Search

Amy B. Vanatta

Examiner (ID: 16175, Phone: (571)272-4995 , Office: P/3765 )

Most Active Art Unit
3732
Art Unit(s)
3741, 3765, 3408, 3732, 2407, 2741
Total Applications
2837
Issued Applications
2062
Pending Applications
167
Abandoned Applications
634

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19229673 [patent_doc_number] => 12009317 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-06-11 [patent_title] => Semiconductor package structure and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 17/321139 [patent_app_country] => US [patent_app_date] => 2021-05-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 37 [patent_no_of_words] => 8108 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17321139 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/321139
Semiconductor package structure and method for manufacturing the same May 13, 2021 Issued
Array ( [id] => 17055780 [patent_doc_number] => 20210265214 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE [patent_app_type] => utility [patent_app_number] => 17/317845 [patent_app_country] => US [patent_app_date] => 2021-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4829 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17317845 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/317845
Methods and apparatus for an improved integrated circuit package May 10, 2021 Issued
Array ( [id] => 18593357 [patent_doc_number] => 11742268 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-29 [patent_title] => Package structure applied to power converter [patent_app_type] => utility [patent_app_number] => 17/243949 [patent_app_country] => US [patent_app_date] => 2021-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5702 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17243949 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/243949
Package structure applied to power converter Apr 28, 2021 Issued
Array ( [id] => 18528675 [patent_doc_number] => 11715677 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-01 [patent_title] => Semiconductor device with frame having arms [patent_app_type] => utility [patent_app_number] => 17/234525 [patent_app_country] => US [patent_app_date] => 2021-04-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 2363 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 144 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17234525 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/234525
Semiconductor device with frame having arms Apr 18, 2021 Issued
Array ( [id] => 18235991 [patent_doc_number] => 11600555 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-03-07 [patent_title] => Package substrate having integrated passive device(s) between leads [patent_app_type] => utility [patent_app_number] => 17/233205 [patent_app_country] => US [patent_app_date] => 2021-04-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3724 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 189 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17233205 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/233205
Package substrate having integrated passive device(s) between leads Apr 15, 2021 Issued
Array ( [id] => 17262847 [patent_doc_number] => 20210375832 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-12-02 [patent_title] => SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 17/214075 [patent_app_country] => US [patent_app_date] => 2021-03-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15197 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -28 [patent_words_short_claim] => 191 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17214075 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/214075
Semiconductor device Mar 25, 2021 Issued
Array ( [id] => 17417053 [patent_doc_number] => 20220051957 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-02-17 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/212417 [patent_app_country] => US [patent_app_date] => 2021-03-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6162 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 128 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17212417 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/212417
Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses Mar 24, 2021 Issued
Array ( [id] => 17130366 [patent_doc_number] => 20210305135 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-30 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 17/209821 [patent_app_country] => US [patent_app_date] => 2021-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5277 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 40 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17209821 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/209821
Semiconductor package Mar 22, 2021 Issued
Array ( [id] => 18088605 [patent_doc_number] => 11538744 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-27 [patent_title] => Cascode semiconductor [patent_app_type] => utility [patent_app_number] => 17/204438 [patent_app_country] => US [patent_app_date] => 2021-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 15 [patent_no_of_words] => 3487 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 149 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17204438 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/204438
Cascode semiconductor Mar 16, 2021 Issued
Array ( [id] => 16936361 [patent_doc_number] => 20210202250 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-07-01 [patent_title] => METHOD OF IMPROVING DEPOSITION INDUCED CD IMBALANCE USING SPATIALLY SELECTIVE ASHING OF CARBON BASED FILM [patent_app_type] => utility [patent_app_number] => 17/204758 [patent_app_country] => US [patent_app_date] => 2021-03-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4468 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17204758 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/204758
Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film Mar 16, 2021 Issued
Array ( [id] => 18563066 [patent_doc_number] => 11728319 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-08-15 [patent_title] => Semiconductor package including a substrate, a semiconductor device, and a mold [patent_app_type] => utility [patent_app_number] => 17/198763 [patent_app_country] => US [patent_app_date] => 2021-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 16 [patent_no_of_words] => 4577 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17198763 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/198763
Semiconductor package including a substrate, a semiconductor device, and a mold Mar 10, 2021 Issued
Array ( [id] => 18317550 [patent_doc_number] => 11631634 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-18 [patent_title] => Leadless semiconductor package and method of manufacture [patent_app_type] => utility [patent_app_number] => 17/190508 [patent_app_country] => US [patent_app_date] => 2021-03-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 3560 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 118 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17190508 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/190508
Leadless semiconductor package and method of manufacture Mar 2, 2021 Issued
Array ( [id] => 18317544 [patent_doc_number] => 11631628 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-18 [patent_title] => Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same [patent_app_type] => utility [patent_app_number] => 17/249325 [patent_app_country] => US [patent_app_date] => 2021-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 20 [patent_no_of_words] => 9386 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17249325 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/249325
Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same Feb 25, 2021 Issued
Array ( [id] => 18317740 [patent_doc_number] => 11631826 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-04-18 [patent_title] => Light-emitting element, light-emitting device, and electronic device [patent_app_type] => utility [patent_app_number] => 17/185117 [patent_app_country] => US [patent_app_date] => 2021-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 27 [patent_no_of_words] => 14212 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 187 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17185117 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/185117
Light-emitting element, light-emitting device, and electronic device Feb 24, 2021 Issued
Array ( [id] => 17833715 [patent_doc_number] => 20220271019 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-08-25 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 17/185499 [patent_app_country] => US [patent_app_date] => 2021-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6420 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17185499 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/185499
Semiconductor package structure Feb 24, 2021 Issued
Array ( [id] => 18205679 [patent_doc_number] => 11588088 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-02-21 [patent_title] => Optoelectronic component that dissipates heat [patent_app_type] => utility [patent_app_number] => 17/183634 [patent_app_country] => US [patent_app_date] => 2021-02-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 10 [patent_no_of_words] => 6259 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 169 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17183634 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/183634
Optoelectronic component that dissipates heat Feb 23, 2021 Issued
Array ( [id] => 17247050 [patent_doc_number] => 20210366795 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-11-25 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 17/179137 [patent_app_country] => US [patent_app_date] => 2021-02-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4174 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -4 [patent_words_short_claim] => 109 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17179137 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/179137
Semiconductor device having control terminal and control substrate Feb 17, 2021 Issued
Array ( [id] => 17359877 [patent_doc_number] => 20220020673 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-01-20 [patent_title] => QUAD FLAT NO-LEAD PACKAGE STRUCTURE [patent_app_type] => utility [patent_app_number] => 17/169553 [patent_app_country] => US [patent_app_date] => 2021-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4520 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -23 [patent_words_short_claim] => 87 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17169553 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/169553
Quad flat no-lead package structure Feb 7, 2021 Issued
Array ( [id] => 19627110 [patent_doc_number] => 12165959 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2024-12-10 [patent_title] => Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method [patent_app_type] => utility [patent_app_number] => 17/150739 [patent_app_country] => US [patent_app_date] => 2021-01-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 40 [patent_no_of_words] => 17763 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 153 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17150739 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/150739
Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method Jan 14, 2021 Issued
Array ( [id] => 18073699 [patent_doc_number] => 11532539 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-12-20 [patent_title] => Semiconductor package with wettable flank [patent_app_type] => utility [patent_app_number] => 17/136136 [patent_app_country] => US [patent_app_date] => 2020-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 45 [patent_no_of_words] => 11154 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 200 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17136136 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/136136
Semiconductor package with wettable flank Dec 28, 2020 Issued
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