Search

Anthony L. Bacon

Examiner (ID: 13838, Phone: (571)270-5623 , Office: P/3747 )

Most Active Art Unit
3747
Art Unit(s)
4159, 3747
Total Applications
545
Issued Applications
419
Pending Applications
0
Abandoned Applications
131

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 11404821 [patent_doc_number] => 20170025359 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-01-26 [patent_title] => 'Fan-out POP Structure with Inconsecutive Polymer Layer' [patent_app_type] => utility [patent_app_number] => 15/284003 [patent_app_country] => US [patent_app_date] => 2016-10-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 4658 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15284003 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/284003
Fan-out POP structure with inconsecutive polymer layer Oct 2, 2016 Issued
Array ( [id] => 16566808 [patent_doc_number] => 10892184 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-01-12 [patent_title] => Photobucket floor colors with selective grafting [patent_app_type] => utility [patent_app_number] => 16/317015 [patent_app_country] => US [patent_app_date] => 2016-09-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 30 [patent_no_of_words] => 12038 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 148 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16317015 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/317015
Photobucket floor colors with selective grafting Sep 29, 2016 Issued
Array ( [id] => 14904355 [patent_doc_number] => 20190295943 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-09-26 [patent_title] => PREFORMED INTERLAYER CONNECTIONS FOR INTEGRATED CIRCUIT DEVICES [patent_app_type] => utility [patent_app_number] => 16/316528 [patent_app_country] => US [patent_app_date] => 2016-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12080 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16316528 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/316528
Preformed interlayer connections for integrated circuit devices Sep 25, 2016 Issued
Array ( [id] => 11385923 [patent_doc_number] => 20170011978 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-01-12 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/269633 [patent_app_country] => US [patent_app_date] => 2016-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 36 [patent_no_of_words] => 16319 [patent_no_of_claims] => 38 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15269633 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/269633
Semiconductor device Sep 18, 2016 Issued
Array ( [id] => 11353696 [patent_doc_number] => 20160372436 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-12-22 [patent_title] => 'Concentric Bump Design for the Alignment in Die Stacking' [patent_app_type] => utility [patent_app_number] => 15/255963 [patent_app_country] => US [patent_app_date] => 2016-09-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 4507 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15255963 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/255963
Concentric bump design for the alignment in die stacking Sep 1, 2016 Issued
Array ( [id] => 11571738 [patent_doc_number] => 20170110382 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-04-20 [patent_title] => 'SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR MODULE' [patent_app_type] => utility [patent_app_number] => 15/245243 [patent_app_country] => US [patent_app_date] => 2016-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 11263 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15245243 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/245243
Semiconductor package, method of fabricating the same, and semiconductor module Aug 23, 2016 Issued
Array ( [id] => 11753424 [patent_doc_number] => 09711442 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-07-18 [patent_title] => 'Semiconductor structure' [patent_app_type] => utility [patent_app_number] => 15/245200 [patent_app_country] => US [patent_app_date] => 2016-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 13 [patent_no_of_words] => 4058 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15245200 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/245200
Semiconductor structure Aug 23, 2016 Issued
Array ( [id] => 11918395 [patent_doc_number] => 09786586 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-10 [patent_title] => 'Semiconductor package and fabrication method thereof' [patent_app_type] => utility [patent_app_number] => 15/242594 [patent_app_country] => US [patent_app_date] => 2016-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 16 [patent_no_of_words] => 2412 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 136 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15242594 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/242594
Semiconductor package and fabrication method thereof Aug 20, 2016 Issued
Array ( [id] => 14968989 [patent_doc_number] => 20190311973 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-10-10 [patent_title] => SYSTEMS AND METHODS FOR IMPROVED THROUGH-SILICON-VIAS [patent_app_type] => utility [patent_app_number] => 16/316504 [patent_app_country] => US [patent_app_date] => 2016-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5090 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16316504 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/316504
Systems and methods for improved through-silicon-vias Aug 17, 2016 Issued
Array ( [id] => 12040429 [patent_doc_number] => 09818664 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-11-14 [patent_title] => 'Electronic device comprising an encapsulating block locally of smaller thickness' [patent_app_type] => utility [patent_app_number] => 15/240482 [patent_app_country] => US [patent_app_date] => 2016-08-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2774 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15240482 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/240482
