Search

Alonzo Chambliss

Examiner (ID: 7113, Phone: (571)272-1927 , Office: P/2897 )

Most Active Art Unit
2897
Art Unit(s)
2814, 2827, 2892, 2897
Total Applications
2434
Issued Applications
2138
Pending Applications
110
Abandoned Applications
210

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 18789411 [patent_doc_number] => 20230378073 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/363769 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9883 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363769 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363769
Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof Aug 1, 2023 Issued
Array ( [id] => 19007805 [patent_doc_number] => 20240071876 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-29 [patent_title] => SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/359098 [patent_app_country] => US [patent_app_date] => 2023-07-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10710 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 167 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18359098 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/359098
SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACTURING METHOD Jul 25, 2023 Pending
Array ( [id] => 19428220 [patent_doc_number] => 12087654 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-10 [patent_title] => Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region [patent_app_type] => utility [patent_app_number] => 18/358914 [patent_app_country] => US [patent_app_date] => 2023-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 21 [patent_figures_cnt] => 28 [patent_no_of_words] => 11115 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18358914 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/358914
Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region Jul 24, 2023 Issued
Array ( [id] => 20118422 [patent_doc_number] => 12368141 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-07-22 [patent_title] => IPD modules with flexible connection scheme in packaging [patent_app_type] => utility [patent_app_number] => 18/357457 [patent_app_country] => US [patent_app_date] => 2023-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 34 [patent_no_of_words] => 2070 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18357457 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/357457
IPD modules with flexible connection scheme in packaging Jul 23, 2023 Issued
Array ( [id] => 19670878 [patent_doc_number] => 12183649 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-31 [patent_title] => IC package including multi-chip unit with bonded integrated heat spreader [patent_app_type] => utility [patent_app_number] => 18/222855 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 12 [patent_no_of_words] => 7420 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 334 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18222855 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/222855
IC package including multi-chip unit with bonded integrated heat spreader Jul 16, 2023 Issued
Array ( [id] => 19546509 [patent_doc_number] => 20240363545 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-31 [patent_title] => ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/352952 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3639 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 82 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352952 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/352952
Electronic package having a chip with a trench in the surface Jul 13, 2023 Issued
Array ( [id] => 19460157 [patent_doc_number] => 12100664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-24 [patent_title] => Semiconductor device with curved conductive lines and method of forming the same [patent_app_type] => utility [patent_app_number] => 18/352595 [patent_app_country] => US [patent_app_date] => 2023-07-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 8881 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18352595 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/352595
Semiconductor device with curved conductive lines and method of forming the same Jul 13, 2023 Issued
Array ( [id] => 19124901 [patent_doc_number] => 11968909 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-04-23 [patent_title] => Method of manufacturing a magnetoresistive random access memory (MRAM) [patent_app_type] => utility [patent_app_number] => 18/219320 [patent_app_country] => US [patent_app_date] => 2023-07-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 5113 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18219320 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/219320
Method of manufacturing a magnetoresistive random access memory (MRAM) Jul 6, 2023 Issued
Array ( [id] => 19428242 [patent_doc_number] => 12087676 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-09-10 [patent_title] => Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof [patent_app_type] => utility [patent_app_number] => 18/217795 [patent_app_country] => US [patent_app_date] => 2023-07-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 29 [patent_no_of_words] => 8945 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217795 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/217795
Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof Jul 2, 2023 Issued
Array ( [id] => 19688108 [patent_doc_number] => 20250006653 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES [patent_app_type] => utility [patent_app_number] => 18/346108 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16900 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18346108 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/346108
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES Jun 29, 2023 Pending
Array ( [id] => 18882907 [patent_doc_number] => 20240006276 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE ASSEMBLY AND A SEMICONDUCTOR PACKAGE ASSEMBLY MANUFACTURED USING THIS METHOD [patent_app_type] => utility [patent_app_number] => 18/343845 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3544 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 212 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18343845 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/343845
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE ASSEMBLY AND A SEMICONDUCTOR PACKAGE ASSEMBLY MANUFACTURED USING THIS METHOD Jun 28, 2023 Pending
Array ( [id] => 18712896 [patent_doc_number] => 20230335529 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/340346 [patent_app_country] => US [patent_app_date] => 2023-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7959 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18340346 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/340346
Metal layer plated to inner leads of a leadframe Jun 22, 2023 Issued
Array ( [id] => 18712824 [patent_doc_number] => 20230335457 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-19 [patent_title] => POWER MODULE [patent_app_type] => utility [patent_app_number] => 18/337975 [patent_app_country] => US [patent_app_date] => 2023-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5444 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 186 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18337975 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/337975
POWER MODULE Jun 19, 2023 Pending
Array ( [id] => 20831607 [patent_doc_number] => 12685212 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-07-14 [patent_title] => Switching device electrically connected to a lead frame by a bonding material [patent_app_type] => utility [patent_app_number] => 18/334304 [patent_app_country] => US [patent_app_date] => 2023-06-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 3410 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18334304 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/334304
Switching device electrically connected to a lead frame by a bonding material Jun 12, 2023 Issued
Array ( [id] => 19634617 [patent_doc_number] => 20240413066 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-12 [patent_title] => EMBEDDED SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/331964 [patent_app_country] => US [patent_app_date] => 2023-06-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5598 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18331964 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/331964
EMBEDDED SEMICONDUCTOR DEVICE Jun 8, 2023 Pending
Array ( [id] => 20441540 [patent_doc_number] => 12512382 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-12-30 [patent_title] => Semiconductor device including stress control layer and methods of forming the same [patent_app_type] => utility [patent_app_number] => 18/330432 [patent_app_country] => US [patent_app_date] => 2023-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 3386 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 127 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18330432 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/330432
Semiconductor device including stress control layer and methods of forming the same Jun 6, 2023 Issued
Array ( [id] => 19507859 [patent_doc_number] => 12119289 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-10-15 [patent_title] => Semiconductor packages with roughened conductive components [patent_app_type] => utility [patent_app_number] => 18/328896 [patent_app_country] => US [patent_app_date] => 2023-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 21 [patent_no_of_words] => 5101 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 63 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18328896 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/328896
Semiconductor packages with roughened conductive components Jun 4, 2023 Issued
Array ( [id] => 19627111 [patent_doc_number] => 12165960 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 18/324424 [patent_app_country] => US [patent_app_date] => 2023-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 9323 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 407 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18324424 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/324424
Semiconductor device May 25, 2023 Issued
Array ( [id] => 19356946 [patent_doc_number] => 12057403 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-06 [patent_title] => Light engine based on silicon photonics TSV interposer [patent_app_type] => utility [patent_app_number] => 18/202666 [patent_app_country] => US [patent_app_date] => 2023-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 25 [patent_no_of_words] => 6205 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18202666 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/202666
Light engine based on silicon photonics TSV interposer May 25, 2023 Issued
Array ( [id] => 19370547 [patent_doc_number] => 12062641 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-13 [patent_title] => Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same [patent_app_type] => utility [patent_app_number] => 18/322467 [patent_app_country] => US [patent_app_date] => 2023-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 27 [patent_no_of_words] => 21812 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18322467 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/322467
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same May 22, 2023 Issued
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