Andrew J Oyer
Examiner (ID: 2471, Phone: (571)270-0347 , Office: P/1767 )
Most Active Art Unit | 1767 |
Art Unit(s) | 1767 |
Total Applications | 638 |
Issued Applications | 430 |
Pending Applications | 78 |
Abandoned Applications | 130 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 1280741
[patent_doc_number] => 06642064
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-11-04
[patent_title] => 'Method of making a high density programmable logic device in a multichip module package'
[patent_app_type] => B1
[patent_app_number] => 08/810567
[patent_app_country] => US
[patent_app_date] => 1997-03-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => patents/06/642/06642064.pdf
[firstpage_image] =>[orig_patent_app_number] => 08810567
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810567 | Method of making a high density programmable logic device in a multichip module package | Mar 2, 1997 | Issued |
Array
(
[id] => 4003034
[patent_doc_number] => 06004866
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-12-21
[patent_title] => 'Method for manufacturing bonded wafer and bonded wafer manufactured thereby'
[patent_app_type] => 1
[patent_app_number] => 8/808655
[patent_app_country] => US
[patent_app_date] => 1997-02-28
[patent_effective_date] => 0000-00-00
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[patent_maintenance] => 1
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[pdf_file] => patents/06/004/06004866.pdf
[firstpage_image] =>[orig_patent_app_number] => 808655
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808655 | Method for manufacturing bonded wafer and bonded wafer manufactured thereby | Feb 27, 1997 | Issued |
Array
(
[id] => 3836846
[patent_doc_number] => 05846878
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Method of manufacturing a wiring layer in a semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/808529
[patent_app_country] => US
[patent_app_date] => 1997-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[pdf_file] => patents/05/846/05846878.pdf
[firstpage_image] =>[orig_patent_app_number] => 808529
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808529 | Method of manufacturing a wiring layer in a semiconductor device | Feb 27, 1997 | Issued |
Array
(
[id] => 3824240
[patent_doc_number] => 05731214
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-03-24
[patent_title] => 'Manufacture of semiconductor device with self-aligned doping'
[patent_app_type] => 1
[patent_app_number] => 8/808241
[patent_app_country] => US
[patent_app_date] => 1997-02-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 4243
[patent_no_of_claims] => 8
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/05/731/05731214.pdf
[firstpage_image] =>[orig_patent_app_number] => 808241
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808241 | Manufacture of semiconductor device with self-aligned doping | Feb 27, 1997 | Issued |
Array
(
[id] => 4055878
[patent_doc_number] => 05969381
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-10-19
[patent_title] => 'Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof'
[patent_app_type] => 1
[patent_app_number] => 8/805973
[patent_app_country] => US
[patent_app_date] => 1997-02-26
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[pdf_file] => patents/05/969/05969381.pdf
[firstpage_image] =>[orig_patent_app_number] => 805973
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/805973 | Semiconductor device with unbreakable testing elements for evaluating components and process of fabrication thereof | Feb 25, 1997 | Issued |
Array
(
[id] => 3925712
[patent_doc_number] => 05877036
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-02
[patent_title] => 'Overlay measuring method using correlation function'
[patent_app_type] => 1
[patent_app_number] => 8/806983
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[pdf_file] => patents/05/877/05877036.pdf
[firstpage_image] =>[orig_patent_app_number] => 806983
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/806983 | Overlay measuring method using correlation function | Feb 25, 1997 | Issued |
Array
(
[id] => 3892266
[patent_doc_number] => 05894161
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-13
[patent_title] => 'Interconnect with pressure sensing mechanism for testing semiconductor wafers'
[patent_app_type] => 1
[patent_app_number] => 8/805126
[patent_app_country] => US
[patent_app_date] => 1997-02-24
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[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/894/05894161.pdf
[firstpage_image] =>[orig_patent_app_number] => 805126
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/805126 | Interconnect with pressure sensing mechanism for testing semiconductor wafers | Feb 23, 1997 | Issued |
Array
(
[id] => 3890858
[patent_doc_number] => 05894065
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-04-13
[patent_title] => 'Method for improving the intermediate dielectric profile, particularly for non-volatile memories'
[patent_app_type] => 1
[patent_app_number] => 8/802619
[patent_app_country] => US
[patent_app_date] => 1997-02-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => patents/05/894/05894065.pdf
[firstpage_image] =>[orig_patent_app_number] => 802619
