Brian Sattizahn
Examiner (ID: 8831)
Most Active Art Unit | 2762 |
Art Unit(s) | 2762 |
Total Applications | 32 |
Issued Applications | 31 |
Pending Applications | 1 |
Abandoned Applications | 0 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 5652170
[patent_doc_number] => 20060137905
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-06-29
[patent_title] => 'Multilayer printed wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/356350
[patent_app_country] => US
[patent_app_date] => 2006-02-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 18
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[pdf_file] => publications/A1/0137/20060137905.pdf
[firstpage_image] =>[orig_patent_app_number] => 11356350
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/356350 | Multilayer printed wiring board | Feb 16, 2006 | Issued |
Array
(
[id] => 5619169
[patent_doc_number] => 20060188702
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-24
[patent_title] => 'Electronic apparatus including printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/354132
[patent_app_country] => US
[patent_app_date] => 2006-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 15
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[pdf_file] => publications/A1/0188/20060188702.pdf
[firstpage_image] =>[orig_patent_app_number] => 11354132
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/354132 | Electronic apparatus including printed circuit board | Feb 14, 2006 | Abandoned |
Array
(
[id] => 5705409
[patent_doc_number] => 20060194457
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'Structure using soldering and soldering method'
[patent_app_type] => utility
[patent_app_number] => 11/350863
[patent_app_country] => US
[patent_app_date] => 2006-02-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
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[pdf_file] => publications/A1/0194/20060194457.pdf
[firstpage_image] =>[orig_patent_app_number] => 11350863
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/350863 | Structure using soldering and soldering method | Feb 9, 2006 | Abandoned |
Array
(
[id] => 5069720
[patent_doc_number] => 20070190822
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-08-16
[patent_title] => 'Low profile compliant leads'
[patent_app_type] => utility
[patent_app_number] => 11/350276
[patent_app_country] => US
[patent_app_date] => 2006-02-09
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
[patent_figures_cnt] => 5
[patent_no_of_words] => 5185
[patent_no_of_claims] => 25
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0190/20070190822.pdf
[firstpage_image] =>[orig_patent_app_number] => 11350276
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/350276 | Low profile compliant leads | Feb 8, 2006 | Issued |
Array
(
[id] => 5669730
[patent_doc_number] => 20060175083
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-10
[patent_title] => 'Wiring board and capacitor to be built into wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/350285
[patent_app_country] => US
[patent_app_date] => 2006-02-09
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[pdf_file] => publications/A1/0175/20060175083.pdf
[firstpage_image] =>[orig_patent_app_number] => 11350285
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/350285 | Wiring board and capacitor to be built into wiring board | Feb 8, 2006 | Issued |
Array
(
[id] => 5670715
[patent_doc_number] => 20060176069
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-10
[patent_title] => 'Wired circuit board and producing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/349188
[patent_app_country] => US
[patent_app_date] => 2006-02-08
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[patent_drawing_sheets_cnt] => 10
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[pdf_file] => publications/A1/0176/20060176069.pdf
[firstpage_image] =>[orig_patent_app_number] => 11349188
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/349188 | Wired circuit board and producing method thereof | Feb 7, 2006 | Issued |
Array
(
[id] => 5702663
[patent_doc_number] => 20060191709
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-08-31
[patent_title] => 'Printed circuit board, flip chip ball grid array board and method of fabricating the same'
[patent_app_type] => utility
[patent_app_number] => 11/349654
[patent_app_country] => US
[patent_app_date] => 2006-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 3563
[patent_no_of_claims] => 9
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0191/20060191709.pdf
[firstpage_image] =>[orig_patent_app_number] => 11349654
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/349654 | Printed circuit board, flip chip ball grid array board and method of fabricating the same | Feb 6, 2006 | Abandoned |
Array
(
[id] => 5151519
[patent_doc_number] => 20070034401
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-02-15
[patent_title] => 'Circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/342845
[patent_app_country] => US
[patent_app_date] => 2006-01-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0034/20070034401.pdf
[firstpage_image] =>[orig_patent_app_number] => 11342845
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/342845 | Circuit board and manufacturing method thereof | Jan 30, 2006 | Abandoned |
Array
(
[id] => 82574
[patent_doc_number] => 07745736
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-29
[patent_title] => 'Interconnecting substrate and semiconductor device'
[patent_app_type] => utility
[patent_app_number] => 11/341445
[patent_app_country] => US
[patent_app_date] => 2006-01-30
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[pdf_file] => patents/07/745/07745736.pdf
[firstpage_image] =>[orig_patent_app_number] => 11341445
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/341445 | Interconnecting substrate and semiconductor device | Jan 29, 2006 | Issued |
Array
(
[id] => 252918
[patent_doc_number] => 07579552
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2009-08-25
