Brian Sattizahn
Examiner (ID: 8831)
Most Active Art Unit | 2762 |
Art Unit(s) | 2762 |
Total Applications | 32 |
Issued Applications | 31 |
Pending Applications | 1 |
Abandoned Applications | 0 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 6441776
[patent_doc_number] => 20100038121
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-18
[patent_title] => 'Metal Deposition'
[patent_app_type] => utility
[patent_app_number] => 12/608297
[patent_app_country] => US
[patent_app_date] => 2009-10-29
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0038/20100038121.pdf
[firstpage_image] =>[orig_patent_app_number] => 12608297
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/608297 | Metal Deposition | Oct 28, 2009 | Abandoned |
Array
(
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[patent_doc_number] => 20100038119
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[patent_kind] => A1
[patent_issue_date] => 2010-02-18
[patent_title] => 'Metal Deposition'
[patent_app_type] => utility
[patent_app_number] => 12/608301
[patent_app_country] => US
[patent_app_date] => 2009-10-29
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 12608301
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/608301 | Metal Deposition | Oct 28, 2009 | Abandoned |
Array
(
[id] => 6192411
[patent_doc_number] => 20110024165
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-02-03
[patent_title] => 'SYSTEMS AND METHODS FOR COMPOSITE STRUCTURES WITH EMBEDDED INTERCONNECTS'
[patent_app_type] => utility
[patent_app_number] => 12/606462
[patent_app_country] => US
[patent_app_date] => 2009-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
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[pdf_file] => publications/A1/0024/20110024165.pdf
[firstpage_image] =>[orig_patent_app_number] => 12606462
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/606462 | SYSTEMS AND METHODS FOR COMPOSITE STRUCTURES WITH EMBEDDED INTERCONNECTS | Oct 26, 2009 | Abandoned |
Array
(
[id] => 5978739
[patent_doc_number] => 20110094778
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2011-04-28
[patent_title] => 'CIRCUIT BOARD AND FABRICATION METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 12/606192
[patent_app_country] => US
[patent_app_date] => 2009-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
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[patent_no_of_words] => 3481
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[firstpage_image] =>[orig_patent_app_number] => 12606192
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/606192 | CIRCUIT BOARD AND FABRICATION METHOD THEREOF | Oct 26, 2009 | Abandoned |
Array
(
[id] => 6277960
[patent_doc_number] => 20100155116
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-06-24
[patent_title] => 'PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 12/606546
[patent_app_country] => US
[patent_app_date] => 2009-10-27
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[pdf_file] => publications/A1/0155/20100155116.pdf
[firstpage_image] =>[orig_patent_app_number] => 12606546
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/606546 | Printed wiring board and method for manufacturing the same | Oct 26, 2009 | Issued |
Array
(
[id] => 6441830
[patent_doc_number] => 20100038127
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-02-18
[patent_title] => 'Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery'
[patent_app_type] => utility
[patent_app_number] => 12/605198
[patent_app_country] => US
[patent_app_date] => 2009-10-23
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0038/20100038127.pdf
[firstpage_image] =>[orig_patent_app_number] => 12605198
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/605198 | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery | Oct 22, 2009 | Issued |
Array
(
[id] => 8538623
[patent_doc_number] => 08314344
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-20
[patent_title] => 'Wiring board and manufacturing method of the same'
[patent_app_type] => utility
[patent_app_number] => 12/573256
[patent_app_country] => US
[patent_app_date] => 2009-10-05
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/573256 | Wiring board and manufacturing method of the same | Oct 4, 2009 | Issued |
Array
(
[id] => 8543822
[patent_doc_number] => 08319115
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2012-11-27
[patent_title] => 'Wiring board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 12/562956
[patent_app_country] => US
[patent_app_date] => 2009-09-18
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[patent_no_of_words] => 13899
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[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 12562956
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/562956 | Wiring board and manufacturing method thereof | Sep 17, 2009 | Issued |
Array
(
[id] => 5460921
[patent_doc_number] => 20090321121
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-12-31
[patent_title] => 'CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD'
[patent_app_type] => utility
[patent_app_number] => 12/552389
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[patent_app_date] => 2009-09-02
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[pdf_file] => publications/A1/0321/20090321121.pdf
[firstpage_image] =>[orig_patent_app_number] => 12552389
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/552389 | CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD | Sep 1, 2009 | Abandoned |
Array
(
[id] => 6495442
[patent_doc_number] => 20100012357
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-21
[patent_title] => 'Printed Circuit Board With Improved Via Design'
[patent_app_type] => utility
[patent_app_number] => 12/548933
[patent_app_country] => US
[patent_app_date] => 2009-08-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
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[patent_no_of_words] => 10822
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[pdf_file] => publications/A1/0012/20100012357.pdf
[firstpage_image] =>[orig_patent_app_number] => 12548933
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/548933 | Printed circuit board with improved via design | Aug 26, 2009 | Issued |
Array
(
[id] => 6214741
[patent_doc_number] => 20100051341
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-03-04
[patent_title] => 'Circuit substrate having power/ground plane with grid holes'
[patent_app_type] => utility
[patent_app_number] => 12/583804
[patent_app_country] => US
[patent_app_date] => 2009-08-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => publications/A1/0051/20100051341.pdf
[firstpage_image] =>[orig_patent_app_number] => 12583804
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/583804 | Circuit substrate having power/ground plane with grid holes | Aug 25, 2009 | Issued |
Array
(
[id] => 9009743
[patent_doc_number] => 08525041
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2013-09-03
[patent_title] => 'Multilayer wiring board and method for manufacturing the same'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/543644 | Multilayer wiring board and method for manufacturing the same | Aug 18, 2009 | Issued |
Array
(
[id] => 6129115
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[patent_title] => 'PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/544100 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | Aug 18, 2009 | Abandoned |
Array
(
[id] => 5364216
[patent_doc_number] => 20090301775
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[patent_issue_date] => 2009-12-10
[patent_title] => 'Wired circuit board and electronic device'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/461576 | Wired circuit board and electronic device | Aug 16, 2009 | Abandoned |
Array
(
[id] => 8876188
[patent_doc_number] => 08471154
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[patent_kind] => B1
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[patent_title] => 'Stackable variable height via package and method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/537048 | Stackable variable height via package and method | Aug 5, 2009 | Issued |
Array
(
[id] => 6627952
[patent_doc_number] => 20100035021
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[patent_title] => 'Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/461268 | Method of manufacturing a substrate, substrate, device provided with a substrate, and determining method | Aug 4, 2009 | Issued |
Array
(
[id] => 4600400
[patent_doc_number] => 07977578
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-07-12
[patent_title] => 'Tab tape for tape carrier package'
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[patent_app_number] => 12/458936
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/458936 | Tab tape for tape carrier package | Jul 27, 2009 | Issued |
Array
(
[id] => 6147617
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/508145 | Z-directed pass-through components for printed circuit boards | Jul 22, 2009 | Issued |
Array
(
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Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 12/490077 | Circuit substrate and method of fabricating the same and chip package structure | Jun 22, 2009 | Issued |