => 2021-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 9 [patent_no_of_words] => 3510 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17242121 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/242121
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies Apr 26, 2021 Issued
Array ( [id] => 18016464 [patent_doc_number] => 11508771 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-22 [patent_title] => Image sensors [patent_app_type] => utility [patent_app_number] => 17/240120 [patent_app_country] => US [patent_app_date] => 2021-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 12406 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17240120 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/240120
Image sensors Apr 25, 2021 Issued
Array ( [id] => 19767461 [patent_doc_number] => 12225777 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-02-11 [patent_title] => Pixel regions having curved surfaces between first and second definition layers [patent_app_type] => utility [patent_app_number] => 17/629026 [patent_app_country] => US [patent_app_date] => 2021-04-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 6514 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 372 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17629026 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/629026
Pixel regions having curved surfaces between first and second definition layers Apr 22, 2021 Issued
Array ( [id] => 17188810 [patent_doc_number] => 20210335695 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-28 [patent_title] => WIRING SUBSTRATE AND ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/233786 [patent_app_country] => US [patent_app_date] => 2021-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17028 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17233786 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/233786
Wiring structure having stacked first and second electrodes Apr 18, 2021 Issued
Array ( [id] => 18190634 [patent_doc_number] => 11581235 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-14 [patent_title] => IC package including multi-chip unit with bonded integrated heat spreader [patent_app_type] => utility [patent_app_number] => 17/234671 [patent_app_country] => US [patent_app_date] => 2021-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 7372 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17234671 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/234671
IC package including multi-chip unit with bonded integrated heat spreader Apr 18, 2021 Issued
Array ( [id] => 18032211 [patent_doc_number] => 11515411 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-11-29 [patent_title] => Silicon rich nitride layer between a plurality of semiconductor layers [patent_app_type] => utility [patent_app_number] => 17/232201 [patent_app_country] => US [patent_app_date] => 2021-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 22 [patent_no_of_words] => 9340 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 435 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17232201 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/232201
Silicon rich nitride layer between a plurality of semiconductor layers Apr 15, 2021 Issued
Array ( [id] => 18766964 [patent_doc_number] => 11817374 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-11-14 [patent_title] => Electronic device with exposed tie bar [patent_app_type] => utility [patent_app_number] => 17/229955 [patent_app_country] => US [patent_app_date] => 2021-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 14 [patent_no_of_words] => 4110 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 210 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17229955 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/229955
Electronic device with exposed tie bar Apr 13, 2021 Issued
Array ( [id] => 17941782 [patent_doc_number] => 11476242 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-10-18 [patent_title] => Cascode power electronic device packaging method and packaging structure thereof [patent_app_type] => utility [patent_app_number] => 17/229880 [patent_app_country] => US [patent_app_date] => 2021-04-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 49 [patent_no_of_words] => 6006 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 238 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17229880 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/229880
Cascode power electronic device packaging method and packaging structure thereof Apr 13, 2021 Issued
Array ( [id] => 18520814 [patent_doc_number] => 11710709 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-25 [patent_title] => Terminal member made of plurality of metal layers between two heat sinks [patent_app_type] => utility [patent_app_number] => 17/228033 [patent_app_country] => US [patent_app_date] => 2021-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 16 [patent_no_of_words] => 12831 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 226 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17228033 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/228033
Terminal member made of plurality of metal layers between two heat sinks Apr 11, 2021 Issued
Array ( [id] => 17174121 [patent_doc_number] => 20210327792 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-10-21 [patent_title] => PACKAGED STACKABLE ELECTRONIC POWER DEVICE FOR SURFACE MOUNTING AND CIRCUIT ARRANGEMENT [patent_app_type] => utility [patent_app_number] => 17/227030 [patent_app_country] => US [patent_app_date] => 2021-04-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11126 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 141 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17227030 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/227030
Packaged stackable electronic power device for surface mounting and circuit arrangement Apr 8, 2021 Issued
Array ( [id] => 17485990 [patent_doc_number] => 20220093494 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-24 [patent_title] => LEAD FRAME [patent_app_type] => utility [patent_app_number] => 17/225683 [patent_app_country] => US [patent_app_date] => 2021-04-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2824 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17225683 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/225683
Lead frame having a die pad with a plurality of grooves on an underside Apr 7, 2021 Issued
Array ( [id] => 17917570 [patent_doc_number] => 20220319966 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-10-06 [patent_title] => ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE [patent_app_type] => utility [patent_app_number] => 17/219830 [patent_app_country] => US [patent_app_date] => 2021-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5294 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17219830 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/219830
Isolated temperature sensor device package Mar 30, 2021 Issued
Array ( [id] => 16966203 [patent_doc_number] => 20210217702 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-15 [patent_title] => SYSTEMS AND METHODS FOR INTERCONNECTING DIES [patent_app_type] => utility [patent_app_number] => 17/216278 [patent_app_country] => US [patent_app_date] => 2021-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7905 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17216278 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/216278
Die-to-die routing through a seal ring Mar 28, 2021 Issued
Array ( [id] => 18299785 [patent_doc_number] => 20230109471 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-06 [patent_title] => ELECTRONIC DEVICE [patent_app_type] => utility [patent_app_number] => 17/913527 [patent_app_country] => US [patent_app_date] => 2021-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17167 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 221 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17913527 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/913527
ELECTRONIC DEVICE Mar 21, 2021 Pending
Array ( [id] => 17477413 [patent_doc_number] => 20220084917 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-17 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/201544 [patent_app_country] => US [patent_app_date] => 2021-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7766 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17201544 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/201544
Plurality of leads between MOSFET chips Mar 14, 2021 Issued
Array ( [id] => 16920516 [patent_doc_number] => 20210193608 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-24 [patent_title] => CIRCUIT BOARD ELEMENT AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/195649 [patent_app_country] => US [patent_app_date] => 2021-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8254 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 192 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17195649 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/195649
CIRCUIT BOARD ELEMENT AND MANUFACTURING METHOD THEREOF Mar 8, 2021 Abandoned
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