Barbara J Bullock
Examiner (ID: 9881)
Most Active Art Unit | 2901 |
Art Unit(s) | 2900, 2912, 2901, 2902 |
Total Applications | 4468 |
Issued Applications | 4372 |
Pending Applications | 0 |
Abandoned Applications | 96 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6435269
[patent_doc_number] => 20020127851
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2002-09-12
[patent_title] => 'Method of producing semiconductor device'
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[patent_app_number] => 10/020118
[patent_app_country] => US
[patent_app_date] => 2001-12-18
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[pdf_file] => publications/A1/0127/20020127851.pdf
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/020118 | Method of producing semiconductor device | Dec 17, 2001 | Abandoned |
Array
(
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[patent_doc_number] => 20020094624
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[patent_kind] => A1
[patent_issue_date] => 2002-07-18
[patent_title] => 'Method for forming cell capacitor for high-integrated DRAMs'
[patent_app_type] => new
[patent_app_number] => 10/020649
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/020649 | Method for forming cell capacitor for high-integrated DRAMs | Dec 11, 2001 | Issued |
Array
(
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[patent_doc_number] => 06420254
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[patent_kind] => B1
[patent_issue_date] => 2002-07-16
[patent_title] => 'Recessed bond pad'
[patent_app_type] => B1
[patent_app_number] => 09/996538
[patent_app_country] => US
[patent_app_date] => 2001-11-28
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Array
(
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[patent_doc_number] => 06624062
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[patent_kind] => B2
[patent_issue_date] => 2003-09-23
[patent_title] => 'Wiring structure in semiconductor device and method for forming the same'
[patent_app_type] => B2
[patent_app_number] => 09/993517
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[patent_app_date] => 2001-11-27
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/993517 | Wiring structure in semiconductor device and method for forming the same | Nov 26, 2001 | Issued |
Array
(
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[patent_doc_number] => 06459117
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[patent_issue_date] => 2002-10-01
[patent_title] => 'Integrated circuit device formed with high Q MIM capacitor'
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[patent_app_number] => 09/994398
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[patent_app_date] => 2001-11-26
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Array
(
[id] => 6494756
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[patent_kind] => A1
[patent_issue_date] => 2002-12-19
[patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING A PAD AND A METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => new
[patent_app_number] => 09/988268
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/988268 | Semiconductor device including a pad and a method of manufacturing the same | Nov 18, 2001 | Issued |
Array
(
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[patent_doc_number] => 20030089996
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[patent_title] => 'Electromigration-reliability improvement of dual damascene interconnects'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/010679 | Electromigration-reliability improvement of dual damascene interconnects | Nov 12, 2001 | Issued |
Array
(
[id] => 6359090
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[patent_issue_date] => 2002-05-16
[patent_title] => 'Method of manufacturing semiconductor device'
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Array
(
[id] => 996556
[patent_doc_number] => 06913996
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[patent_kind] => B2
[patent_issue_date] => 2005-07-05
[patent_title] => 'Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring'
[patent_app_type] => utility
[patent_app_number] => 10/181273
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Array
(
[id] => 1559883
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[patent_issue_date] => 2002-08-20
[patent_title] => 'Method for producing a micromechanical structure and a micromechanical structure'
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[patent_app_number] => 09/992939
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Array
(
[id] => 1500401
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Array
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[id] => 6091977
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Array
(
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Array
(
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Array
(
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Array
(
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Array
(
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Array
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Array
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