
Alonzo Chambliss
Examiner (ID: 8324, Phone: (571)272-1927 , Office: P/2897 )
| Most Active Art Unit | 2897 |
| Art Unit(s) | 2814, 2892, 2827, 2897 |
| Total Applications | 2380 |
| Issued Applications | 2112 |
| Pending Applications | 97 |
| Abandoned Applications | 209 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 18810337
[patent_doc_number] => 20230384672
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-30
[patent_title] => Polymer Layer in Semiconductor Device and Method of Manufacture
[patent_app_type] => utility
[patent_app_number] => 18/446562
[patent_app_country] => US
[patent_app_date] => 2023-08-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13809
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 98
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18446562
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/446562 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Aug 8, 2023 | Issued |
Array
(
[id] => 18789411
[patent_doc_number] => 20230378073
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-23
[patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/363769
[patent_app_country] => US
[patent_app_date] => 2023-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9883
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 95
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363769
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/363769 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Aug 1, 2023 | Issued |
Array
(
[id] => 18812654
[patent_doc_number] => 20230386991
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-30
[patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/363766
[patent_app_country] => US
[patent_app_date] => 2023-08-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 13008
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363766
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/363766 | Encircling a semiconductor device with stacked frames on a substrate | Aug 1, 2023 | Issued |
Array
(
[id] => 19428220
[patent_doc_number] => 12087654
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-10
[patent_title] => Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region
[patent_app_type] => utility
[patent_app_number] => 18/358914
[patent_app_country] => US
[patent_app_date] => 2023-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 28
[patent_no_of_words] => 11115
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 104
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358914
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/358914 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Jul 24, 2023 | Issued |
Array
(
[id] => 20118422
[patent_doc_number] => 12368141
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-07-22
[patent_title] => IPD modules with flexible connection scheme in packaging
[patent_app_type] => utility
[patent_app_number] => 18/357457
[patent_app_country] => US
[patent_app_date] => 2023-07-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 25
[patent_figures_cnt] => 34
[patent_no_of_words] => 2070
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 106
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357457
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/357457 | IPD modules with flexible connection scheme in packaging | Jul 23, 2023 | Issued |
Array
(
[id] => 19670878
[patent_doc_number] => 12183649
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-31
[patent_title] => IC package including multi-chip unit with bonded integrated heat spreader
[patent_app_type] => utility
[patent_app_number] => 18/222855
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 12
[patent_no_of_words] => 7420
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 334
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222855
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/222855 | IC package including multi-chip unit with bonded integrated heat spreader | Jul 16, 2023 | Issued |
Array
(
[id] => 19546509
[patent_doc_number] => 20240363545
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-10-31
[patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/352952
[patent_app_country] => US
[patent_app_date] => 2023-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3639
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 82
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352952
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/352952 | ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF | Jul 13, 2023 | Pending |
Array
(
[id] => 19460157
[patent_doc_number] => 12100664
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-24
[patent_title] => Semiconductor device with curved conductive lines and method of forming the same
[patent_app_type] => utility
[patent_app_number] => 18/352595
[patent_app_country] => US
[patent_app_date] => 2023-07-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 20
[patent_figures_cnt] => 20
[patent_no_of_words] => 8881
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352595
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/352595 | Semiconductor device with curved conductive lines and method of forming the same | Jul 13, 2023 | Issued |
Array
(
[id] => 19124901
[patent_doc_number] => 11968909
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-04-23
[patent_title] => Method of manufacturing a magnetoresistive random access memory (MRAM)
[patent_app_type] => utility
[patent_app_number] => 18/219320
[patent_app_country] => US
[patent_app_date] => 2023-07-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 20
[patent_no_of_words] => 5113
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 52
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18219320
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/219320 | Method of manufacturing a magnetoresistive random access memory (MRAM) | Jul 6, 2023 | Issued |
Array
(
[id] => 19428242
[patent_doc_number] => 12087676
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-09-10
[patent_title] => Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof
[patent_app_type] => utility
[patent_app_number] => 18/217795
[patent_app_country] => US
