Bitew A. Dinke

Array ( [id] => 9542609 [patent_doc_number] => 20140167255 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-19 [patent_title] => 'PACKAGE STRUCTURE AND PACKAGE METHOD' [patent_app_type] => utility [patent_app_number] => 14/079377 [patent_app_country] => US [patent_app_date] => 2013-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5167 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14079377 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9474397 [patent_doc_number] => 20140131860 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-15 [patent_title] => 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND ELECTRONIC DEVICE' [patent_app_type] => utility [patent_app_number] => 14/078623 [patent_app_country] => US [patent_app_date] => 2013-11-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 13 [patent_figures_cnt] => 13 [patent_no_of_words] => 7118 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14078623 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10964817 [patent_doc_number] => 20140367850 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-12-18 [patent_title] => 'STACKED PACKAGE AND METHOD OF FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/077771 [patent_app_country] => US [patent_app_date] => 2013-11-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 2967 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14077771 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9488413 [patent_doc_number] => 20140138819 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-22 [patent_title] => 'SEMICONDUCTOR DEVICE INCLUDING TSV AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/074573 [patent_app_country] => US [patent_app_date] => 2013-11-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 10628 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14074573 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9460497 [patent_doc_number] => 20140124923 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-08 [patent_title] => 'SEMICONDUCTOR DEVICES HAVING A STAGGERED PAD WIRING STRUCTURE' [patent_app_type] => utility [patent_app_number] => 14/072993 [patent_app_country] => US [patent_app_date] => 2013-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 8912 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14072993 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9534589 [patent_doc_number] => 20140159235 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-12 [patent_title] => 'ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF THE ELECTRONIC APPARATUS' [patent_app_type] => utility [patent_app_number] => 14/073144 [patent_app_country] => US [patent_app_date] => 2013-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 24 [patent_figures_cnt] => 24 [patent_no_of_words] => 16091 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14073144 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9566013 [patent_doc_number] => 20140183726 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-07-03 [patent_title] => 'PACKAGE SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND PACKAGE ON PACKAGE SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/073309 [patent_app_country] => US [patent_app_date] => 2013-11-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 9076 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14073309 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10238270 [patent_doc_number] => 20150123265 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-05-07 [patent_title] => 'SOLDER BUMP ARRANGEMENTS FOR LARGE AREA ANALOG CIRCUITRY' [patent_app_type] => utility [patent_app_number] => 14/071865 [patent_app_country] => US [patent_app_date] => 2013-11-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9739 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14071865 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10924111 [patent_doc_number] => 20140327132 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-11-06 [patent_title] => 'TSV Backside Reveal Structure and Exposing Process' [patent_app_type] => utility [patent_app_number] => 14/071453 [patent_app_country] => US [patent_app_date] => 2013-11-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5567 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14071453 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9737813 [patent_doc_number] => 20140273531 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES' [patent_app_type] => utility [patent_app_number] => 14/062328 [patent_app_country] => US [patent_app_date] => 2013-10-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 13700 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14062328 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9508836 [patent_doc_number] => 20140145327 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-29 [patent_title] => 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/060913 [patent_app_country] => US [patent_app_date] => 2013-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 8984 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14060913 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10223642 [patent_doc_number] => 20150108635 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-23 [patent_title] => 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF' [patent_app_type] => utility [patent_app_number] => 14/061615 [patent_app_country] => US [patent_app_date] => 2013-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5245 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14061615 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10223596 [patent_doc_number] => 20150108589 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-04-23 [patent_title] => 'EMBEDDED INTERLEVEL DIELECTRIC BARRIER LAYERS FOR REPLACEMENT METAL GATE FIELD EFFECT TRANSISTORS' [patent_app_type] => utility [patent_app_number] => 14/059480 [patent_app_country] => US [patent_app_date] => 2013-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 5596 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14059480 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11286474 [patent_doc_number] => 09502333 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-11-22 [patent_title] => 'Semiconductor device having conductive vias' [patent_app_type] => utility [patent_app_number] => 14/056230 [patent_app_country] => US [patent_app_date] => 2013-10-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 3882 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 156 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14056230 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9905919 [patent_doc_number] => 20150061119 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-03-05 [patent_title] => 'CIRCUIT SUBSTRATE, SEMICONDUTOR PACKAGE STRUCTURE AND PROCESS FOR FABRICATING A CIRCUIT SUBSTRATE' [patent_app_type] => utility [patent_app_number] => 14/054850 [patent_app_country] => US [patent_app_date] => 2013-10-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 4172 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14054850 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11781911 [patent_doc_number] => 09391112 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-07-12 [patent_title] => 'Semiconductor apparatus' [patent_app_type] => utility [patent_app_number] => 14/038516 [patent_app_country] => US [patent_app_date] => 2013-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 12415 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 257 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14038516 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9728790 [patent_doc_number] => 20140264497 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'SELF-ALIGNED APPROACH FOR DRAIN DIFFUSION IN FIELD EFFECT TRANSISTORS' [patent_app_type] => utility [patent_app_number] => 14/037253 [patent_app_country] => US [patent_app_date] => 2013-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 1929 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037253 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9729039 [patent_doc_number] => 20140264746 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-09-18 [patent_title] => 'SELF ALIGNED CAPACITOR FABRICATION' [patent_app_type] => utility [patent_app_number] => 14/037334 [patent_app_country] => US [patent_app_date] => 2013-09-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 3006 [patent_no_of_claims] => 4 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14037334 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10515412 [patent_doc_number] => 09242444 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-01-26 [patent_title] => 'Method of fabricating a composite structure with a stable bonding layer of oxide' [patent_app_type] => utility [patent_app_number] => 14/031498 [patent_app_country] => US [patent_app_date] => 2013-09-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 5715 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 253 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14031498 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11221803 [patent_doc_number] => 09450150 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-09-20 [patent_title] => 'Nitride semiconductor light-emitting element' [patent_app_type] => utility [patent_app_number] => 14/400625 [patent_app_country] => US [patent_app_date] => 2013-09-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 17 [patent_no_of_words] => 6606 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14400625 [rel_patent_id] =>[rel_patent_doc_number] =>)