Search

Brian Green

Examiner (ID: 2034)

Most Active Art Unit
3507
Art Unit(s)
3611, 3509, 3311, 3507, 3633, 3305, PQT, 2899, 3628, OPQA
Total Applications
1423
Issued Applications
940
Pending Applications
101
Abandoned Applications
382

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 17270352 [patent_doc_number] => 11195780 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2021-12-07 [patent_title] => Stacked silicon package assembly having thermal management using phase change material [patent_app_type] => utility [patent_app_number] => 16/828822 [patent_app_country] => US [patent_app_date] => 2020-03-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 18 [patent_no_of_words] => 5134 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 53 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16828822 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/828822
Stacked silicon package assembly having thermal management using phase change material Mar 23, 2020 Issued
Array ( [id] => 17270400 [patent_doc_number] => 11195828 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-12-07 [patent_title] => Semiconductor device [patent_app_type] => utility [patent_app_number] => 16/826692 [patent_app_country] => US [patent_app_date] => 2020-03-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 8072 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 95 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16826692 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/826692
Semiconductor device Mar 22, 2020 Issued
Array ( [id] => 17165960 [patent_doc_number] => 11152068 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-19 [patent_title] => Integrated circuit including vertical capacitors [patent_app_type] => utility [patent_app_number] => 16/823414 [patent_app_country] => US [patent_app_date] => 2020-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 4044 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 59 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16823414 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/823414
Integrated circuit including vertical capacitors Mar 18, 2020 Issued
Array ( [id] => 16120623 [patent_doc_number] => 20200212334 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-02 [patent_title] => ORGANIC LIGHT EMITTING DISPLAY DEVICE AND LIGHTING APPARATUS FOR VEHICLES USING THE SAME [patent_app_type] => utility [patent_app_number] => 16/817778 [patent_app_country] => US [patent_app_date] => 2020-03-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8700 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -43 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16817778 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/817778
Organic light emitting display device and lighting apparatus for vehicles using the same Mar 12, 2020 Issued
Array ( [id] => 17150845 [patent_doc_number] => 11143917 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-12 [patent_title] => Display panel and method of fabricating the same [patent_app_type] => utility [patent_app_number] => 16/816144 [patent_app_country] => US [patent_app_date] => 2020-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 30 [patent_figures_cnt] => 30 [patent_no_of_words] => 10072 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 117 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16816144 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/816144
Display panel and method of fabricating the same Mar 10, 2020 Issued
Array ( [id] => 17100167 [patent_doc_number] => 20210287958 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-09-16 [patent_title] => Stiffener Ring [patent_app_type] => utility [patent_app_number] => 16/815546 [patent_app_country] => US [patent_app_date] => 2020-03-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1499 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 12 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16815546 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/815546
Stiffener ring Mar 10, 2020 Issued
Array ( [id] => 18608107 [patent_doc_number] => 11749585 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-09-05 [patent_title] => High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package [patent_app_type] => utility [patent_app_number] => 16/805392 [patent_app_country] => US [patent_app_date] => 2020-02-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 15 [patent_no_of_words] => 6127 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 79 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16805392 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/805392
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package Feb 27, 2020 Issued
Array ( [id] => 17137685 [patent_doc_number] => 11139252 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Semiconductor package and method for manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/802479 [patent_app_country] => US [patent_app_date] => 2020-02-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 36 [patent_figures_cnt] => 71 [patent_no_of_words] => 14418 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 49 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16802479 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/802479
Semiconductor package and method for manufacturing the same Feb 25, 2020 Issued
Array ( [id] => 17055878 [patent_doc_number] => 20210265312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-08-26 [patent_title] => INTEGRATED CIRCUIT DEVICE WITH STACKED DIES HAVING MIRRORED CIRCUITRY [patent_app_type] => utility [patent_app_number] => 16/798267 [patent_app_country] => US [patent_app_date] => 2020-02-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5197 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 66 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16798267 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/798267
Integrated circuit device with stacked dies having mirrored circuitry Feb 20, 2020 Issued
Array ( [id] => 18857340 [patent_doc_number] => 11854935 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2023-12-26 [patent_title] => Enhanced base die heat path using through-silicon vias [patent_app_type] => utility [patent_app_number] => 16/794789 [patent_app_country] => US [patent_app_date] => 2020-02-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 11 [patent_no_of_words] => 6950 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16794789 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/794789
