Brian Sattizahn
Examiner (ID: 8831)
Most Active Art Unit | 2762 |
Art Unit(s) | 2762 |
Total Applications | 32 |
Issued Applications | 31 |
Pending Applications | 1 |
Abandoned Applications | 0 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5256197
[patent_doc_number] => 20070209829
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-13
[patent_title] => 'Suspension board with circuit'
[patent_app_type] => utility
[patent_app_number] => 11/713053
[patent_app_country] => US
[patent_app_date] => 2007-03-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 7855
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0209/20070209829.pdf
[firstpage_image] =>[orig_patent_app_number] => 11713053
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/713053 | Suspension board with circuit | Mar 1, 2007 | Issued |
Array
(
[id] => 4803180
[patent_doc_number] => 20080014768
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-01-17
[patent_title] => 'Rigid-flexible printed circuit board and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/708456
[patent_app_country] => US
[patent_app_date] => 2007-02-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 23
[patent_figures_cnt] => 23
[patent_no_of_words] => 6058
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 4
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0014/20080014768.pdf
[firstpage_image] =>[orig_patent_app_number] => 11708456
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/708456 | Rigid-flexible printed circuit board and method of manufacturing the same | Feb 20, 2007 | Abandoned |
Array
(
[id] => 5257771
[patent_doc_number] => 20070211403
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-13
[patent_title] => 'Molded high impedance surface'
[patent_app_type] => utility
[patent_app_number] => 11/708970
[patent_app_country] => US
[patent_app_date] => 2007-02-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 5101
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0211/20070211403.pdf
[firstpage_image] =>[orig_patent_app_number] => 11708970
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/708970 | Molded high impedance surface | Feb 19, 2007 | Abandoned |
Array
(
[id] => 5233419
[patent_doc_number] => 20070125574
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-06-07
[patent_title] => 'PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/672245
[patent_app_country] => US
[patent_app_date] => 2007-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 4893
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 10
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0125/20070125574.pdf
[firstpage_image] =>[orig_patent_app_number] => 11672245
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/672245 | PRINTED CIRCUIT BOARD HAVING EMBEDDED CAPACITORS USING HYBRID MATERIAL AND METHOD OF MANUFACTURING THE SAME | Feb 6, 2007 | Abandoned |
Array
(
[id] => 6584087
[patent_doc_number] => 20100000768
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2010-01-07
[patent_title] => 'LEAD-EMBEDDED METALLIZED CERAMICS SUBSTRATE AND PACKAGE'
[patent_app_type] => utility
[patent_app_number] => 12/279073
[patent_app_country] => US
[patent_app_date] => 2007-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 7797
[patent_no_of_claims] => 9
[patent_no_of_ind_claims] => 2
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0000/20100000768.pdf
[firstpage_image] =>[orig_patent_app_number] => 12279073
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/279073 | Lead-embedded metallized ceramics substrate and package | Feb 6, 2007 | Issued |
Array
(
[id] => 185536
[patent_doc_number] => 07649143
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-01-19
[patent_title] => 'Wired-circuit-board assembly sheet'
[patent_app_type] => utility
[patent_app_number] => 11/654547
[patent_app_country] => US
[patent_app_date] => 2007-01-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 10
[patent_no_of_words] => 7617
[patent_no_of_claims] => 6
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/649/07649143.pdf
[firstpage_image] =>[orig_patent_app_number] => 11654547
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/654547 | Wired-circuit-board assembly sheet | Jan 17, 2007 | Issued |
Array
(
[id] => 4970954
[patent_doc_number] => 20070110956
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-17
[patent_title] => 'MULTILAYER CERAMIC SUBSTRATE AND ITS PRODUCTION METHOD'
[patent_app_type] => utility
[patent_app_number] => 11/622795
[patent_app_country] => US
[patent_app_date] => 2007-01-12
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 5398
[patent_no_of_claims] => 5
[patent_no_of_ind_claims] => 1
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0110/20070110956.pdf
[firstpage_image] =>[orig_patent_app_number] => 11622795
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/622795 | MULTILAYER CERAMIC SUBSTRATE AND ITS PRODUCTION METHOD | Jan 11, 2007 | Abandoned |
Array
(
[id] => 4807603
[patent_doc_number] => 20080171181
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-07-17
[patent_title] => 'High-current traces on plated molded interconnect device'
[patent_app_type] => utility
[patent_app_number] => 11/652361
[patent_app_country] => US
[patent_app_date] => 2007-01-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 3220
[patent_no_of_claims] => 30
[patent_no_of_ind_claims] => 4
[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0171/20080171181.pdf
[firstpage_image] =>[orig_patent_app_number] => 11652361
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/652361 | High-current traces on plated molded interconnect device | Jan 10, 2007 | Abandoned |
Array
(
[id] => 4810023
[patent_doc_number] => 20080190654
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-08-14
[patent_title] => 'Printed Wiring Board'
[patent_app_type] => utility
[patent_app_number] => 11/621273
[patent_app_country] => US
[patent_app_date] => 2007-01-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3946
[patent_no_of_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0190/20080190654.pdf
[firstpage_image] =>[orig_patent_app_number] => 11621273
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/621273 | Printed Wiring Board | Jan 8, 2007 | Abandoned |
Array
(
[id] => 5059767
[patent_doc_number] => 20070221403
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-09-27
[patent_title] => 'SIGNAL TRANSMISSION STRUCTURE, PACKAGE STRUCTURE AND BONDING METHOD THEREOF'
[patent_app_type] => utility
[patent_app_number] => 11/620430
[patent_app_country] => US
[patent_app_date] => 2007-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 6
[patent_figures_cnt] => 6
[patent_no_of_words] => 3234
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0221/20070221403.pdf
[firstpage_image] =>[orig_patent_app_number] => 11620430
