
Awat M. Salih
Examiner (ID: 18788, Phone: (571)270-5601 , Office: P/2845 )
| Most Active Art Unit | 2845 |
| Art Unit(s) | 2845 |
| Total Applications | 569 |
| Issued Applications | 470 |
| Pending Applications | 50 |
| Abandoned Applications | 69 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 5019605
[patent_doc_number] => 20070145571
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-28
[patent_title] => 'Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency'
[patent_app_type] => utility
[patent_app_number] => 11/300328
[patent_app_country] => US
[patent_app_date] => 2005-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 2326
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0145/20070145571.pdf
[firstpage_image] =>[orig_patent_app_number] => 11300328
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/300328 | Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency | Dec 14, 2005 | Issued |
Array
(
[id] => 5116876
[patent_doc_number] => 20070138590
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-21
[patent_title] => 'Light sensor having undulating features for CMOS imager'
[patent_app_type] => utility
[patent_app_number] => 11/300378
[patent_app_country] => US
[patent_app_date] => 2005-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 14
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[patent_no_of_words] => 3844
[patent_no_of_claims] => 40
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[patent_maintenance] => 1
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[pdf_file] => publications/A1/0138/20070138590.pdf
[firstpage_image] =>[orig_patent_app_number] => 11300378
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/300378 | Light sensor having undulating features for CMOS imager | Dec 14, 2005 | Issued |
Array
(
[id] => 5908960
[patent_doc_number] => 20060125020
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-15
[patent_title] => 'CMOS image sensor and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/303188
[patent_app_country] => US
[patent_app_date] => 2005-12-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 2795
[patent_no_of_claims] => 20
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0125/20060125020.pdf
[firstpage_image] =>[orig_patent_app_number] => 11303188
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/303188 | CMOS image sensor and method for fabricating the same | Dec 14, 2005 | Abandoned |
Array
(
[id] => 315170
[patent_doc_number] => 07525140
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-04-28
[patent_title] => 'Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength'
[patent_app_type] => utility
[patent_app_number] => 11/304649
[patent_app_country] => US
[patent_app_date] => 2005-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 20
[patent_no_of_words] => 2670
[patent_no_of_claims] => 13
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 141
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/525/07525140.pdf
[firstpage_image] =>[orig_patent_app_number] => 11304649
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304649 | Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength | Dec 13, 2005 | Issued |
Array
(
[id] => 5645998
[patent_doc_number] => 20060131730
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-22
[patent_title] => 'Semiconductor package and fabrication method'
[patent_app_type] => utility
[patent_app_number] => 11/304868
[patent_app_country] => US
[patent_app_date] => 2005-12-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 28
[patent_figures_cnt] => 28
[patent_no_of_words] => 11939
[patent_no_of_claims] => 37
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[pdf_file] => publications/A1/0131/20060131730.pdf
[firstpage_image] =>[orig_patent_app_number] => 11304868
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/304868 | Semiconductor package having connecting bumps | Dec 13, 2005 | Issued |
Array
(
[id] => 5600936
[patent_doc_number] => 20060291281
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-12-28
[patent_title] => 'NON-VOLATILE MEMORY, MANUFACTURING AND OPERATING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/164969
[patent_app_country] => US
[patent_app_date] => 2005-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
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[patent_no_of_claims] => 40
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[pdf_file] => publications/A1/0291/20060291281.pdf
[firstpage_image] =>[orig_patent_app_number] => 11164969
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/164969 | NON-VOLATILE MEMORY, MANUFACTURING AND OPERATING METHOD THEREOF | Dec 12, 2005 | Abandoned |
Array
(
[id] => 23139
[patent_doc_number] => 07800097
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-09-21
[patent_title] => 'Semiconductor device including independent active layers and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/299818
[patent_app_country] => US
[patent_app_date] => 2005-12-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 21
[patent_no_of_words] => 6478
[patent_no_of_claims] => 24
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 166
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/800/07800097.pdf
[firstpage_image] =>[orig_patent_app_number] => 11299818
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/299818 | Semiconductor device including independent active layers and method for fabricating the same | Dec 12, 2005 | Issued |
Array
(
[id] => 865558
[patent_doc_number] => 07368806
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-06
[patent_title] => 'Flip chip package with anti-floating structure'
[patent_app_type] => utility
[patent_app_number] => 11/296489
[patent_app_country] => US
[patent_app_date] => 2005-12-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 6
[patent_no_of_words] => 2367
[patent_no_of_claims] => 8
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/368/07368806.pdf
[firstpage_image] =>[orig_patent_app_number] => 11296489
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/296489 | Flip chip package with anti-floating structure | Dec 7, 2005 | Issued |
