Array
(
[id] => 4156244
[patent_doc_number] => 06156644
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2000-12-05
[patent_title] => 'Method for forming interconnects for semiconductor devices using reaction control layers, and interconnects formed thereby'
[patent_app_type] => 1
[patent_app_number] => 8/760594
[patent_app_country] => US
[patent_app_date] => 1996-12-04
[patent_effective_date] => 0000-00-00
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[patent_no_of_words] => 3463
[patent_no_of_claims] => 35
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[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/156/06156644.pdf
[firstpage_image] =>[orig_patent_app_number] => 760594
[rel_patent_id] =>[rel_patent_doc_number] =>) 08/760594 | Method for forming interconnects for semiconductor devices using reaction control layers, and interconnects formed thereby | Dec 3, 1996 | Issued |