Search

Bradley R. Spies

Examiner (ID: 10754, Phone: (571)272-3469 , Office: P/1777 )

Most Active Art Unit
1777
Art Unit(s)
1777
Total Applications
943
Issued Applications
639
Pending Applications
108
Abandoned Applications
212

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 6694942 [patent_doc_number] => 20030107136 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-06-12 [patent_title] => 'Chip structure and process for forming the same' [patent_app_type] => new [patent_app_number] => 10/337673 [patent_app_country] => US [patent_app_date] => 2003-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 12 [patent_no_of_words] => 8199 [patent_no_of_claims] => 220 [patent_no_of_ind_claims] => 13 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0107/20030107136.pdf [firstpage_image] =>[orig_patent_app_number] => 10337673 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/337673
Chip structure to improve resistance-capacitance delay and reduce energy loss of the chip Jan 5, 2003 Issued
Array ( [id] => 6690934 [patent_doc_number] => 20030038366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-27 [patent_title] => 'Three-dimensional semiconductor device having plural active semiconductor components' [patent_app_type] => new [patent_app_number] => 10/268752 [patent_app_country] => US [patent_app_date] => 2002-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 31 [patent_figures_cnt] => 31 [patent_no_of_words] => 7866 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 50 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20030038366.pdf [firstpage_image] =>[orig_patent_app_number] => 10268752 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/268752
Three-dimensional semiconductor device having plural active semiconductor components Oct 10, 2002 Abandoned
Array ( [id] => 7963791 [patent_doc_number] => 06680532 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-01-20 [patent_title] => 'Multi chip module' [patent_app_type] => B1 [patent_app_number] => 10/265751 [patent_app_country] => US [patent_app_date] => 2002-10-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 4 [patent_no_of_words] => 2015 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/680/06680532.pdf [firstpage_image] =>[orig_patent_app_number] => 10265751 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/265751
Multi chip module Oct 6, 2002 Issued
Array ( [id] => 1197830 [patent_doc_number] => 06727582 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-04-27 [patent_title] => 'Semiconductor device' [patent_app_type] => B2 [patent_app_number] => 10/255961 [patent_app_country] => US [patent_app_date] => 2002-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 3379 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 194 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/727/06727582.pdf [firstpage_image] =>[orig_patent_app_number] => 10255961 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/255961
Semiconductor device Sep 26, 2002 Issued
Array ( [id] => 6776269 [patent_doc_number] => 20030047349 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-13 [patent_title] => 'Integrated circuit package and printed circuit board arrangement' [patent_app_type] => new [patent_app_number] => 10/065016 [patent_app_country] => US [patent_app_date] => 2002-09-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 2909 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 135 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0047/20030047349.pdf [firstpage_image] =>[orig_patent_app_number] => 10065016 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/065016
Integrated circuit package and printed circuit board arrangement Sep 9, 2002 Issued
Array ( [id] => 6718712 [patent_doc_number] => 20030052399 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-20 [patent_title] => 'Semiconductor device having semiconductor element packaged on interposer' [patent_app_type] => new [patent_app_number] => 10/222841 [patent_app_country] => US [patent_app_date] => 2002-08-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5511 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 132 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0052/20030052399.pdf [firstpage_image] =>[orig_patent_app_number] => 10222841 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/222841
Semiconductor device having semiconductor element packaged on interposer Aug 18, 2002 Issued
Array ( [id] => 1225227 [patent_doc_number] => 06700207 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Flip-chip ball grid array package for electromigration testing' [patent_app_type] => B2 [patent_app_number] => 10/212448 [patent_app_country] => US [patent_app_date] => 2002-08-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 6 [patent_no_of_words] => 3025 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/700/06700207.pdf [firstpage_image] =>[orig_patent_app_number] => 10212448 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/212448
Flip-chip ball grid array package for electromigration testing Aug 4, 2002 Issued
Array ( [id] => 1056352 [patent_doc_number] => 06855575 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-02-15 [patent_title] => 'Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof' [patent_app_type] => utility [patent_app_number] => 10/202764 [patent_app_country] => US [patent_app_date] => 2002-07-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 2725 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 190 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/855/06855575.pdf [firstpage_image] =>[orig_patent_app_number] => 10202764 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/202764
Semiconductor chip package having a semiconductor chip with center and edge bonding pads and manufacturing method thereof Jul 23, 2002 Issued
Array ( [id] => 1210966 [patent_doc_number] => 06713862 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Low temperature co-fired ceramic-metal packaging technology' [patent_app_type] => B2 [patent_app_number] => 10/199418 [patent_app_country] => US [patent_app_date] => 2002-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 9 [patent_no_of_words] => 4712 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 110 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713862.pdf [firstpage_image] =>[orig_patent_app_number] => 10199418 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/199418
Low temperature co-fired ceramic-metal packaging technology Jul 18, 2002 Issued
Array ( [id] => 6748096 [patent_doc_number] => 20030042616 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-06 [patent_title] => 'ANGLED EDGE CONNECTIONS FOR MULTICHIP STRUCTURES' [patent_app_type] => new [patent_app_number] => 10/198791 [patent_app_country] => US [patent_app_date] => 2002-07-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3915 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 154 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0042/20030042616.pdf [firstpage_image] =>[orig_patent_app_number] => 10198791 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/198791
