Application number | Title of the application | Filing Date | Status |
---|
08/159236 | METHOD FOR FORMING TUNGSTEN PLUGS IN CONTACT HOLES OF A SEMICONDUCTOR DEVICE | Nov 29, 1993 | Abandoned |
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08/149856 | THERMAL PROCESS FOR FORMING HIGH VALUE RESISTORS | Nov 9, 1993 | Abandoned |
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08/141140 | SEMICONDUCTOR DEVICE USING ANTIREFLECTION COATING | Oct 21, 1993 | Abandoned |
08/141780 | TUNGSTEN FORMATION PROCESS | Oct 21, 1993 | Abandoned |
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08/130062 | TAPERED PROFILE INTERCONNECT TECHNOLOGY UTILIZING AN ETCHBACK METHOD | Sep 29, 1993 | Abandoned |
Array
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08/121594 | ANTIFUSE STRUCTURE AND METHOD FOR INTEGRATION INTO CMOS PROCESS | Sep 13, 1993 | Abandoned |