Electronic device comprising an encapsulating block locally of smaller thickness Aug 17, 2016 Issued
Array ( [id] => 15108875 [patent_doc_number] => 10475769 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-11-12 [patent_title] => Semiconductor package and manufacturing method of the same [patent_app_type] => utility [patent_app_number] => 15/239295 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 22 [patent_figures_cnt] => 22 [patent_no_of_words] => 6151 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 65 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239295 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239295
Semiconductor package and manufacturing method of the same Aug 16, 2016 Issued
Array ( [id] => 12014536 [patent_doc_number] => 09807882 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-31 [patent_title] => 'Density-optimized module-level inductor ground structure' [patent_app_type] => utility [patent_app_number] => 15/239751 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 11 [patent_no_of_words] => 7984 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 56 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239751 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239751
Density-optimized module-level inductor ground structure Aug 16, 2016 Issued
Array ( [id] => 11517551 [patent_doc_number] => 20170084626 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2017-03-23 [patent_title] => 'THREE-DIMENSIONAL SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/239434 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 26 [patent_figures_cnt] => 26 [patent_no_of_words] => 14359 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239434 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239434
Three-dimensional semiconductor device Aug 16, 2016 Issued
Array ( [id] => 12208557 [patent_doc_number] => 20180053784 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-02-22 [patent_title] => 'SYSTEM ON CHIP FULLY-DEPLETED SILICON ON INSULATOR WITH RF AND MM-WAVE INTEGRATED FUNCTIONS' [patent_app_type] => utility [patent_app_number] => 15/239230 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 4719 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239230 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239230
System on chip fully-depleted silicon on insulator with rf and mm-wave integrated functions Aug 16, 2016 Issued
Array ( [id] => 11904301 [patent_doc_number] => 09773741 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-09-26 [patent_title] => 'Bondable device including a hydrophilic layer' [patent_app_type] => utility [patent_app_number] => 15/239588 [patent_app_country] => US [patent_app_date] => 2016-08-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 11 [patent_no_of_words] => 11744 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 55 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15239588 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/239588
Bondable device including a hydrophilic layer Aug 16, 2016 Issued
Array ( [id] => 12047375 [patent_doc_number] => 09824983 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-11-21 [patent_title] => 'Chip carrier, a device and a method' [patent_app_type] => utility [patent_app_number] => 15/232815 [patent_app_country] => US [patent_app_date] => 2016-08-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 41 [patent_no_of_words] => 21519 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15232815 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/232815
Chip carrier, a device and a method Aug 9, 2016 Issued
Array ( [id] => 11753426 [patent_doc_number] => 09711444 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-18 [patent_title] => 'Packaging module and substrate structure thereof' [patent_app_type] => utility [patent_app_number] => 15/231931 [patent_app_country] => US [patent_app_date] => 2016-08-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 3406 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15231931 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/231931
Packaging module and substrate structure thereof Aug 8, 2016 Issued
Array ( [id] => 11293746 [patent_doc_number] => 20160343678 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-11-24 [patent_title] => 'SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 15/231030 [patent_app_country] => US [patent_app_date] => 2016-08-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 7313 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15231030 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/231030
Semiconductor device Aug 7, 2016 Issued
Array ( [id] => 11928740 [patent_doc_number] => 09795718 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2017-10-24 [patent_title] => 'Biocompatible devices with dissolvable substrates and methods of forming the same' [patent_app_type] => utility [patent_app_number] => 15/229497 [patent_app_country] => US [patent_app_date] => 2016-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5901 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 30 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15229497 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/229497
Biocompatible devices with dissolvable substrates and methods of forming the same Aug 4, 2016 Issued
Array ( [id] => 11725230 [patent_doc_number] => 09698094 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-07-04 [patent_title] => 'Wiring board and electronic component device' [patent_app_type] => utility [patent_app_number] => 15/228059 [patent_app_country] => US [patent_app_date] => 2016-08-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 27 [patent_figures_cnt] => 41 [patent_no_of_words] => 10275 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15228059 [rel_patent_id] =>[rel_patent_doc_number] =>)
15/228059
Wiring board and electronic component device Aug 3, 2016 Issued
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