Brian Sattizahn

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Array ( [id] => 4883258 [patent_doc_number] => 20080257590 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2008-10-23 [patent_title] => 'HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF' [patent_app_type] => utility [patent_app_number] => 12/034564 [patent_app_country] => US [patent_app_date] => 2008-02-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 4138 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0257/20080257590.pdf [firstpage_image] =>[orig_patent_app_number] => 12034564 [rel_patent_id] =>[rel_patent_doc_number] =>)

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