Bac H. Au

Array ( [id] => 19146567 [patent_doc_number] => 20240145597 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => Fin Field-Effect Transistor Device Having Contact Plugs with Re-Entrant Profile [patent_app_type] => utility [patent_app_number] => 18/402407 [patent_app_country] => US [patent_app_date] => 2024-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8792 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18402407 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19945388 [patent_doc_number] => 12317538 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-05-27 [patent_title] => Semiconductor devices [patent_app_type] => utility [patent_app_number] => 18/402295 [patent_app_country] => US [patent_app_date] => 2024-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 45 [patent_no_of_words] => 5802 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18402295 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19130942 [patent_doc_number] => 20240136295 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-04-25 [patent_title] => FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS [patent_app_type] => utility [patent_app_number] => 18/400745 [patent_app_country] => US [patent_app_date] => 2023-12-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5146 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18400745 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19237476 [patent_doc_number] => 20240194671 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-13 [patent_title] => TRANSISTOR CONFIGURATIONS FOR MULTI-DECK MEMORY DEVICES [patent_app_type] => utility [patent_app_number] => 18/542240 [patent_app_country] => US [patent_app_date] => 2023-12-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15645 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18542240 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19720363 [patent_doc_number] => 12205906 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-01-21 [patent_title] => Electronic package and fabrication method thereof [patent_app_type] => utility [patent_app_number] => 18/537638 [patent_app_country] => US [patent_app_date] => 2023-12-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 13 [patent_no_of_words] => 3966 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18537638 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19269397 [patent_doc_number] => 20240213101 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => ELECTRONIC CIRCUIT WITH MOS TRANSISTORS AND MANUFACTURING METHOD [patent_app_type] => utility [patent_app_number] => 18/535882 [patent_app_country] => US [patent_app_date] => 2023-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7515 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18535882 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19436166 [patent_doc_number] => 20240304664 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-12 [patent_title] => FAST RECOVERY DIODE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/535464 [patent_app_country] => US [patent_app_date] => 2023-12-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4970 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 111 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18535464 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19073344 [patent_doc_number] => 20240107770 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-28 [patent_title] => SEMICONDUCTOR MEMORY DEVICE [patent_app_type] => utility [patent_app_number] => 18/530049 [patent_app_country] => US [patent_app_date] => 2023-12-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10486 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18530049 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19837491 [patent_doc_number] => 20250089277 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-13 [patent_title] => METAL-INSULATOR-METAL (MIM) CAPACITORS WITH IMPROVED RELIABILITY [patent_app_type] => utility [patent_app_number] => 18/524533 [patent_app_country] => US [patent_app_date] => 2023-11-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9693 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18524533 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20038010 [patent_doc_number] => 20250176232 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-29 [patent_title] => GATE ELECTRODE STRUCTURE IN MEDIUM VOLTAGE DEVICE FOR SCALING AND INCREASED PERFORMANCE [patent_app_type] => utility [patent_app_number] => 18/519393 [patent_app_country] => US [patent_app_date] => 2023-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4273 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18519393 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19055030 [patent_doc_number] => 20240096999 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-21 [patent_title] => SILICIDE STRUCTURES IN TRANSISTORS AND METHODS OF FORMING [patent_app_type] => utility [patent_app_number] => 18/520326 [patent_app_country] => US [patent_app_date] => 2023-11-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10926 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 76 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18520326 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19269470 [patent_doc_number] => 20240213174 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-06-27 [patent_title] => SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/515797 [patent_app_country] => US [patent_app_date] => 2023-11-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9784 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18515797 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19176125 [patent_doc_number] => 20240162099 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-16 [patent_title] => POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR ASSEMBLING THE SAME [patent_app_type] => utility [patent_app_number] => 18/504463 [patent_app_country] => US [patent_app_date] => 2023-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5983 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 164 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18504463 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19191538 [patent_doc_number] => 20240170451 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-23 [patent_title] => ASSEMBLY OF INTEGRATED CIRCUIT WAFERS [patent_app_type] => utility [patent_app_number] => 18/504895 [patent_app_country] => US [patent_app_date] => 2023-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5137 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 52 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18504895 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20011277 [patent_doc_number] => 20250149499 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-05-08 [patent_title] => HYBRID BONDING WITH SELECTIVELY FORMED DIELECTRIC MATERIAL [patent_app_type] => utility [patent_app_number] => 18/504526 [patent_app_country] => US [patent_app_date] => 2023-11-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 0 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18504526 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19148694 [patent_doc_number] => 20240147815 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-05-02 [patent_title] => DISPLAY APPARATUS WITH IMPROVED ADHESION CHARACTERISTICS IN NON-ACTIVE AREA [patent_app_type] => utility [patent_app_number] => 18/384687 [patent_app_country] => US [patent_app_date] => 2023-10-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11827 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -22 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18384687 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 20276507 [patent_doc_number] => 12446296 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2025-10-14 [patent_title] => Etch profile control of via opening [patent_app_type] => utility [patent_app_number] => 18/481120 [patent_app_country] => US [patent_app_date] => 2023-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 59 [patent_figures_cnt] => 59 [patent_no_of_words] => 11360 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18481120 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18906041 [patent_doc_number] => 20240021526 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => INTEGRATED CIRCUIT [patent_app_type] => utility [patent_app_number] => 18/474822 [patent_app_country] => US [patent_app_date] => 2023-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 29322 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18474822 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 18898714 [patent_doc_number] => 20240014199 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-11 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/472249 [patent_app_country] => US [patent_app_date] => 2023-09-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6573 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18472249 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 19515693 [patent_doc_number] => 20240347379 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-17 [patent_title] => METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARIZATION AND SEMICONDUCTOR STRUCTURE THEREOF [patent_app_type] => utility [patent_app_number] => 18/235970 [patent_app_country] => US [patent_app_date] => 2023-08-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8943 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 137 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18235970 [rel_patent_id] =>[rel_patent_doc_number] =>)