
Awat M. Salih
Examiner (ID: 18788, Phone: (571)270-5601 , Office: P/2845 )
| Most Active Art Unit | 2845 |
| Art Unit(s) | 2845 |
| Total Applications | 569 |
| Issued Applications | 470 |
| Pending Applications | 50 |
| Abandoned Applications | 69 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5123514
[patent_doc_number] => 20070235784
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'Three-terminal cascade switch for controlling static power consumption in integrated circuits'
[patent_app_type] => utility
[patent_app_number] => 11/393259
[patent_app_country] => US
[patent_app_date] => 2006-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 5162
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0235/20070235784.pdf
[firstpage_image] =>[orig_patent_app_number] => 11393259
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/393259 | Three-terminal cascade switch for controlling static power consumption in integrated circuits | Mar 29, 2006 | Issued |
Array
(
[id] => 5123589
[patent_doc_number] => 20070235859
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEATSPREADER'
[patent_app_type] => utility
[patent_app_number] => 11/278008
[patent_app_country] => US
[patent_app_date] => 2006-03-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0235/20070235859.pdf
[firstpage_image] =>[orig_patent_app_number] => 11278008
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/278008 | Integrated circuit package system with heatspreader | Mar 29, 2006 | Issued |
Array
(
[id] => 5599617
[patent_doc_number] => 20060289962
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-28
[patent_title] => 'AN ISOLATION REGION FOR USE IN A SEMICONDUCTOR DEVICE'
[patent_app_type] => utility
[patent_app_number] => 11/277909
[patent_app_country] => US
[patent_app_date] => 2006-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0289/20060289962.pdf
[firstpage_image] =>[orig_patent_app_number] => 11277909
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/277909 | AN ISOLATION REGION FOR USE IN A SEMICONDUCTOR DEVICE | Mar 28, 2006 | Abandoned |
Array
(
[id] => 5730237
[patent_doc_number] => 20060255351
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-11-16
[patent_title] => 'Metal oxide semiconductor films, structures and methods'
[patent_app_type] => utility
[patent_app_number] => 11/394382
[patent_app_country] => US
[patent_app_date] => 2006-03-29
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[patent_no_of_words] => 6646
[patent_no_of_claims] => 40
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0255/20060255351.pdf
[firstpage_image] =>[orig_patent_app_number] => 11394382
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/394382 | Metal oxide semiconductor films, structures and methods | Mar 28, 2006 | Abandoned |
Array
(
[id] => 7535711
[patent_doc_number] => 08049340
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-11-01
[patent_title] => 'Device for avoiding parasitic capacitance in an integrated circuit package'
[patent_app_type] => utility
[patent_app_number] => 11/277188
[patent_app_country] => US
[patent_app_date] => 2006-03-22
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/08/049/08049340.pdf
[firstpage_image] =>[orig_patent_app_number] => 11277188
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/277188 | Device for avoiding parasitic capacitance in an integrated circuit package | Mar 21, 2006 | Issued |
Array
(
[id] => 5751091
[patent_doc_number] => 20060220240
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-10-05
[patent_title] => 'Analytic structure for failure analysis of semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/374579
[patent_app_country] => US
[patent_app_date] => 2006-03-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 26
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[pdf_file] => publications/A1/0220/20060220240.pdf
[firstpage_image] =>[orig_patent_app_number] => 11374579
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/374579 | Analytic structure for failure analysis of semiconductor device | Mar 12, 2006 | Abandoned |
Array
(
[id] => 247385
[patent_doc_number] => 07586139
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-08
[patent_title] => 'Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor'
[patent_app_type] => utility
[patent_app_number] => 11/276218
[patent_app_country] => US
[patent_app_date] => 2006-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
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[patent_no_of_words] => 2963
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/586/07586139.pdf
[firstpage_image] =>[orig_patent_app_number] => 11276218
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/276218 | Photo-sensor and pixel array with backside illumination and method of forming the photo-sensor | Feb 16, 2006 | Issued |
Array
(
[id] => 5175213
[patent_doc_number] => 20070176271
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-02
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS'
[patent_app_type] => utility
[patent_app_number] => 11/307349
[patent_app_country] => US
[patent_app_date] => 2006-02-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0176/20070176271.pdf
[firstpage_image] =>[orig_patent_app_number] => 11307349
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307349 | INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS | Jan 31, 2006 | Abandoned |
Array
(
[id] => 5157515
[patent_doc_number] => 20070170559
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'INTEGRATED CIRCUIT PACKAGE SYSTEM'
[patent_app_type] => utility
[patent_app_number] => 11/307128
[patent_app_country] => US
[patent_app_date] => 2006-01-24
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[firstpage_image] =>[orig_patent_app_number] => 11307128
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307128 | Integrated circuit package system | Jan 23, 2006 | Issued |
Array
(
[id] => 9414257
[patent_doc_number] => 08698294
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2014-04-15
[patent_title] => 'Integrated circuit package system including wide flange leadframe'
[patent_app_type] => utility
[patent_app_number] => 11/307129
[patent_app_country] => US
[patent_app_date] => 2006-01-24
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/307129 | Integrated circuit package system including wide flange leadframe | Jan 23, 2006 | Issued |
Array
(
[id] => 5157468
[patent_doc_number] => 20070170512
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHOD OF FABRICATING SAME'
[patent_app_type] => utility
[patent_app_number] => 11/275638
[patent_app_country] => US
[patent_app_date] => 2006-01-20
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[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0170/20070170512.pdf
[firstpage_image] =>[orig_patent_app_number] => 11275638
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/275638 | Electrostatic discharge protection device and method of fabricating same | Jan 19, 2006 | Issued |
Array
(
[id] => 918360
[patent_doc_number] => 07323774
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[patent_title] => 'Integrated circuit package system with pedestal structure'
[patent_app_type] => utility
[patent_app_number] => 11/306808
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11306808
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306808 | Integrated circuit package system with pedestal structure | Jan 10, 2006 | Issued |
Array
(
[id] => 5654191
[patent_doc_number] => 20060139926
[patent_country] => US
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[patent_title] => 'Light-emitting device, and illumination apparatus and display apparatus using the light-emitting device'
[patent_app_type] => utility
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/316978 | Light-emitting device, and illumination apparatus and display apparatus using the light-emitting device | Dec 26, 2005 | Issued |
Array
(
[id] => 5863252
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[patent_title] => 'High frequency module'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/313808 | High frequency module | Dec 21, 2005 | Abandoned |
Array
(
[id] => 5645926
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[patent_title] => 'MOS device, CMOS device, and fabricating method thereof'
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Array
(
[id] => 5832285
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[patent_title] => 'Chip package structure and method for manufacturing the same'
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Array
(
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[patent_title] => 'Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink'
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Array
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Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306099 | PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF | Dec 15, 2005 | Abandoned |