Search

Alonzo Chambliss

Examiner (ID: 7693, Phone: (571)272-1927 , Office: P/2897 )

Most Active Art Unit
2897
Art Unit(s)
2892, 2814, 2897, 2827
Total Applications
2413
Issued Applications
2126
Pending Applications
105
Abandoned Applications
210

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20540577 [patent_doc_number] => 12557667 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-02-17 [patent_title] => Semiconductor device with lead frame having an offset portion on a die pad [patent_app_type] => utility [patent_app_number] => 18/170159 [patent_app_country] => US [patent_app_date] => 2023-02-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 3583 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 252 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18170159 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/170159
Semiconductor device with lead frame having an offset portion on a die pad Feb 15, 2023 Issued
Array ( [id] => 18473423 [patent_doc_number] => 20230207711 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-29 [patent_title] => MULTI-DIMENSIONAL PHOTONIC INTEGRATED CIRCUITS AND MEMORY STRUCTURE FOR PHOTONIC INTEGRATED CIRCUITS AND ASSOCIATED SYSTEMS AND METHODS [patent_app_type] => utility [patent_app_number] => 18/109291 [patent_app_country] => US [patent_app_date] => 2023-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10631 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109291 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/109291
Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package Feb 13, 2023 Issued
Array ( [id] => 18600207 [patent_doc_number] => 20230275008 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-31 [patent_title] => SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD [patent_app_type] => utility [patent_app_number] => 18/169146 [patent_app_country] => US [patent_app_date] => 2023-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5788 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18169146 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/169146
SEMICONDUCTOR PACKAGE WITH OVERLAPPING LEADS AND DIE PAD Feb 13, 2023 Pending
Array ( [id] => 18572688 [patent_doc_number] => 20230263026 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => LIGHT-EMITTING ELEMENT AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 18/109274 [patent_app_country] => US [patent_app_date] => 2023-02-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9050 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109274 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/109274
Light-emitting element with a pixel electrode having an uneven structure Feb 13, 2023 Issued
Array ( [id] => 20305410 [patent_doc_number] => 12451410 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-21 [patent_title] => Semiconductor package module including vertical terminals [patent_app_type] => utility [patent_app_number] => 18/109190 [patent_app_country] => US [patent_app_date] => 2023-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 19 [patent_no_of_words] => 0 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 193 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18109190 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/109190
Semiconductor package module including vertical terminals Feb 12, 2023 Issued
Array ( [id] => 18570589 [patent_doc_number] => 20230260926 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS [patent_app_type] => utility [patent_app_number] => 18/107143 [patent_app_country] => US [patent_app_date] => 2023-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18107143 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/107143
Semiconductor packages having fixing members Feb 7, 2023 Issued
Array ( [id] => 18570589 [patent_doc_number] => 20230260926 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS [patent_app_type] => utility [patent_app_number] => 18/107143 [patent_app_country] => US [patent_app_date] => 2023-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18107143 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/107143
Semiconductor packages having fixing members Feb 7, 2023 Issued
Array ( [id] => 18570589 [patent_doc_number] => 20230260926 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS [patent_app_type] => utility [patent_app_number] => 18/107143 [patent_app_country] => US [patent_app_date] => 2023-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18107143 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/107143
Semiconductor packages having fixing members Feb 7, 2023 Issued
Array ( [id] => 18570589 [patent_doc_number] => 20230260926 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-08-17 [patent_title] => SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS [patent_app_type] => utility [patent_app_number] => 18/107143 [patent_app_country] => US [patent_app_date] => 2023-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7838 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 122 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18107143 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/107143
Semiconductor packages having fixing members Feb 7, 2023 Issued
18/040273 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Feb 1, 2023 Pending
Array ( [id] => 18440031 [patent_doc_number] => 20230187326 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => SEMICONDUCTOR DEVICE HAVING A CARRIER, SEMICONDUCTOR CHIP PACKAGES MOUNTED ON THE CARRIER AND A COOLING ELEMENT [patent_app_type] => utility [patent_app_number] => 18/103865 [patent_app_country] => US [patent_app_date] => 2023-01-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16870 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18103865 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/103865
Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element Jan 30, 2023 Issued
Array ( [id] => 20455979 [patent_doc_number] => 12519041 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-01-06 [patent_title] => Semiconductor module for a power semiconductor device [patent_app_type] => utility [patent_app_number] => 18/161571 [patent_app_country] => US [patent_app_date] => 2023-01-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 3504 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 131 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18161571 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/161571
Semiconductor module for a power semiconductor device Jan 29, 2023 Issued
Array ( [id] => 18857323 [patent_doc_number] => 11854918 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Seal ring between interconnected chips mounted on an integrated circuit [patent_app_type] => utility [patent_app_number] => 18/155713 [patent_app_country] => US [patent_app_date] => 2023-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 8255 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 64 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18155713 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/155713
Seal ring between interconnected chips mounted on an integrated circuit Jan 16, 2023 Issued
Array ( [id] => 18950984 [patent_doc_number] => 11894290 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-06 [patent_title] => Packaged stackable electronic power device for surface mounting and circuit arrangement [patent_app_type] => utility [patent_app_number] => 18/150511 [patent_app_country] => US [patent_app_date] => 2023-01-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 35 [patent_no_of_words] => 11126 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150511 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/150511
Packaged stackable electronic power device for surface mounting and circuit arrangement Jan 4, 2023 Issued
Array ( [id] => 19364396 [patent_doc_number] => 20240266430 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => ENHANCEMENT-MODE N-CHANNEL AND P-CHANNEL GAN DEVICE INTEGRATION STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/577714 [patent_app_country] => US [patent_app_date] => 2022-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4524 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -6 [patent_words_short_claim] => 279 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18577714 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/577714
Enhancement-mode N-channel and P-channel GaN device integration structure Dec 28, 2022 Issued
Array ( [id] => 18340248 [patent_doc_number] => 20230132197 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SPREADER [patent_app_type] => utility [patent_app_number] => 18/089536 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7393 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18089536 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/089536
IC package including multi-chip unit with bonded integrated heat spreader Dec 26, 2022 Issued
Array ( [id] => 18804385 [patent_doc_number] => 11837549 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-05 [patent_title] => Power delivery for embedded bridge die utilizing trench structures [patent_app_type] => utility [patent_app_number] => 18/089542 [patent_app_country] => US [patent_app_date] => 2022-12-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 6350 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18089542 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/089542
Power delivery for embedded bridge die utilizing trench structures Dec 26, 2022 Issued
Array ( [id] => 18334715 [patent_doc_number] => 20230126663 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => LAYER STRUCTURE AND CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/088238 [patent_app_country] => US [patent_app_date] => 2022-12-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11536 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18088238 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/088238
Layer structure with an intermetallic phase layer and a chip package that includes the layer structure Dec 22, 2022 Issued
Array ( [id] => 18323207 [patent_doc_number] => 20230121335 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => Power Module with Press-Fit Contacts [patent_app_type] => utility [patent_app_number] => 18/086950 [patent_app_country] => US [patent_app_date] => 2022-12-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6431 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 18 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18086950 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/086950
Power module with press-fit contacts Dec 21, 2022 Issued
Array ( [id] => 18323253 [patent_doc_number] => 20230121381 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT BOARD USING PIN SOLDER ENHANCEMENT [patent_app_type] => utility [patent_app_number] => 18/068562 [patent_app_country] => US [patent_app_date] => 2022-12-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11612 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -28 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18068562 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/068562
Systems and methods for providing an interface on a printed circuit board using pin solder enhancement Dec 19, 2022 Issued
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