[patent_title] => 'Tab tape for tape carrier package'
[patent_app_type] => utility
[patent_app_number] => 11/341614
[patent_app_country] => US
[patent_app_date] => 2006-01-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 3114
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/579/07579552.pdf
[firstpage_image] =>[orig_patent_app_number] => 11341614
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/341614 | Tab tape for tape carrier package | Jan 29, 2006 | Issued |
Array
(
[id] => 5134719
[patent_doc_number] => 20070076348
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-04-05
[patent_title] => 'Interposer and electronic device fabrication method'
[patent_app_type] => utility
[patent_app_number] => 11/339661
[patent_app_country] => US
[patent_app_date] => 2006-01-26
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0076/20070076348.pdf
[firstpage_image] =>[orig_patent_app_number] => 11339661
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/339661 | Interposer and electronic device fabrication method | Jan 25, 2006 | Issued |
Array
(
[id] => 92763
[patent_doc_number] => 07737367
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2010-06-15
[patent_title] => 'Multilayer circuit board and manufacturing method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/338771
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[pdf_file] => patents/07/737/07737367.pdf
[firstpage_image] =>[orig_patent_app_number] => 11338771
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/338771 | Multilayer circuit board and manufacturing method thereof | Jan 24, 2006 | Issued |
Array
(
[id] => 561971
[patent_doc_number] => 07470863
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-12-30
[patent_title] => 'Microelectronic device with mixed dielectric'
[patent_app_type] => utility
[patent_app_number] => 11/338402
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[pdf_file] => patents/07/470/07470863.pdf
[firstpage_image] =>[orig_patent_app_number] => 11338402
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/338402 | Microelectronic device with mixed dielectric | Jan 23, 2006 | Issued |
Array
(
[id] => 602688
[patent_doc_number] => 07432451
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-10-07
[patent_title] => 'Electro-optical device, circuit board, mounting structure, and electronic apparatus'
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/07/432/07432451.pdf
[firstpage_image] =>[orig_patent_app_number] => 11337470
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/337470 | Electro-optical device, circuit board, mounting structure, and electronic apparatus | Jan 23, 2006 | Issued |
Array
(
[id] => 857096
[patent_doc_number] => 07375289
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-05-20
[patent_title] => 'Multi-layer printed wiring board including an alignment mark as an index for a position of via holes'
[patent_app_type] => utility
[patent_app_number] => 11/331268
[patent_app_country] => US
[patent_app_date] => 2006-01-13
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[pdf_file] => patents/07/375/07375289.pdf
[firstpage_image] =>[orig_patent_app_number] => 11331268
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/331268 | Multi-layer printed wiring board including an alignment mark as an index for a position of via holes | Jan 12, 2006 | Issued |
Array
(
[id] => 5216791
[patent_doc_number] => 20070158102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-07-12
[patent_title] => 'Method of attaching a high power surface mount transistor to a printed circuit board'
[patent_app_type] => utility
[patent_app_number] => 11/330774
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[pdf_file] => publications/A1/0158/20070158102.pdf
[firstpage_image] =>[orig_patent_app_number] => 11330774
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/330774 | Method of attaching a high power surface mount transistor to a printed circuit board | Jan 11, 2006 | Issued |
Array
(
[id] => 5593355
[patent_doc_number] => 20060157271
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-20
[patent_title] => 'Double-sided flexible printed circuits'
[patent_app_type] => utility
[patent_app_number] => 11/330157
[patent_app_country] => US
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[pdf_file] => publications/A1/0157/20060157271.pdf
[firstpage_image] =>[orig_patent_app_number] => 11330157
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/330157 | Double-sided flexible printed circuits | Jan 11, 2006 | Issued |
Array
(
[id] => 5593354
[patent_doc_number] => 20060157270
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-20
[patent_title] => 'Printed wiring substrate and method for identifying printed wiring substrate'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 11329070
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/329070 | Printed wiring substrate and method for identifying printed wiring substrate | Jan 10, 2006 | Abandoned |
Array
(
[id] => 5103855
[patent_doc_number] => 20070062730
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2007-03-22
[patent_title] => 'CONTROLLED DEPTH ETCHED VIAS'
[patent_app_type] => utility
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[pdf_file] => publications/A1/0062/20070062730.pdf
[firstpage_image] =>[orig_patent_app_number] => 11306730
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/306730 | CONTROLLED DEPTH ETCHED VIAS | Jan 8, 2006 | Abandoned |
Array
(
[id] => 5691061
[patent_doc_number] => 20060151206
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2006-07-13
[patent_title] => 'Semiconductor device and manufacturing method therefor'
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[patent_current_assignee] =>[type] => publication
[pdf_file] => publications/A1/0151/20060151206.pdf
[firstpage_image] =>[orig_patent_app_number] => 11324635
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/324635 | Semiconductor device and manufacturing method therefor | Jan 3, 2006 | Abandoned |