Search

Bitew A. Dinke

Examiner (ID: 8905, Phone: (571)272-0534 , Office: P/2823 )

Most Active Art Unit
2823
Art Unit(s)
2823, 2896, 2812, 2826
Total Applications
846
Issued Applications
558
Pending Applications
111
Abandoned Applications
209

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 19308795 [patent_doc_number] => 20240237378 [patent_country] => US [patent_kind] => A9 [patent_issue_date] => 2024-07-11 [patent_title] => ORGANIC LIGHT EMITTING ELEMENT [patent_app_type] => utility [patent_app_number] => 18/493815 [patent_app_country] => US [patent_app_date] => 2023-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4232 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18493815 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/493815
ORGANIC LIGHT EMITTING ELEMENT Oct 24, 2023 Pending
Array ( [id] => 19308795 [patent_doc_number] => 20240237378 [patent_country] => US [patent_kind] => A9 [patent_issue_date] => 2024-07-11 [patent_title] => ORGANIC LIGHT EMITTING ELEMENT [patent_app_type] => utility [patent_app_number] => 18/493815 [patent_app_country] => US [patent_app_date] => 2023-10-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4232 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18493815 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/493815
ORGANIC LIGHT EMITTING ELEMENT Oct 23, 2023 Pending
Array ( [id] => 19850804 [patent_doc_number] => 20250096155 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-03-20 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME [patent_app_type] => utility [patent_app_number] => 18/469410 [patent_app_country] => US [patent_app_date] => 2023-09-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7570 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18469410 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/469410
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME Sep 17, 2023 Pending
Array ( [id] => 19468120 [patent_doc_number] => 20240321790 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => BONDING-TYPE INTERCONNECTION MEMBER [patent_app_type] => utility [patent_app_number] => 18/458118 [patent_app_country] => US [patent_app_date] => 2023-08-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3450 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 170 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18458118 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/458118
BONDING-TYPE INTERCONNECTION MEMBER Aug 28, 2023 Pending
Array ( [id] => 19589934 [patent_doc_number] => 20240387491 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-21 [patent_title] => PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/455857 [patent_app_country] => US [patent_app_date] => 2023-08-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5958 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18455857 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/455857
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF Aug 24, 2023 Pending
Array ( [id] => 19468127 [patent_doc_number] => 20240321797 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-09-26 [patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 18/455573 [patent_app_country] => US [patent_app_date] => 2023-08-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10351 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18455573 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/455573
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Aug 23, 2023 Pending
Array ( [id] => 19758089 [patent_doc_number] => 20250046654 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-02-06 [patent_title] => DIFFERENTIAL ETCH RATES OF COPPER FEATURES [patent_app_type] => utility [patent_app_number] => 18/363775 [patent_app_country] => US [patent_app_date] => 2023-08-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4507 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 88 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18363775 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/363775
DIFFERENTIAL ETCH RATES OF COPPER FEATURES Aug 1, 2023 Pending
Array ( [id] => 19712678 [patent_doc_number] => 20250022820 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-16 [patent_title] => UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMATION [patent_app_type] => utility [patent_app_number] => 18/349351 [patent_app_country] => US [patent_app_date] => 2023-07-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10933 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18349351 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/349351
UNDER-BUMP METALLIZATION STRUCTURES AND ASSOCIATED METHODS OF FORMATION Jul 9, 2023 Pending
Array ( [id] => 19688136 [patent_doc_number] => 20250006681 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS [patent_app_type] => utility [patent_app_number] => 18/216404 [patent_app_country] => US [patent_app_date] => 2023-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5531 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18216404 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/216404
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS Jun 28, 2023 Pending
Array ( [id] => 18821196 [patent_doc_number] => 20230395537 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING [patent_app_type] => utility [patent_app_number] => 18/206591 [patent_app_country] => US [patent_app_date] => 2023-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2602 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -2 [patent_words_short_claim] => 284 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18206591 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/206591
BUMP OF CHIP PACKAGE WITH HIGHER BEARING CAPACITY IN WIRE BONDING Jun 5, 2023 Pending