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/802619 | Method for improving the intermediate dielectric profile, particularly for non-volatile memories | Feb 18, 1997 | Issued |
Array
(
[id] => 3966954
[patent_doc_number] => 05956585
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-09-21
[patent_title] => 'Method of forming a self-aligned damage-free buried contact'
[patent_app_type] => 1
[patent_app_number] => 8/803035
[patent_app_country] => US
[patent_app_date] => 1997-02-19
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/05/956/05956585.pdf
[firstpage_image] =>[orig_patent_app_number] => 803035
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/803035 | Method of forming a self-aligned damage-free buried contact | Feb 18, 1997 | Issued |
Array
(
[id] => 3858461
[patent_doc_number] => 05792674
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-08-11
[patent_title] => 'Method of making a tapered thickness waveguide intergrated semiconductor laser'
[patent_app_type] => 1
[patent_app_number] => 8/799931
[patent_app_country] => US
[patent_app_date] => 1997-02-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/05/792/05792674.pdf
[firstpage_image] =>[orig_patent_app_number] => 799931
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/799931 | Method of making a tapered thickness waveguide intergrated semiconductor laser | Feb 12, 1997 | Issued |
Array
(
[id] => 3836394
[patent_doc_number] => 05846848
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity'
[patent_app_type] => 1
[patent_app_number] => 8/796351
[patent_app_country] => US
[patent_app_date] => 1997-02-07
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[pdf_file] => patents/05/846/05846848.pdf
[firstpage_image] =>[orig_patent_app_number] => 796351
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/796351 | Polysilicon electromigration sensor which can detect and monitor electromigration in composite metal lines on integrated circuit structures with improved sensitivity | Feb 6, 1997 | Issued |
Array
(
[id] => 4113670
[patent_doc_number] => 06046069
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-04-04
[patent_title] => 'Solid-state image pick-up device and method for manufacturing the same'
[patent_app_type] => 1
[patent_app_number] => 8/796887
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[patent_app_date] => 1997-02-05
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[pdf_file] => patents/06/046/06046069.pdf
[firstpage_image] =>[orig_patent_app_number] => 796887
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/796887 | Solid-state image pick-up device and method for manufacturing the same | Feb 4, 1997 | Issued |
Array
(
[id] => 4019563
[patent_doc_number] => 05880482
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-03-09
[patent_title] => 'Low dark current photodetector'
[patent_app_type] => 1
[patent_app_number] => 8/790653
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 790653
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/790653 | Low dark current photodetector | Jan 28, 1997 | Issued |
Array
(
[id] => 4029238
[patent_doc_number] => 05994171
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[patent_kind] => NA
[patent_issue_date] => 1999-11-30
[patent_title] => 'Method of making lateral components in power semiconductor devices'
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[patent_app_number] => 8/787741
[patent_app_country] => US
[patent_app_date] => 1997-01-24
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[pdf_file] => patents/05/994/05994171.pdf
[firstpage_image] =>[orig_patent_app_number] => 787741
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/787741 | Method of making lateral components in power semiconductor devices | Jan 23, 1997 | Issued |
Array
(
[id] => 3867842
[patent_doc_number] => 05837601
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-11-17
[patent_title] => 'CMOS semiconductor device having dual-gate electrode construction and method of production of the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/788191 | CMOS semiconductor device having dual-gate electrode construction and method of production of the same | Jan 23, 1997 | Issued |
Array
(
[id] => 3825621
[patent_doc_number] => 05783472
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-07-21
[patent_title] => 'Method of making an SOI transistor'
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[patent_app_number] => 8/787797
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/787797 | Method of making an SOI transistor | Jan 22, 1997 | Issued |
Array
(
[id] => 3740635
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/786879 | Method of making an SOI transistor | Jan 22, 1997 | Issued |
Array
(
[id] => 3838935
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/788107 | Method of forming electrode of semiconductor device | Jan 22, 1997 | Issued |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/784290 | Method for fabricating a semiconductor device | Jan 15, 1997 | Issued |
Array
(
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[pdf_file] => patents/05/843/05843799.pdf
[firstpage_image] =>[orig_patent_app_number] => 782135
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/782135 | Circuit module redundancy architecture process | Jan 12, 1997 | Issued |