Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 3411148
[patent_doc_number] => 05411916
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-02
[patent_title] => 'Method for patterning wirings of semiconductor integrated circuit device'
[patent_app_type] => 1
[patent_app_number] => 8/077946
[patent_app_country] => US
[patent_app_date] => 1993-03-18
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/077946 | Method for patterning wirings of semiconductor integrated circuit device | Mar 17, 1993 | Issued |
Array
(
[id] => 2967673
[patent_doc_number] => 05258328
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-11-02
[patent_title] => 'Method of forming multilayered wiring structure of semiconductor device'
[patent_app_type] => 1
[patent_app_number] => 8/031324
[patent_app_country] => US
[patent_app_date] => 1993-03-15
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[firstpage_image] =>[orig_patent_app_number] => 031324
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/031324 | Method of forming multilayered wiring structure of semiconductor device | Mar 14, 1993 | Issued |
08/028428 | METHOD OF PROCESSING A POLYSILICON FILM ON A SINGLE-CRYSTAL SILICON SUBSTRATE | Mar 8, 1993 | Pending |
Array
(
[id] => 3029422
[patent_doc_number] => 05342808
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-30
[patent_title] => 'Aperture size control for etched vias and metal contacts'
[patent_app_type] => 1
[patent_app_number] => 8/028643
[patent_app_country] => US
[patent_app_date] => 1993-03-09
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Array
(
[id] => 3052244
[patent_doc_number] => 05344793
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-09-06
[patent_title] => 'Formation of silicided junctions in deep sub-micron MOSFETs by defect enhanced CoSi2 formation'
[patent_app_type] => 1
[patent_app_number] => 8/026944
[patent_app_country] => US
[patent_app_date] => 1993-03-05
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Array
(
[id] => 3070210
[patent_doc_number] => 05336623
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-09
[patent_title] => 'Process for producing integrated solar cell'
[patent_app_type] => 1
[patent_app_number] => 8/025128
[patent_app_country] => US
[patent_app_date] => 1993-03-02
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[firstpage_image] =>[orig_patent_app_number] => 025128
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/025128 | Process for producing integrated solar cell | Mar 1, 1993 | Issued |
08/026114 | METHOD FOR BURYING LOW RESISTANCE MATERIAL IN A CONTACT HOLE | Mar 1, 1993 | Abandoned |
Array
(
[id] => 3007485
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-04
[patent_title] => 'Method for forming metallization in an integrated circuit'
[patent_app_type] => 1
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[patent_app_country] => US
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Array
(
[id] => 3083512
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-01-18
[patent_title] => 'Method for forming miniature contacts of highly integrated semiconductor devices'
[patent_app_type] => 1
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[patent_app_country] => US
[patent_app_date] => 1993-03-01
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[pdf_file] => patents/05/279/05279989.pdf
[firstpage_image] =>[orig_patent_app_number] => 022666
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/022666 | Method for forming miniature contacts of highly integrated semiconductor devices | Feb 28, 1993 | Issued |
Array
(
[id] => 3065347
[patent_doc_number] => 05336365
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-09
[patent_title] => 'Polysilicon etching method'
[patent_app_type] => 1
[patent_app_number] => 8/022634
[patent_app_country] => US
[patent_app_date] => 1993-02-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[patent_no_of_words] => 3778
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[pdf_file] => patents/05/336/05336365.pdf
[firstpage_image] =>[orig_patent_app_number] => 022634
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/022634 | Polysilicon etching method | Feb 24, 1993 | Issued |
Array
(
[id] => 3446497
[patent_doc_number] => 05387556
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-02-07
[patent_title] => 'Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub. 2'
[patent_app_type] => 1
[patent_app_number] => 8/021831
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 021831
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/021831 | Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub. 2 | Feb 23, 1993 | Issued |
Array
(
[id] => 3029252
[patent_doc_number] => 05342799
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-30
[patent_title] => 'Substrate slew circuit process'
[patent_app_type] => 1
[patent_app_number] => 8/020486
[patent_app_country] => US
[patent_app_date] => 1993-02-22
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[pdf_file] => patents/05/342/05342799.pdf
[firstpage_image] =>[orig_patent_app_number] => 020486
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/020486 | Substrate slew circuit process | Feb 21, 1993 | Issued |
Array
(
[id] => 2975124
[patent_doc_number] => 05256595
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-10-26
[patent_title] => 'Method of growing device quality InP onto an InP substrate using an organometallic precursor in a hot wall reactor'
[patent_app_type] => 1
[patent_app_number] => 8/019508
[patent_app_country] => US
[patent_app_date] => 1993-02-19
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[pdf_file] => patents/05/256/05256595.pdf
[firstpage_image] =>[orig_patent_app_number] => 019508
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/019508 | Method of growing device quality InP onto an InP substrate using an organometallic precursor in a hot wall reactor | Feb 18, 1993 | Issued |
Array
(
[id] => 2887630
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1993-08-24
[patent_title] => 'Film forming method by spin coating in production of semiconductor device'
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Array
(
[id] => 3425371
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1995-05-16
[patent_title] => 'Method for chemical vapor depositing a titanium nitride layer on a semiconductor wafer and method of annealing tin films'
[patent_app_type] => 1
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/019084 | Method for chemical vapor depositing a titanium nitride layer on a semiconductor wafer and method of annealing tin films | Feb 17, 1993 | Issued |
Array
(
[id] => 3059794
[patent_doc_number] => 05294296
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-03-15
[patent_title] => 'Method for manufacturing a contact hole of a semiconductor device'
[patent_app_type] => 1
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[patent_app_country] => US
[patent_app_date] => 1993-02-11
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[firstpage_image] =>[orig_patent_app_number] => 016597
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/016597 | Method for manufacturing a contact hole of a semiconductor device | Feb 10, 1993 | Issued |
08/014920 | METHOD OF FORMING A LOW-RESISTANCE CONTACT ON A COMPOUND SEMICONDUCTOR | Feb 7, 1993 | Abandoned |
Array
(
[id] => 3043794
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[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 1994-08-02
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[patent_app_number] => 8/011632
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Array
(
[id] => 3017791
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[patent_kind] => NA
[patent_issue_date] => 1994-02-22
[patent_title] => 'Method for forming self-aligned t-shaped transistor electrode'
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[patent_app_number] => 8/011998
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[firstpage_image] =>[orig_patent_app_number] => 011998
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/011998 | Method for forming self-aligned t-shaped transistor electrode | Jan 31, 1993 | Issued |
Array
(
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[patent_kind] => NA
[patent_issue_date] => 1994-05-17
[patent_title] => 'Method of manufacturing semiconductor device having multilayer interconnection structure'
[patent_app_type] => 1
[patent_app_number] => 8/009180
[patent_app_country] => US
[patent_app_date] => 1993-01-26
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[rel_patent_id] =>[rel_patent_doc_number] =>) 08/009180 | Method of manufacturing semiconductor device having multilayer interconnection structure | Jan 25, 1993 | Issued |