Angela Y Ortiz
Examiner (ID: 9995)
Most Active Art Unit | 1732 |
Art Unit(s) | 1789, 1307, 2899, 1732, 3663, 1798, 1797 |
Total Applications | 1089 |
Issued Applications | 798 |
Pending Applications | 57 |
Abandoned Applications | 203 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
09/014885 | METHOD FOR REDUCING VIA INDUCTANCE IN AN ELECTRONIC ASSEMBLY AND ARTICLE | Jan 27, 1998 | Issued |
Array
(
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[patent_issue_date] => 1999-01-26
[patent_title] => 'Low-crosstalk modular electrical connector assembly'
[patent_app_type] => 1
[patent_app_number] => 8/970233
[patent_app_country] => US
[patent_app_date] => 1997-11-14
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[firstpage_image] =>[orig_patent_app_number] => 970233
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/970233 | Low-crosstalk modular electrical connector assembly | Nov 13, 1997 | Issued |
Array
(
[id] => 3764890
[patent_doc_number] => 05844166
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[patent_kind] => NA
[patent_issue_date] => 1998-12-01
[patent_title] => 'Lattice RF shield'
[patent_app_type] => 1
[patent_app_number] => 8/907290
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Array
(
[id] => 3786477
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[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Semiconductor die carrier having a dielectric epoxy between adjacent leads'
[patent_app_type] => 1
[patent_app_number] => 8/902032
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[patent_app_date] => 1997-07-29
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/902032 | Semiconductor die carrier having a dielectric epoxy between adjacent leads | Jul 28, 1997 | Issued |
Array
(
[id] => 3988647
[patent_doc_number] => 05959256
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[patent_kind] => NA
[patent_issue_date] => 1999-09-28
[patent_title] => 'Multilayer printed wiring board'
[patent_app_type] => 1
[patent_app_number] => 8/889976
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[patent_app_date] => 1997-07-10
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Array
(
[id] => 3894390
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[patent_kind] => NA
[patent_issue_date] => 1998-11-10
[patent_title] => 'Pattern structure of flexible printed circuit board'
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Array
(
[id] => 3797726
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[patent_issue_date] => 1998-07-14
[patent_title] => 'Multilayer circuit board unit'
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[patent_app_number] => 8/866315
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/866315 | Multilayer circuit board unit | May 29, 1997 | Issued |
Array
(
[id] => 3864356
[patent_doc_number] => 05796049
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[patent_kind] => NA
[patent_issue_date] => 1998-08-18
[patent_title] => 'Electronics mounting plate with heat exchanger and method for manufacturing same'
[patent_app_type] => 1
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[firstpage_image] =>[orig_patent_app_number] => 832998
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/832998 | Electronics mounting plate with heat exchanger and method for manufacturing same | Apr 3, 1997 | Issued |
Array
(
[id] => 4040985
[patent_doc_number] => 05856636
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1999-01-05
[patent_title] => 'Electronic circuit prototype wiring board with visually distinctive contact pads'
[patent_app_type] => 1
[patent_app_number] => 8/810356
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/810356 | Electronic circuit prototype wiring board with visually distinctive contact pads | Mar 2, 1997 | Issued |
Array
(
[id] => 3843489
[patent_doc_number] => 05847326
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-12-08
[patent_title] => 'Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability'
[patent_app_type] => 1
[patent_app_number] => 8/808019
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[firstpage_image] =>[orig_patent_app_number] => 808019
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/808019 | Low-temperature fired ceramic circuit substrate with improved Ag-Au connection reliability | Mar 2, 1997 | Issued |
Array
(
[id] => 3902009
[patent_doc_number] => 05750923
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-05-12
[patent_title] => 'Electric shielding metal shell receptacle having movable binding strips'
[patent_app_type] => 1
[patent_app_number] => 8/792756
[patent_app_country] => US
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[pdf_file] => patents/05/750/05750923.pdf
[firstpage_image] =>[orig_patent_app_number] => 792756
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/792756 | Electric shielding metal shell receptacle having movable binding strips | Feb 3, 1997 | Issued |
Array
(
[id] => 3786448
[patent_doc_number] => 05821455
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1998-10-13
[patent_title] => 'Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid'
[patent_app_type] => 1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/790577 | Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid | Jan 28, 1997 | Issued |
Array
(
[id] => 3797663
[patent_doc_number] => 05780772
[patent_country] => US
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[patent_issue_date] => 1998-07-14
[patent_title] => 'Solution to mold wire sweep in fine pitch devices'
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[firstpage_image] =>[orig_patent_app_number] => 788546
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/788546 | Solution to mold wire sweep in fine pitch devices | Jan 23, 1997 | Issued |
Array
(
[id] => 3743881
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[patent_issue_date] => 1998-05-19
[patent_title] => 'Charge coupled device (CCD) semiconductor chip package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/785017 | Charge coupled device (CCD) semiconductor chip package | Jan 16, 1997 | Issued |
Array
(
[id] => 3796239
[patent_doc_number] => 05726391
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[patent_title] => 'Thermosetting Encapsulants for electronics packaging'
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[firstpage_image] =>[orig_patent_app_number] => 768056
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/768056 | Thermosetting Encapsulants for electronics packaging | Dec 15, 1996 | Issued |
Array
(
[id] => 3819403
[patent_doc_number] => 05789704
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[patent_kind] => NA
[patent_issue_date] => 1998-08-04
[patent_title] => 'Container with heat removing features for containing an electronic contol unit'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/753956 | Container with heat removing features for containing an electronic contol unit | Dec 2, 1996 | Issued |
Array
(
[id] => 3843503
[patent_doc_number] => 05847327
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[patent_title] => 'Dimensionally stable core for use in high density chip packages'
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[pdf_file] => patents/05/847/05847327.pdf
[firstpage_image] =>[orig_patent_app_number] => 747169
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/747169 | Dimensionally stable core for use in high density chip packages | Nov 7, 1996 | Issued |
Array
(
[id] => 3855935
[patent_doc_number] => 05767446
[patent_country] => US
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[patent_issue_date] => 1998-06-16
[patent_title] => 'Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/736107 | Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package | Oct 23, 1996 | Issued |
Array
(
[id] => 3881456
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/717048 | Electronic control module having fluid-tight seals of a polymer material which expands when wet | Sep 19, 1996 | Issued |