Angled edge connections for multichip structures Jul 17, 2002 Issued
Array ( [id] => 7421199 [patent_doc_number] => 20040000702 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2004-01-01 [patent_title] => 'Integrated circuit and laminated leadframe package' [patent_app_type] => new [patent_app_number] => 10/183287 [patent_app_country] => US [patent_app_date] => 2002-06-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2887 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0000/20040000702.pdf [firstpage_image] =>[orig_patent_app_number] => 10183287 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/183287
Integrated circuit and laminated leadframe package Jun 26, 2002 Issued
Array ( [id] => 6170363 [patent_doc_number] => 20020153618 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-24 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/162613 [patent_app_country] => US [patent_app_date] => 2002-06-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 8534 [patent_no_of_claims] => 36 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 177 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0153/20020153618.pdf [firstpage_image] =>[orig_patent_app_number] => 10162613 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/162613
Semiconductor device Jun 5, 2002 Issued
Array ( [id] => 6153920 [patent_doc_number] => 20020145188 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-10 [patent_title] => 'Flat semiconductor device and power converter employing the same' [patent_app_type] => new [patent_app_number] => 10/161674 [patent_app_country] => US [patent_app_date] => 2002-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 8048 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 107 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0145/20020145188.pdf [firstpage_image] =>[orig_patent_app_number] => 10161674 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/161674
Flat semiconductor device and power converter employing the same Jun 4, 2002 Abandoned
Array ( [id] => 6539039 [patent_doc_number] => 20020137261 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-26 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/152726 [patent_app_country] => US [patent_app_date] => 2002-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6217 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20020137261.pdf [firstpage_image] =>[orig_patent_app_number] => 10152726 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/152726
Method of making semiconductor device having improved heat radiation plate arrangement May 22, 2002 Issued
Array ( [id] => 6539052 [patent_doc_number] => 20020137262 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-09-26 [patent_title] => 'Semiconductor device' [patent_app_type] => new [patent_app_number] => 10/152727 [patent_app_country] => US [patent_app_date] => 2002-05-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 6227 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 145 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0137/20020137262.pdf [firstpage_image] =>[orig_patent_app_number] => 10152727 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/152727
Semiconductor device May 22, 2002 Issued
Array ( [id] => 1218120 [patent_doc_number] => 06707148 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-16 [patent_title] => 'Bumped integrated circuits for optical applications' [patent_app_type] => B1 [patent_app_number] => 10/153269 [patent_app_country] => US [patent_app_date] => 2002-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 5 [patent_no_of_words] => 2490 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 163 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/707/06707148.pdf [firstpage_image] =>[orig_patent_app_number] => 10153269 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/153269
Bumped integrated circuits for optical applications May 20, 2002 Issued
Array ( [id] => 1210873 [patent_doc_number] => 06713815 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-30 [patent_title] => 'Semiconductor device with transistors that convert a voltage difference into a drain current difference' [patent_app_type] => B2 [patent_app_number] => 10/147415 [patent_app_country] => US [patent_app_date] => 2002-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 8 [patent_no_of_words] => 5989 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/713/06713815.pdf [firstpage_image] =>[orig_patent_app_number] => 10147415 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/147415
Semiconductor device with transistors that convert a voltage difference into a drain current difference May 15, 2002 Issued
Array ( [id] => 5901099 [patent_doc_number] => 20020140080 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof' [patent_app_type] => new [patent_app_number] => 10/147672 [patent_app_country] => US [patent_app_date] => 2002-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 1223 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0140/20020140080.pdf [firstpage_image] =>[orig_patent_app_number] => 10147672 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/147672
Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof May 14, 2002 Issued
Array ( [id] => 1374912 [patent_doc_number] => 06566739 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-05-20 [patent_title] => 'Dual chip package' [patent_app_type] => B2 [patent_app_number] => 10/143071 [patent_app_country] => US [patent_app_date] => 2002-05-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 4228 [patent_no_of_claims] => 5 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 291 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/566/06566739.pdf [firstpage_image] =>[orig_patent_app_number] => 10143071 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/143071
Dual chip package May 9, 2002 Issued
Array ( [id] => 1266563 [patent_doc_number] => 06661089 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-12-09 [patent_title] => 'Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same' [patent_app_type] => B2 [patent_app_number] => 10/137834 [patent_app_country] => US [patent_app_date] => 2002-05-03 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 19 [patent_no_of_words] => 4393 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/661/06661089.pdf [firstpage_image] =>[orig_patent_app_number] => 10137834 [rel_patent_id] =>[rel_patent_doc_number] =>)
10/137834
Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same May 2, 2002 Issued
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