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/620430 | Signal transmission structure, package structure and bonding method thereof | Jan 4, 2007 | Issued |
Array
(
[id] => 5217527
[patent_doc_number] => 20070158838
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/649870
[patent_app_country] => US
[patent_app_date] => 2007-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 7
[patent_no_of_words] => 6690
[patent_no_of_claims] => 17
[patent_no_of_ind_claims] => 3
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0158/20070158838.pdf
[firstpage_image] =>[orig_patent_app_number] => 11649870
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/649870 | Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same | Jan 4, 2007 | Abandoned |
Array
(
[id] => 5002172
[patent_doc_number] => 20070199736
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-30
[patent_title] => 'SUBSTRATE WITH MULTILAYER PLATED THROUGH HOLE AND METHOD FOR FORMING THE MULTILAYER PLATED THROUGH HOLE'
[patent_app_type] => utility
[patent_app_number] => 11/620031
[patent_app_country] => US
[patent_app_date] => 2007-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 10
[patent_figures_cnt] => 10
[patent_no_of_words] => 2566
[patent_no_of_claims] => 4
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[pdf_file] => publications/A1/0199/20070199736.pdf
[firstpage_image] =>[orig_patent_app_number] => 11620031
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/620031 | Substrate with multilayer plated through hole and method for forming the multilayer plated through hole | Jan 3, 2007 | Issued |
Array
(
[id] => 4908
[patent_doc_number] => 07816611
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-10-19
[patent_title] => 'Circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/619860
[patent_app_country] => US
[patent_app_date] => 2007-01-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[pdf_file] => patents/07/816/07816611.pdf
[firstpage_image] =>[orig_patent_app_number] => 11619860
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/619860 | Circuit board | Jan 3, 2007 | Issued |
Array
(
[id] => 5157542
[patent_doc_number] => 20070170586
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-26
[patent_title] => 'Printed circuit board for semiconductor package and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/646552
[patent_app_country] => US
[patent_app_date] => 2006-12-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
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[patent_no_of_words] => 6694
[patent_no_of_claims] => 28
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[pdf_file] => publications/A1/0170/20070170586.pdf
[firstpage_image] =>[orig_patent_app_number] => 11646552
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/646552 | Printed circuit board for semiconductor package and method of manufacturing the same | Dec 27, 2006 | Abandoned |
Array
(
[id] => 4461964
[patent_doc_number] => 07880091
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2011-02-01
[patent_title] => 'Electronic device substrate, electronic device and methods for making same'
[patent_app_type] => utility
[patent_app_number] => 11/645948
[patent_app_country] => US
[patent_app_date] => 2006-12-27
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[patent_drawing_sheets_cnt] => 13
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[pdf_file] => patents/07/880/07880091.pdf
[firstpage_image] =>[orig_patent_app_number] => 11645948
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/645948 | Electronic device substrate, electronic device and methods for making same | Dec 26, 2006 | Issued |
Array
(
[id] => 4875989
[patent_doc_number] => 20080149371
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-26
[patent_title] => 'Flexible circuit'
[patent_app_type] => utility
[patent_app_number] => 11/644548
[patent_app_country] => US
[patent_app_date] => 2006-12-22
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[pdf_file] => publications/A1/0149/20080149371.pdf
[firstpage_image] =>[orig_patent_app_number] => 11644548
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/644548 | Flexible circuit | Dec 21, 2006 | Abandoned |
Array
(
[id] => 5031024
[patent_doc_number] => 20070095563
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-03
[patent_title] => 'Circuit board having deformation interrupting section and circuit board forming method'
[patent_app_type] => utility
[patent_app_number] => 11/640656
[patent_app_country] => US
[patent_app_date] => 2006-12-18
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0095/20070095563.pdf
[firstpage_image] =>[orig_patent_app_number] => 11640656
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/640656 | Circuit board having deformation interrupting section and circuit board forming method | Dec 17, 2006 | Abandoned |
Array
(
[id] => 133545
[patent_doc_number] => 07696441
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-13
[patent_title] => 'Flexible wired circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/638475
[patent_app_country] => US
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[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/07/696/07696441.pdf
[firstpage_image] =>[orig_patent_app_number] => 11638475
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/638475 | Flexible wired circuit board | Dec 13, 2006 | Issued |
Array
(
[id] => 8122063
[patent_doc_number] => 20120085579
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2012-04-12
[patent_title] => 'ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER'
[patent_app_type] => utility
[patent_app_number] => 12/159323
[patent_app_country] => US
[patent_app_date] => 2006-12-14
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[pdf_file] => publications/A1/0085/20120085579.pdf
[firstpage_image] =>[orig_patent_app_number] => 12159323
[rel_patent_id] =>[rel_patent_doc_number] =>) 12/159323 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER | Dec 13, 2006 | Abandoned |
Array
(
[id] => 4781953
[patent_doc_number] => 20080135282
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-06-12
[patent_title] => 'PRINTED MULTILAYER CIRCUIT CONTAINING ACTIVE DEVICES AND METHOD OF MANUFATURING'
[patent_app_type] => utility
[patent_app_number] => 11/609069
[patent_app_country] => US
[patent_app_date] => 2006-12-11
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[patent_no_of_words] => 2810
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[pdf_file] => publications/A1/0135/20080135282.pdf
[firstpage_image] =>[orig_patent_app_number] => 11609069
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/609069 | PRINTED MULTILAYER CIRCUIT CONTAINING ACTIVE DEVICES AND METHOD OF MANUFATURING | Dec 10, 2006 | Abandoned |