
Andargie M. Aychillhum
Examiner (ID: 2625)
| Most Active Art Unit | 2848 |
| Art Unit(s) | 2841, 2847, 2835, 2848 |
| Total Applications | 1542 |
| Issued Applications | 1297 |
| Pending Applications | 94 |
| Abandoned Applications | 197 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 11713205
[patent_doc_number] => 20170181704
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-06-29
[patent_title] => 'APPENDAGE MOUNTABLE ELECTRONIC DEVICES CONFORMABLE TO SURFACES'
[patent_app_type] => utility
[patent_app_number] => 15/375514
[patent_app_country] => US
[patent_app_date] => 2016-12-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 21
[patent_figures_cnt] => 21
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[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15375514
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/375514 | Appendage mountable electronic devices conformable to surfaces | Dec 11, 2016 | Issued |
Array
(
[id] => 11711154
[patent_doc_number] => 20170179653
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-06-22
[patent_title] => 'PRINTED CIRCUIT BOARD HAVING HIGH-SPEED OR HIGH-FREQUENCY SIGNAL CONNECTOR'
[patent_app_type] => utility
[patent_app_number] => 15/375744
[patent_app_country] => US
[patent_app_date] => 2016-12-12
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/375744 | Printed circuit board having high-speed or high-frequency signal connector | Dec 11, 2016 | Issued |
Array
(
[id] => 12828574
[patent_doc_number] => 20180168030
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-06-14
[patent_title] => IMPLEMENTING REWORKABLE STRAIN RELIEF PACKAGING STRUCTURE FOR ELECTRONIC COMPONENT INTERCONNECTS
[patent_app_type] => utility
[patent_app_number] => 15/373511
[patent_app_country] => US
[patent_app_date] => 2016-12-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/373511 | Implementing reworkable strain relief packaging structure for electronic component interconnects | Dec 8, 2016 | Issued |
Array
(
[id] => 13744233
[patent_doc_number] => 20180376587
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-12-27
[patent_title] => Flexible Electronic System
[patent_app_type] => utility
[patent_app_number] => 16/062914
[patent_app_country] => US
[patent_app_date] => 2016-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[rel_patent_id] =>[rel_patent_doc_number] =>) 16/062914 | Flexible electronic system | Dec 7, 2016 | Issued |
Array
(
[id] => 12110796
[patent_doc_number] => 09867292
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2018-01-09
[patent_title] => 'Printed wiring board'
[patent_app_type] => utility
[patent_app_number] => 15/371212
[patent_app_country] => US
[patent_app_date] => 2016-12-07
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/371212 | Printed wiring board | Dec 6, 2016 | Issued |
Array
(
[id] => 13656689
[patent_doc_number] => 09854678
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-12-26
[patent_title] => Electronic device including cable supporting structure
[patent_app_type] => utility
[patent_app_number] => 15/366595
[patent_app_country] => US
[patent_app_date] => 2016-12-01
[patent_effective_date] => 0000-00-00
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/366595 | Electronic device including cable supporting structure | Nov 30, 2016 | Issued |
Array
(
[id] => 11502860
[patent_doc_number] => 20170077045
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-03-16
[patent_title] => 'SEMICONDUCTOR STRUCTURE'
[patent_app_type] => utility
[patent_app_number] => 15/364185
[patent_app_country] => US
[patent_app_date] => 2016-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15364185
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/364185 | Semiconductor structure | Nov 28, 2016 | Issued |
Array
(
[id] => 11753428
[patent_doc_number] => 09711446
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2017-07-18
[patent_title] => 'Resin composition'
[patent_app_type] => utility
[patent_app_number] => 15/363166
[patent_app_country] => US
[patent_app_date] => 2016-11-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15363166
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/363166 | Resin composition | Nov 28, 2016 | Issued |
Array
(
[id] => 12759649
[patent_doc_number] => 20180145051
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => PACKAGE-BOTTOM THROUGH-MOLD VIA INTERPOSERS FOR LAND-SIDE CONFIGURED DEVICES FOR SYSTEM-IN-PACKAGE APPARATUS
[patent_app_type] => utility
[patent_app_number] => 15/357233
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15357233
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/357233 | Package-bottom through-mold via interposers for land-side configured devices for system-in-package apparatus | Nov 20, 2016 | Issued |
Array
(
[id] => 11696244
[patent_doc_number] => 20170171961
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-06-15
[patent_title] => 'BOARD LEVEL SHIELDS INCLUDING FOIL AND/OR FILM COVERS'
[patent_app_type] => utility
[patent_app_number] => 15/357001
[patent_app_country] => US
[patent_app_date] => 2016-11-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 9854
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15357001
[rel_patent_id] =>[rel_patent_doc_number] =>) 15/357001 | Board level shields including foil and/or film covers | Nov 20, 2016 | Issued |
Array
(
[id] => 11617364
[patent_doc_number] => 09655244
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2017-05-16
[patent_title] => 'Flexible electronic device and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 15/356522
[patent_app_country] => US
[patent_app_date] => 2016-11-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/356522 | Flexible electronic device and method for manufacturing the same | Nov 17, 2016 | Issued |
Array
(
[id] => 11947403
[patent_doc_number] => 20170251554
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2017-08-31
[patent_title] => 'PRINTED BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE'
[patent_app_type] => utility
[patent_app_number] => 15/355559
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/355559 | Printed board, electronic device, and method for manufacturing electronic device | Nov 17, 2016 | Issued |
Array
(
[id] => 13570863
[patent_doc_number] => 20180336979
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2018-11-22
[patent_title] => WIRE HARNESS
[patent_app_type] => utility
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[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/778675 | Wire harness | Nov 17, 2016 | Issued |
Array
(
[id] => 12759547
[patent_doc_number] => 20180145017
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[patent_kind] => A1
[patent_issue_date] => 2018-05-24
[patent_title] => SEMICONDUCTOR SUBSTRATE INCLUDING EMBEDDED COMPONENT AND METHOD OF MANUFACTURING THE SAME
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/356407 | Semiconductor substrate including embedded component and method of manufacturing the same | Nov 17, 2016 | Issued |
Array
(
[id] => 16337908
[patent_doc_number] => 10788862
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2020-09-29
[patent_title] => Flexible display device and unfolding detection method thereof
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Array
(
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[patent_title] => 'ELECTRONIC DEVICE HAVING WATERPROOF STRUCTURE'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/344485 | Electronic device having waterproof structure | Nov 3, 2016 | Issued |
Array
(
[id] => 11934257
[patent_doc_number] => 09801273
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[patent_kind] => B2
[patent_issue_date] => 2017-10-24
[patent_title] => 'Multilayer structure and related method of manufacture for electronics'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 15/343731 | Multilayer structure and related method of manufacture for electronics | Nov 3, 2016 | Issued |
Array
(
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[patent_title] => 'THREE-DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION BACKGROUND'
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Array
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Array
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