
Awat M. Salih
Examiner (ID: 18788, Phone: (571)270-5601 , Office: P/2845 )
| Most Active Art Unit | 2845 |
| Art Unit(s) | 2845 |
| Total Applications | 569 |
| Issued Applications | 470 |
| Pending Applications | 50 |
| Abandoned Applications | 69 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5145608
[patent_doc_number] => 20070045662
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'SUBSTRATE FOR FILM GROWTH OF GROUP III NITRIDES, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/467319
[patent_app_country] => US
[patent_app_date] => 2006-08-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 7152
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0045/20070045662.pdf
[firstpage_image] =>[orig_patent_app_number] => 11467319
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/467319 | SUBSTRATE FOR FILM GROWTH OF GROUP III NITRIDES, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE USING THE SAME | Aug 24, 2006 | Abandoned |
Array
(
[id] => 4768764
[patent_doc_number] => 20080054420
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE'
[patent_app_type] => utility
[patent_app_number] => 11/466539
[patent_app_country] => US
[patent_app_date] => 2006-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2125
[patent_no_of_claims] => 21
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[pdf_file] => publications/A1/0054/20080054420.pdf
[firstpage_image] =>[orig_patent_app_number] => 11466539
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466539 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE | Aug 22, 2006 | Abandoned |
Array
(
[id] => 4768765
[patent_doc_number] => 20080054421
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-03-06
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERLOCK'
[patent_app_type] => utility
[patent_app_number] => 11/466748
[patent_app_country] => US
[patent_app_date] => 2006-08-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[pdf_file] => publications/A1/0054/20080054421.pdf
[firstpage_image] =>[orig_patent_app_number] => 11466748
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466748 | Integrated circuit package system with interlock | Aug 22, 2006 | Issued |
Array
(
[id] => 9184434
[patent_doc_number] => 08624372
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-01-07
[patent_title] => 'Semiconductor component comprising an interposer substrate'
[patent_app_type] => utility
[patent_app_number] => 11/466279
[patent_app_country] => US
[patent_app_date] => 2006-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 6954
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466279 | Semiconductor component comprising an interposer substrate | Aug 21, 2006 | Issued |
Array
(
[id] => 143047
[patent_doc_number] => 07692210
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-06
[patent_title] => 'Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same'
[patent_app_type] => utility
[patent_app_number] => 11/466309
[patent_app_country] => US
[patent_app_date] => 2006-08-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4682
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/692/07692210.pdf
[firstpage_image] =>[orig_patent_app_number] => 11466309
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466309 | Intermeshed guard bands for multiple voltage supply structures on an integrated circuit, and methods of making same | Aug 21, 2006 | Issued |
Array
(
[id] => 5145629
[patent_doc_number] => 20070045683
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'LIGHT REFLECTIVITY CONTROLLED PHOTODIODE CELL, AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/465898
[patent_app_country] => US
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[pdf_file] => publications/A1/0045/20070045683.pdf
[firstpage_image] =>[orig_patent_app_number] => 11465898
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/465898 | LIGHT REFLECTIVITY CONTROLLED PHOTODIODE CELL, AND METHOD OF MANUFACTURING THE SAME | Aug 20, 2006 | Abandoned |
Array
(
[id] => 229200
[patent_doc_number] => 07602015
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-10-13
[patent_title] => 'Process to control semiconductor wafer yield'
[patent_app_type] => utility
[patent_app_number] => 11/464619
[patent_app_country] => US
[patent_app_date] => 2006-08-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 1
[patent_figures_cnt] => 3
[patent_no_of_words] => 1441
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[pdf_file] => patents/07/602/07602015.pdf
[firstpage_image] =>[orig_patent_app_number] => 11464619
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/464619 | Process to control semiconductor wafer yield | Aug 14, 2006 | Issued |
Array
(
[id] => 4997613
[patent_doc_number] => 20070040247
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-22
[patent_title] => 'Leadframe package with dual lead configurations'
[patent_app_type] => utility
[patent_app_number] => 11/503269
[patent_app_country] => US
[patent_app_date] => 2006-08-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 13
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[patent_no_of_words] => 6088
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[pdf_file] => publications/A1/0040/20070040247.pdf
[firstpage_image] =>[orig_patent_app_number] => 11503269
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/503269 | Leadframe package with dual lead configurations | Aug 13, 2006 | Abandoned |
Array
(
[id] => 1076898
[patent_doc_number] => 07615410
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-11-10
[patent_title] => 'Chip-sized flip-chip semiconductor package and method for making the same'
[patent_app_type] => utility
[patent_app_number] => 11/456978
[patent_app_country] => US
[patent_app_date] => 2006-07-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/615/07615410.pdf
[firstpage_image] =>[orig_patent_app_number] => 11456978
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/456978 | Chip-sized flip-chip semiconductor package and method for making the same | Jul 11, 2006 | Issued |
Array
(
[id] => 5622870
[patent_doc_number] => 20060261375
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-23
[patent_title] => 'Power Semiconductor Component with Plate Capacitor Structure'
[patent_app_type] => utility
[patent_app_number] => 11/382838
[patent_app_country] => US
[patent_app_date] => 2006-05-11
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11382838
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/382838 | Power semiconductor component with plate capacitor structure | May 10, 2006 | Issued |
Array
(
[id] => 5082880
[patent_doc_number] => 20070272931
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-29
[patent_title] => 'Methods, devices and systems producing illumination and effects'
[patent_app_type] => utility
[patent_app_number] => 11/418089
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/418089 | Methods, devices and systems producing illumination and effects | May 4, 2006 | Abandoned |
Array
(
[id] => 5730327
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[patent_title] => 'Physical quantity sensor device'
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[firstpage_image] =>[orig_patent_app_number] => 11417109
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/417109 | Physical quantity sensor device | May 3, 2006 | Abandoned |
Array
(
[id] => 5031688
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[patent_title] => 'Wafer level package for surface acoustic wave device and fabrication method thereof'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/415099 | Wafer level package for surface acoustic wave device and fabrication method thereof | May 1, 2006 | Issued |
Array
(
[id] => 5054390
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[patent_title] => 'Conventionally printable non-volatile passive memory element and method of making thereof'
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/308658 | STRUCTURE AND PROCESS OF CHIP PACKAGE | Apr 18, 2006 | Abandoned |
Array
(
[id] => 4526451
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[patent_issue_date] => 2011-05-31
[patent_title] => 'Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/401338 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus | Apr 9, 2006 | Issued |
Array
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Array
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/394818 | Integration scheme for semiconductor photodetectors on an integrated circuit chip | Mar 30, 2006 | Abandoned |
Array
(
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