Brian Sattizahn
Examiner (ID: 8831)
Most Active Art Unit | 2762 |
Art Unit(s) | 2762 |
Total Applications | 32 |
Issued Applications | 31 |
Pending Applications | 1 |
Abandoned Applications | 0 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5065312
[patent_doc_number] => 20070186413
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'Circuit board structure and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/543545
[patent_app_country] => US
[patent_app_date] => 2006-10-04
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 4945
[patent_no_of_claims] => 38
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[patent_words_short_claim] => 0
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0186/20070186413.pdf
[firstpage_image] =>[orig_patent_app_number] => 11543545
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/543545 | Circuit board structure and method for fabricating the same | Oct 3, 2006 | Abandoned |
Array
(
[id] => 4941248
[patent_doc_number] => 20080078570
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2008-04-03
[patent_title] => 'Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing'
[patent_app_type] => utility
[patent_app_number] => 11/541776
[patent_app_country] => US
[patent_app_date] => 2006-10-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 4
[patent_no_of_words] => 12939
[patent_no_of_claims] => 32
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[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0078/20080078570.pdf
[firstpage_image] =>[orig_patent_app_number] => 11541776
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/541776 | Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same | Oct 2, 2006 | Issued |
Array
(
[id] => 5082386
[patent_doc_number] => 20070272436
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-11-29
[patent_title] => 'Printed circuit board unit'
[patent_app_type] => utility
[patent_app_number] => 11/528349
[patent_app_country] => US
[patent_app_date] => 2006-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 4516
[patent_no_of_claims] => 15
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0272/20070272436.pdf
[firstpage_image] =>[orig_patent_app_number] => 11528349
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/528349 | Printed circuit board unit | Sep 27, 2006 | Abandoned |
Array
(
[id] => 5168269
[patent_doc_number] => 20070068700
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-29
[patent_title] => 'Electric contact and method for producing the same and connector using the electric contacts'
[patent_app_type] => utility
[patent_app_number] => 11/527852
[patent_app_country] => US
[patent_app_date] => 2006-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 30
[patent_figures_cnt] => 30
[patent_no_of_words] => 25485
[patent_no_of_claims] => 31
[patent_no_of_ind_claims] => 12
[patent_words_short_claim] => 0
[patent_maintenance] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0068/20070068700.pdf
[firstpage_image] =>[orig_patent_app_number] => 11527852
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/527852 | Electric contact and method for producing the same and connector using the electric contacts | Sep 25, 2006 | Abandoned |
Array
(
[id] => 5122944
[patent_doc_number] => 20070235213
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-10-11
[patent_title] => '2-Layer printed circuit board and method of manufacturing the same'
[patent_app_type] => utility
[patent_app_number] => 11/524378
[patent_app_country] => US
[patent_app_date] => 2006-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[patent_no_of_words] => 4211
[patent_no_of_claims] => 17
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[pdf_file] => publications/A1/0235/20070235213.pdf
[firstpage_image] =>[orig_patent_app_number] => 11524378
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/524378 | 2-Layer printed circuit board and method of manufacturing the same | Sep 20, 2006 | Abandoned |
Array
(
[id] => 5530076
[patent_doc_number] => 20090229864
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-09-17
[patent_title] => 'INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK'
[patent_app_type] => utility
[patent_app_number] => 11/720658
[patent_app_country] => US
[patent_app_date] => 2006-09-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 2
[patent_figures_cnt] => 2
[patent_no_of_words] => 8628
[patent_no_of_claims] => 11
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0229/20090229864.pdf
[firstpage_image] =>[orig_patent_app_number] => 11720658
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/720658 | INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK | Sep 14, 2006 | Abandoned |
Array
(
[id] => 5037619
[patent_doc_number] => 20070089901
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-26
[patent_title] => 'Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component'
[patent_app_type] => utility
[patent_app_number] => 11/521625
[patent_app_country] => US
[patent_app_date] => 2006-09-14
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 3
[patent_no_of_words] => 1648
[patent_no_of_claims] => 4
[patent_no_of_ind_claims] => 1
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0089/20070089901.pdf
[firstpage_image] =>[orig_patent_app_number] => 11521625
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/521625 | Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component | Sep 13, 2006 | Abandoned |
Array
(
[id] => 123765
[patent_doc_number] => 07705245
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-04-27
[patent_title] => 'Electronic device substrate and its fabrication method, and electronic device and its fabrication method'
[patent_app_type] => utility
[patent_app_number] => 11/530344
[patent_app_country] => US
[patent_app_date] => 2006-09-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 7
[patent_figures_cnt] => 33
[patent_no_of_words] => 5709
[patent_no_of_claims] => 12
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 107
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/705/07705245.pdf
[firstpage_image] =>[orig_patent_app_number] => 11530344
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/530344 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method | Sep 7, 2006 | Issued |
Array
(
[id] => 247292
[patent_doc_number] => 07586046
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-09-08
[patent_title] => 'Wired circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/514963
[patent_app_country] => US
[patent_app_date] => 2006-09-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
[patent_figures_cnt] => 5
[patent_no_of_words] => 5495
[patent_no_of_claims] => 2
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/586/07586046.pdf
[firstpage_image] =>[orig_patent_app_number] => 11514963
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/514963 | Wired circuit board | Sep 4, 2006 | Issued |
Array
(
[id] => 5214102
[patent_doc_number] => 20070103182
