Brian Sattizahn

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Array ( [id] => 13878725 [patent_doc_number] => 20190035703 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2019-01-31 [patent_title] => Ag UNDERLAYER- ATTACHED METALLIC MEMBER, Ag UNDERLAYER- ATTACHED INSULATING CIRCUIT SUBSTRATE,SEMICONDUCTOR DEVICE, HEAT SINK- ATTACHED INSULATING CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING Ag UNDERLAYER-ATTACHED METALLIC MEMBER [patent_app_type] => utility [patent_app_number] => 16/072660 [patent_app_country] => US [patent_app_date] => 2017-01-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10992 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -5 [patent_words_short_claim] => 81 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16072660 [rel_patent_id] =>[rel_patent_doc_number] =>)

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