Alonzo Chambliss

Array ( [id] => 19294596 [patent_doc_number] => 12033960 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2024-07-09 [patent_title] => Semiconductor package with stiffener ring having elevated opening [patent_app_type] => utility [patent_app_number] => 17/548325 [patent_app_country] => US [patent_app_date] => 2021-12-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 4452 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17548325 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18440030 [patent_doc_number] => 20230187325 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-06-15 [patent_title] => RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF THERMAL EXPANSION MATCHED MOUNT PADS AND ASSOCIATED FABRICATION METHODS [patent_app_type] => utility [patent_app_number] => 17/546453 [patent_app_country] => US [patent_app_date] => 2021-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 17522 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 123 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17546453 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19277338 [patent_doc_number] => 12027470 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-07-02 [patent_title] => Package carrier having a stiffener between solder bumps [patent_app_type] => utility [patent_app_number] => 17/547200 [patent_app_country] => US [patent_app_date] => 2021-12-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 33 [patent_no_of_words] => 5984 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17547200 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19046687 [patent_doc_number] => 11935807 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-03-19 [patent_title] => Plurality of dies electrically connected to a printed circuit board by a clip [patent_app_type] => utility [patent_app_number] => 17/542645 [patent_app_country] => US [patent_app_date] => 2021-12-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 1594 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17542645 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17486012 [patent_doc_number] => 20220093516 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-03-24 [patent_title] => POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES [patent_app_type] => utility [patent_app_number] => 17/540141 [patent_app_country] => US [patent_app_date] => 2021-12-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6324 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17540141 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17645280 [patent_doc_number] => 20220173019 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-06-02 [patent_title] => LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF LEAD FRAME [patent_app_type] => utility [patent_app_number] => 17/536713 [patent_app_country] => US [patent_app_date] => 2021-11-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5517 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17536713 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19376633 [patent_doc_number] => 12068213 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-20 [patent_title] => Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof [patent_app_type] => utility [patent_app_number] => 17/531867 [patent_app_country] => US [patent_app_date] => 2021-11-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 36 [patent_no_of_words] => 5608 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 124 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17531867 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18068166 [patent_doc_number] => 20220399254 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-15 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME [patent_app_type] => utility [patent_app_number] => 17/531736 [patent_app_country] => US [patent_app_date] => 2021-11-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5454 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17531736 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18967487 [patent_doc_number] => 11901268 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-13 [patent_title] => Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith [patent_app_type] => utility [patent_app_number] => 17/455709 [patent_app_country] => US [patent_app_date] => 2021-11-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 11621 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 184 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17455709 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18337630 [patent_doc_number] => 20230129579 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-27 [patent_title] => HIGH ELECTRON MOBILITY TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/528159 [patent_app_country] => US [patent_app_date] => 2021-11-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3175 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 74 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17528159 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18983582 [patent_doc_number] => 11908771 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-02-20 [patent_title] => Power semiconductor device with dual heat dissipation structures [patent_app_type] => utility [patent_app_number] => 17/524879 [patent_app_country] => US [patent_app_date] => 2021-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 25 [patent_no_of_words] => 6206 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17524879 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19229707 [patent_doc_number] => 12009351 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Plurality of semiconductor devices between stacked substrates [patent_app_type] => utility [patent_app_number] => 17/525833 [patent_app_country] => US [patent_app_date] => 2021-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 55 [patent_figures_cnt] => 55 [patent_no_of_words] => 18584 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17525833 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18848755 [patent_doc_number] => 20230411159 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-21 [patent_title] => LASER IRRADIATION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS [patent_app_type] => utility [patent_app_number] => 18/035775 [patent_app_country] => US [patent_app_date] => 2021-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11990 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18035775 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18326491 [patent_doc_number] => 20230124619 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-04-20 [patent_title] => CAVITY FORMED IN A MOLDING COMPOUND OF A SEMICONDUCTOR PACKAGE TO REDUCE MECHANICAL STRESS ON A PORTION OF A DIE IN THE PACKAGE, AND METHODS OF FORMATION [patent_app_type] => utility [patent_app_number] => 17/453202 [patent_app_country] => US [patent_app_date] => 2021-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4638 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 44 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17453202 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17417401 [patent_doc_number] => 20220052305 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-17 [patent_title] => ORGANIC LIGHT-EMITTING APPARATUS AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/516494 [patent_app_country] => US [patent_app_date] => 2021-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 278 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17516494 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 17417066 [patent_doc_number] => 20220051970 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-17 [patent_title] => INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME [patent_app_type] => utility [patent_app_number] => 17/511879 [patent_app_country] => US [patent_app_date] => 2021-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11654 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 284 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17511879 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18042255 [patent_doc_number] => 20220386472 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-12-01 [patent_title] => CIRCUIT BOARD PREPARATION METHOD [patent_app_type] => utility [patent_app_number] => 17/503360 [patent_app_country] => US [patent_app_date] => 2021-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6781 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 178 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17503360 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18913041 [patent_doc_number] => 11876028 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-01-16 [patent_title] => Package with electrically insulated carrier and at least one step on encapsulant [patent_app_type] => utility [patent_app_number] => 17/502082 [patent_app_country] => US [patent_app_date] => 2021-10-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 35 [patent_no_of_words] => 12414 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17502082 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18494220 [patent_doc_number] => 11699641 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-07-11 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 17/499018 [patent_app_country] => US [patent_app_date] => 2021-10-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 18 [patent_no_of_words] => 9324 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 420 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17499018 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19401240 [patent_doc_number] => 12075652 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-08-27 [patent_title] => Light-emitting device, display device, imaging device, and electronic device, with substrate, lens including convex curved surface portion, and light-emitting part between surface of substrate and lens [patent_app_type] => utility [patent_app_number] => 17/495947 [patent_app_country] => US [patent_app_date] => 2021-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 28 [patent_no_of_words] => 13175 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 202 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17495947 [rel_patent_id] =>[rel_patent_doc_number] =>)