| Application number | Title of the application | Filing Date | Status |
|---|
| 08/086897 | SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION LAYER | Jul 6, 1993 | Pending |
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| 08/034560 | INTEGRATED CIRCUIT HAVING A DIAMOND THIN FILM TRENCH ARRANGEMENT AS A COMPONENT THEREOF AND METHOD | Mar 18, 1993 | Pending |
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| 08/013539 | IC WIRING CONNECTING METHOD AND APPARATUS | Jan 27, 1993 | Abandoned |
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