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-05-10
[patent_title] => 'Circuit Board, Electronic Device Including a Circuit Board, and Method of Manufacturing a Circuit Board'
[patent_app_type] => utility
[patent_app_number] => 11/466942
[patent_app_country] => US
[patent_app_date] => 2006-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 11
[patent_figures_cnt] => 11
[patent_no_of_words] => 16127
[patent_no_of_claims] => 19
[patent_no_of_ind_claims] => 3
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0103/20070103182.pdf
[firstpage_image] =>[orig_patent_app_number] => 11466942
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/466942 | Circuit board, electronic device including a circuit board, and method of manufacturing a circuit board | Aug 23, 2006 | Issued |
Array
(
[id] => 5293208
[patent_doc_number] => 20090008134
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-01-08
[patent_title] => 'Module'
[patent_app_type] => utility
[patent_app_number] => 11/631348
[patent_app_country] => US
[patent_app_date] => 2006-08-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 2096
[patent_no_of_claims] => 2
[patent_no_of_ind_claims] => 1
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0008/20090008134.pdf
[firstpage_image] =>[orig_patent_app_number] => 11631348
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/631348 | Module | Aug 23, 2006 | Abandoned |
Array
(
[id] => 5149000
[patent_doc_number] => 20070049060
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'Printed circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/508277
[patent_app_country] => US
[patent_app_date] => 2006-08-23
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[pdf_file] => publications/A1/0049/20070049060.pdf
[firstpage_image] =>[orig_patent_app_number] => 11508277
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/508277 | Printed circuit board and manufacturing method thereof | Aug 22, 2006 | Issued |
Array
(
[id] => 345332
[patent_doc_number] => 07498522
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-03
[patent_title] => 'Multilayer printed circuit board and manufacturing method thereof'
[patent_app_type] => utility
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[patent_app_country] => US
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[pdf_file] => patents/07/498/07498522.pdf
[firstpage_image] =>[orig_patent_app_number] => 11507478
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/507478 | Multilayer printed circuit board and manufacturing method thereof | Aug 21, 2006 | Issued |
Array
(
[id] => 5406775
[patent_doc_number] => 20090120673
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-05-14
[patent_title] => 'Multilayer circuit board and electronic device'
[patent_app_type] => utility
[patent_app_number] => 11/990860
[patent_app_country] => US
[patent_app_date] => 2006-08-18
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
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[pdf_file] => publications/A1/0120/20090120673.pdf
[firstpage_image] =>[orig_patent_app_number] => 11990860
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/990860 | Multilayer circuit board and electronic device | Aug 17, 2006 | Issued |
Array
(
[id] => 5163119
[patent_doc_number] => 20070284700
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-12-13
[patent_title] => 'Coatings and methods for inhibiting tin whisker growth'
[patent_app_type] => utility
[patent_app_number] => 11/506541
[patent_app_country] => US
[patent_app_date] => 2006-08-18
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[pdf_file] => publications/A1/0284/20070284700.pdf
[firstpage_image] =>[orig_patent_app_number] => 11506541
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/506541 | Coatings and methods for inhibiting tin whisker growth | Aug 17, 2006 | Abandoned |
Array
(
[id] => 5145757
[patent_doc_number] => 20070045811
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-01
[patent_title] => 'LAMINATED PRODUCT IN STRUCTURE INCLUDING GLASS-CLOTH CONTAINED RESIN LAYER AND METHOD FOR MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 11/463166
[patent_app_country] => US
[patent_app_date] => 2006-08-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 4
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[pdf_file] => publications/A1/0045/20070045811.pdf
[firstpage_image] =>[orig_patent_app_number] => 11463166
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/463166 | LAMINATED PRODUCT IN STRUCTURE INCLUDING GLASS-CLOTH CONTAINED RESIN LAYER AND METHOD FOR MANUFACTURING THE SAME | Aug 7, 2006 | Abandoned |
Array
(
[id] => 334503
[patent_doc_number] => 07507915
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-03-24
[patent_title] => 'Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/462604
[patent_app_country] => US
[patent_app_date] => 2006-08-04
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[pdf_file] => patents/07/507/07507915.pdf
[firstpage_image] =>[orig_patent_app_number] => 11462604
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/462604 | Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same | Aug 3, 2006 | Issued |
Array
(
[id] => 282040
[patent_doc_number] => 07554040
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-06-30
[patent_title] => 'Printed circuit board and soldering method and apparatus'
[patent_app_type] => utility
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[patent_app_country] => US
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[pdf_file] => patents/07/554/07554040.pdf
[firstpage_image] =>[orig_patent_app_number] => 11460943
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/460943 | Printed circuit board and soldering method and apparatus | Jul 27, 2006 | Issued |
Array
(
[id] => 5431483
[patent_doc_number] => 20090166069
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2009-07-02
[patent_title] => 'Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure'
[patent_app_type] => utility
[patent_app_number] => 11/989453
[patent_app_country] => US
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[pdf_file] => publications/A1/0166/20090166069.pdf
[firstpage_image] =>[orig_patent_app_number] => 11989453
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/989453 | Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure | Jul 20, 2006 | Abandoned |
Array
(
[id] => 415454
[patent_doc_number] => 07279639
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-09
[patent_title] => 'Superconducting cable joint structure'
[patent_app_type] => utility
[patent_app_number] => 11/489638
[patent_app_country] => US
[patent_app_date] => 2006-07-20
[patent_effective_date] => 0000-00-00
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/279/07279639.pdf
[firstpage_image] =>[orig_patent_app_number] => 11489638
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/489638 | Superconducting cable joint structure | Jul 19, 2006 | Issued |