Array ( [id] => 18774336 [patent_doc_number] => 20230369167 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-16 [patent_title] => LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/196012 [patent_app_country] => US [patent_app_date] => 2023-05-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5725 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 250 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18196012 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/196012
LIQUID CIRCULATING COOLING PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF May 10, 2023 Pending
Array ( [id] => 18789474 [patent_doc_number] => 20230378144 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => STACKED PACKAGING STRUCTURE AND POWER CONVERTER [patent_app_type] => utility [patent_app_number] => 18/141510 [patent_app_country] => US [patent_app_date] => 2023-05-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2366 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18141510 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/141510
STACKED PACKAGING STRUCTURE AND POWER CONVERTER Apr 30, 2023 Pending
Array ( [id] => 18743473 [patent_doc_number] => 20230352461 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-02 [patent_title] => THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/139744 [patent_app_country] => US [patent_app_date] => 2023-04-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4827 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 345 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18139744 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/139744
THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF Apr 25, 2023 Pending
Array ( [id] => 19532077 [patent_doc_number] => 20240355979 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-10-24 [patent_title] => LIGHT-EMITTING DIODE PACKAGES WITH MATERIALS FOR REDUCING EFFECTS OF ENVIRONMENTAL INGRESS [patent_app_type] => utility [patent_app_number] => 18/304836 [patent_app_country] => US [patent_app_date] => 2023-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9741 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 43 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18304836 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/304836
LIGHT-EMITTING DIODE PACKAGES WITH MATERIALS FOR REDUCING EFFECTS OF ENVIRONMENTAL INGRESS Apr 20, 2023 Pending
Array ( [id] => 19038259 [patent_doc_number] => 20240088074 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-14 [patent_title] => THICK REDISTRIBUTION LAYER FEATURES [patent_app_type] => utility [patent_app_number] => 18/184480 [patent_app_country] => US [patent_app_date] => 2023-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8389 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18184480 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/184480
THICK REDISTRIBUTION LAYER FEATURES Mar 14, 2023 Pending
Array ( [id] => 19696490 [patent_doc_number] => 20250015035 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-09 [patent_title] => A SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME [patent_app_type] => utility [patent_app_number] => 18/547853 [patent_app_country] => US [patent_app_date] => 2023-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6526 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18547853 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/547853
A SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME Mar 12, 2023 Pending
Array ( [id] => 18821241 [patent_doc_number] => 20230395582 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/180948 [patent_app_country] => US [patent_app_date] => 2023-03-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3343 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -7 [patent_words_short_claim] => 86 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18180948 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/180948
SEMICONDUCTOR DEVICE Mar 8, 2023 Pending
Array ( [id] => 18514686 [patent_doc_number] => 20230230947 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-07-20 [patent_title] => SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING [patent_app_type] => utility [patent_app_number] => 18/179431 [patent_app_country] => US [patent_app_date] => 2023-03-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6118 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -8 [patent_words_short_claim] => 84 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18179431 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/179431
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING Mar 6, 2023 Pending
Array ( [id] => 18679992 [patent_doc_number] => 20230317650 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-05 [patent_title] => CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE [patent_app_type] => utility [patent_app_number] => 18/172529 [patent_app_country] => US [patent_app_date] => 2023-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 15740 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -9 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18172529 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/172529
CONNECTION STRUCTURAL BODY AND SEMICONDUCTOR DEVICE Feb 21, 2023 Pending
Array ( [id] => 18696457 [patent_doc_number] => 20230326896 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-10-12 [patent_title] => CHIP-ON-FILM PACKAGE [patent_app_type] => utility [patent_app_number] => 18/108733 [patent_app_country] => US [patent_app_date] => 2023-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 2082 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 229 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18108733 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/108733
CHIP-ON-FILM PACKAGE Feb 12, 2023 Pending
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