Enhanced base die heat path using through-silicon vias Feb 18, 2020 Issued
Array ( [id] => 16846078 [patent_doc_number] => 11018175 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-05-25 [patent_title] => Solid-state imaging device, method for manufacturing same, and electronic device [patent_app_type] => utility [patent_app_number] => 16/789812 [patent_app_country] => US [patent_app_date] => 2020-02-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 20 [patent_no_of_words] => 14558 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16789812 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/789812
Solid-state imaging device, method for manufacturing same, and electronic device Feb 12, 2020 Issued
Array ( [id] => 17137682 [patent_doc_number] => 11139249 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Semiconductor devices and methods of forming the same [patent_app_type] => utility [patent_app_number] => 16/783392 [patent_app_country] => US [patent_app_date] => 2020-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 20 [patent_figures_cnt] => 21 [patent_no_of_words] => 12325 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 89 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16783392 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/783392
Semiconductor devices and methods of forming the same Feb 5, 2020 Issued
Array ( [id] => 17137691 [patent_doc_number] => 11139258 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-10-05 [patent_title] => Bonding pads with thermal pathways [patent_app_type] => utility [patent_app_number] => 16/782298 [patent_app_country] => US [patent_app_date] => 2020-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 5049 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16782298 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/782298
Bonding pads with thermal pathways Feb 4, 2020 Issued
Array ( [id] => 17551701 [patent_doc_number] => 20220123043 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2022-04-21 [patent_title] => LIGHT EMITTING SUBSTRATE, WIRING SUBSTRATE AND DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 17/281293 [patent_app_country] => US [patent_app_date] => 2020-01-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16375 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 182 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17281293 [rel_patent_id] =>[rel_patent_doc_number] =>)
17/281293
Light emitting substrate, wiring substrate and display device Jan 20, 2020 Issued
Array ( [id] => 17353165 [patent_doc_number] => 11227812 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2022-01-18 [patent_title] => Package and manufacturing method thereof [patent_app_type] => utility [patent_app_number] => 16/745355 [patent_app_country] => US [patent_app_date] => 2020-01-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 28 [patent_no_of_words] => 10040 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16745355 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/745355
Package and manufacturing method thereof Jan 16, 2020 Issued
Array ( [id] => 16180478 [patent_doc_number] => 20200227447 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-16 [patent_title] => SLT Integrated Circuit Capacitor Structure and Methods [patent_app_type] => utility [patent_app_number] => 16/737776 [patent_app_country] => US [patent_app_date] => 2020-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7249 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -16 [patent_words_short_claim] => 150 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16737776 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/737776
SLT integrated circuit capacitor structure and methods Jan 7, 2020 Issued
Array ( [id] => 17196081 [patent_doc_number] => 11164848 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-11-02 [patent_title] => Semiconductor structure and method manufacturing the same [patent_app_type] => utility [patent_app_number] => 16/737869 [patent_app_country] => US [patent_app_date] => 2020-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 42 [patent_figures_cnt] => 65 [patent_no_of_words] => 17860 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16737869 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/737869
Semiconductor structure and method manufacturing the same Jan 7, 2020 Issued
Array ( [id] => 15873597 [patent_doc_number] => 20200144202 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-05-07 [patent_title] => Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices [patent_app_type] => utility [patent_app_number] => 16/734889 [patent_app_country] => US [patent_app_date] => 2020-01-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8793 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16734889 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/734889
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices Jan 5, 2020 Issued
Array ( [id] => 16973754 [patent_doc_number] => 11069736 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-07-20 [patent_title] => Via support structure under pad areas for BSI bondability improvement [patent_app_type] => utility [patent_app_number] => 16/732646 [patent_app_country] => US [patent_app_date] => 2020-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 18 [patent_no_of_words] => 8082 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 83 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16732646 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/732646
Via support structure under pad areas for BSI bondability improvement Jan 1, 2020 Issued
Array ( [id] => 16904807 [patent_doc_number] => 20210183723 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2021-06-17 [patent_title] => SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME [patent_app_type] => utility [patent_app_number] => 16/717933 [patent_app_country] => US [patent_app_date] => 2019-12-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6020 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 151 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16717933 [rel_patent_id] =>[rel_patent_doc_number] =>)
16/717933
Semiconductor package structure and method of manufacturing the same Dec 16, 2019 Issued
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