[patent_app_date] => 2023-07-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 29
[patent_no_of_words] => 8945
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217795
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/217795 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Jul 2, 2023 | Issued |
Array
(
[id] => 18712896
[patent_doc_number] => 20230335529
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-19
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/340346
[patent_app_country] => US
[patent_app_date] => 2023-06-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7959
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 150
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340346
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/340346 | SEMICONDUCTOR DEVICE | Jun 22, 2023 | Pending |
Array
(
[id] => 19101079
[patent_doc_number] => 20240120307
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-04-11
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/334304
[patent_app_country] => US
[patent_app_date] => 2023-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8171
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18334304
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/334304 | SEMICONDUCTOR DEVICE | Jun 12, 2023 | Pending |
Array
(
[id] => 19101079
[patent_doc_number] => 20240120307
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-04-11
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/334304
[patent_app_country] => US
[patent_app_date] => 2023-06-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8171
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 94
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18334304
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/334304 | SEMICONDUCTOR DEVICE | Jun 12, 2023 | Pending |
Array
(
[id] => 20441540
[patent_doc_number] => 12512382
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-12-30
[patent_title] => Semiconductor device including stress control layer and methods of forming the same
[patent_app_type] => utility
[patent_app_number] => 18/330432
[patent_app_country] => US
[patent_app_date] => 2023-06-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 16
[patent_no_of_words] => 3386
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 127
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18330432
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/330432 | Semiconductor device including stress control layer and methods of forming the same | Jun 6, 2023 | Issued |
Array
(
[id] => 19507859
[patent_doc_number] => 12119289
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-10-15
[patent_title] => Semiconductor packages with roughened conductive components
[patent_app_type] => utility
[patent_app_number] => 18/328896
[patent_app_country] => US
[patent_app_date] => 2023-06-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 21
[patent_no_of_words] => 5101
[patent_no_of_claims] => 25
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328896
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/328896 | Semiconductor packages with roughened conductive components | Jun 4, 2023 | Issued |
Array
(
[id] => 19627111
[patent_doc_number] => 12165960
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-12-10
[patent_title] => Semiconductor device
[patent_app_type] => utility
[patent_app_number] => 18/324424
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
[patent_figures_cnt] => 18
[patent_no_of_words] => 9323
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 407
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324424
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/324424 | Semiconductor device | May 25, 2023 | Issued |
Array
(
[id] => 19356946
[patent_doc_number] => 12057403
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-06
[patent_title] => Light engine based on silicon photonics TSV interposer
[patent_app_type] => utility
[patent_app_number] => 18/202666
[patent_app_country] => US
[patent_app_date] => 2023-05-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 25
[patent_no_of_words] => 6205
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18202666
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/202666 | Light engine based on silicon photonics TSV interposer | May 25, 2023 | Issued |
Array
(
[id] => 19370547
[patent_doc_number] => 12062641
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-08-13
[patent_title] => Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same
[patent_app_type] => utility
[patent_app_number] => 18/322467
[patent_app_country] => US
[patent_app_date] => 2023-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
[patent_figures_cnt] => 27
[patent_no_of_words] => 21812
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322467
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/322467 | Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same | May 22, 2023 | Issued |
Array
(
[id] => 18653139
[patent_doc_number] => 20230298979
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-09-21
[patent_title] => ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/322369
[patent_app_country] => US
[patent_app_date] => 2023-05-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5323
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 102
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322369
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/322369 | ISOLATED TEMPERATURE SENSOR DEVICE PACKAGE | May 22, 2023 | Abandoned |
Array
(
[id] => 19294604
[patent_doc_number] => 12033968
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2024-07-09
[patent_title] => Package structure including stacked pillar portions
[patent_app_type] => utility
[patent_app_number] => 18/311864
[patent_app_country] => US
[patent_app_date] => 2023-05-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
[patent_figures_cnt] => 12
[patent_no_of_words] => 6740
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 146
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18311864
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/311864 | Package structure including stacked pillar portions | May 2, 2023 | Issued |