Array
(
[id] => 5700174
[patent_doc_number] => 20060216859
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-09-28
[patent_title] => 'Package Structure of Semiconductor and Wafer-level Formation Thereof'
[patent_app_type] => utility
[patent_app_number] => 11/164818
[patent_app_country] => US
[patent_app_date] => 2005-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 1947
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[pdf_file] => publications/A1/0216/20060216859.pdf
[firstpage_image] =>[orig_patent_app_number] => 11164818
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/164818 | Package structure of semiconductor and wafer-level formation thereof | Dec 6, 2005 | Issued |
Array
(
[id] => 5908917
[patent_doc_number] => 20060124995
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-15
[patent_title] => 'Semiconductor device and manufacturing method for semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/295458
[patent_app_country] => US
[patent_app_date] => 2005-12-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2995
[patent_no_of_claims] => 12
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[pdf_file] => publications/A1/0124/20060124995.pdf
[firstpage_image] =>[orig_patent_app_number] => 11295458
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/295458 | Semiconductor device and manufacturing method for semiconductor device | Dec 6, 2005 | Abandoned |
Array
(
[id] => 415603
[patent_doc_number] => 07279789
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-09
[patent_title] => 'Thermally enhanced three-dimensional package and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/164819
[patent_app_country] => US
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[pdf_file] => patents/07/279/07279789.pdf
[firstpage_image] =>[orig_patent_app_number] => 11164819
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/164819 | Thermally enhanced three-dimensional package and method for manufacturing the same | Dec 6, 2005 | Issued |
Array
(
[id] => 5680949
[patent_doc_number] => 20060197216
[patent_country] => US
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[patent_title] => 'Semiconductor package structure and method for manufacturing the same'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11294598
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/294598 | Semiconductor package structure and method for manufacturing the same | Dec 5, 2005 | Abandoned |
Array
(
[id] => 5838131
[patent_doc_number] => 20060118789
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-08
[patent_title] => 'Thin film transistor, method of manufacturing the same, and flat panel display using the thin film transistor'
[patent_app_type] => utility
[patent_app_number] => 11/291928
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11291928
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/291928 | Thin film transistor, method of manufacturing the same, and flat panel display using the thin film transistor | Dec 1, 2005 | Abandoned |
Array
(
[id] => 5233948
[patent_doc_number] => 20070126103
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'Microelectronic 3-D package defining thermal through vias and method of making same'
[patent_app_type] => utility
[patent_app_number] => 11/292608
[patent_app_country] => US
[patent_app_date] => 2005-12-01
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[pdf_file] => publications/A1/0126/20070126103.pdf
[firstpage_image] =>[orig_patent_app_number] => 11292608
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/292608 | Microelectronic 3-D package defining thermal through vias and method of making same | Nov 30, 2005 | Abandoned |
Array
(
[id] => 5909027
[patent_doc_number] => 20060125077
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-15
[patent_title] => 'Semiconductor device'
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[pdf_file] => publications/A1/0125/20060125077.pdf
[firstpage_image] =>[orig_patent_app_number] => 11291599
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/291599 | Semiconductor device | Nov 30, 2005 | Abandoned |
Array
(
[id] => 5233947
[patent_doc_number] => 20070126102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'Stacked microelectronic packages'
[patent_app_type] => utility
[patent_app_number] => 11/291398
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 11291398
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/291398 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Nov 30, 2005 | Issued |
Array
(
[id] => 5628779
[patent_doc_number] => 20060145247
[patent_country] => US
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[patent_issue_date] => 2006-07-06
[patent_title] => 'Trench transistor and method for producing it'
[patent_app_type] => utility
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[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 11288519
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/288519 | Trench transistor and method for producing it | Nov 28, 2005 | Abandoned |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 11/285558 | Method of forming a recess structure, recessed channel type transistor and method of manufacturing the recessed channel type transistor | Nov 21, 2005 | Abandoned |
Array
(
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[patent_doc_number] => 20060278997
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[patent_title] => 'Soldered assemblies and methods of making the same'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11284289
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/284289 | Soldered assemblies and methods of making the same | Nov 20, 2005 | Abandoned |
Array
(
[id] => 5152104
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[patent_title] => 'Semiconductor device'
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[pdf_file] => publications/A1/0034/20070034986.pdf
[firstpage_image] =>[orig_patent_app_number] => 11282649
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/282649 | Semiconductor device | Nov 20, 2005 | Abandoned |