Brian Sattizahn
Examiner (ID: 8831)
Most Active Art Unit | 2762 |
Art Unit(s) | 2762 |
Total Applications | 32 |
Issued Applications | 31 |
Pending Applications | 1 |
Abandoned Applications | 0 |
Applications
Application number | Title of the application | Filing Date | Status |
---|---|---|---|
Array
(
[id] => 7093826
[patent_doc_number] => 20050126818
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-16
[patent_title] => 'Multilayer wiring board'
[patent_app_type] => utility
[patent_app_number] => 11/012326
[patent_app_country] => US
[patent_app_date] => 2004-12-16
[patent_effective_date] => 0000-00-00
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[pdf_file] => publications/A1/0126/20050126818.pdf
[firstpage_image] =>[orig_patent_app_number] => 11012326
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/012326 | Multilayer wiring board | Dec 15, 2004 | Issued |
Array
(
[id] => 7230169
[patent_doc_number] => 20050139055
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-06-30
[patent_title] => 'Wired circuit board holding sheet and production method thereof'
[patent_app_type] => utility
[patent_app_number] => 11/011952
[patent_app_country] => US
[patent_app_date] => 2004-12-15
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[pdf_file] => publications/A1/0139/20050139055.pdf
[firstpage_image] =>[orig_patent_app_number] => 11011952
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/011952 | Wired circuit board holding sheet and production method thereof | Dec 14, 2004 | Issued |
Array
(
[id] => 6918670
[patent_doc_number] => 20050096231
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-05-05
[patent_title] => 'Superconducting cable'
[patent_app_type] => utility
[patent_app_number] => 11/012623
[patent_app_country] => US
[patent_app_date] => 2004-12-15
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[firstpage_image] =>[orig_patent_app_number] => 11012623
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/012623 | Superconducting cable | Dec 14, 2004 | Issued |
Array
(
[id] => 404882
[patent_doc_number] => 07288715
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-10-30
[patent_title] => 'High-vacuum-maintaining structure of superconducting cable'
[patent_app_type] => utility
[patent_app_number] => 11/003655
[patent_app_country] => US
[patent_app_date] => 2004-12-03
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[pdf_file] => patents/07/288/07288715.pdf
[firstpage_image] =>[orig_patent_app_number] => 11003655
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/003655 | High-vacuum-maintaining structure of superconducting cable | Dec 2, 2004 | Issued |
Array
(
[id] => 888747
[patent_doc_number] => 07348496
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2008-03-25
[patent_title] => 'Circuit board with organic dielectric layer'
[patent_app_type] => utility
[patent_app_number] => 11/003956
[patent_app_country] => US
[patent_app_date] => 2004-12-03
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[pdf_file] => patents/07/348/07348496.pdf
[firstpage_image] =>[orig_patent_app_number] => 11003956
[rel_patent_id] =>[rel_patent_doc_number] =>) 11/003956 | Circuit board with organic dielectric layer | Dec 2, 2004 | Issued |
Array
(
[id] => 915053
[patent_doc_number] => 07326857
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[patent_kind] => B2
[patent_issue_date] => 2008-02-05
[patent_title] => 'Method and structure for creating printed circuit boards with stepped thickness'
[patent_app_type] => utility
[patent_app_number] => 10/992399
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[pdf_file] => patents/07/326/07326857.pdf
[firstpage_image] =>[orig_patent_app_number] => 10992399
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/992399 | Method and structure for creating printed circuit boards with stepped thickness | Nov 17, 2004 | Issued |
Array
(
[id] => 440020
[patent_doc_number] => 07259335
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2007-08-21
[patent_title] => 'Solder-bearing wafer for use in soldering operations'
[patent_app_type] => utility
[patent_app_number] => 10/982986
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[patent_app_date] => 2004-11-04
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[pdf_file] => patents/07/259/07259335.pdf
[firstpage_image] =>[orig_patent_app_number] => 10982986
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/982986 | Solder-bearing wafer for use in soldering operations | Nov 3, 2004 | Issued |
Array
(
[id] => 935565
[patent_doc_number] => 06974915
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2005-12-13
[patent_title] => 'Printed wiring board interposer sub-assembly and method'
[patent_app_type] => utility
[patent_app_number] => 10/979366
[patent_app_country] => US
[patent_app_date] => 2004-11-01
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[patent_drawing_sheets_cnt] => 4
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/974/06974915.pdf
[firstpage_image] =>[orig_patent_app_number] => 10979366
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/979366 | Printed wiring board interposer sub-assembly and method | Oct 31, 2004 | Issued |
Array
(
[id] => 5101722
[patent_doc_number] => 20070184984
[patent_country] => US
[patent_kind] => A2
[patent_issue_date] => 2007-08-09
[patent_title] => 'SUPERCONDUCTING WIRE, SUPERCONDUCTING MUTIFILAMENTARY WIRE USING THE SUPERCONDUCTING WIRE, AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 10/553171
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[firstpage_image] =>[orig_patent_app_number] => 10553171
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/553171 | Superconductive wire material, superconductive multi-conductor wire using the same method for producing the same | Oct 26, 2004 | Abandoned |
Array
(
[id] => 5101722
[patent_doc_number] => 20070184984
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[patent_issue_date] => 2007-08-09
[patent_title] => 'SUPERCONDUCTING WIRE, SUPERCONDUCTING MUTIFILAMENTARY WIRE USING THE SUPERCONDUCTING WIRE, AND METHOD OF MANUFACTURING THE SAME'
[patent_app_type] => utility
[patent_app_number] => 10/553171
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/553171 | Superconductive wire material, superconductive multi-conductor wire using the same method for producing the same | Oct 26, 2004 | Abandoned |
Array
(
[id] => 7214497
[patent_doc_number] => 20050253253
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-11-17
[patent_title] => 'High electrical performance semiconductor package'
[patent_app_type] => utility
[patent_app_number] => 10/974376
[patent_app_country] => US
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[firstpage_image] =>[orig_patent_app_number] => 10974376
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/974376 | High electrical performance semiconductor package | Oct 25, 2004 | Issued |
Array
(
[id] => 7083028
[patent_doc_number] => 20050048408
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2005-03-03
[patent_title] => 'COMPOSITE LAMINATE CIRCUIT STRUCTURE'
[patent_app_type] => utility
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[firstpage_image] =>[orig_patent_app_number] => 10904126
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/904126 | Composite laminate circuit structure | Oct 24, 2004 | Issued |
Array
(
[id] => 7131986
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[patent_title] => 'Circuit board with mounting pads for reducing parasitic effect'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964619 | Circuit board with mounting pads for reducing parasitic effect | Oct 14, 2004 | Issued |
Array
(
[id] => 7081640
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[patent_title] => 'Integrated lead suspension and method of construction'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964188 | Integrated lead suspension and method of construction | Oct 12, 2004 | Issued |
Array
(
[id] => 7009380
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Array
(
[id] => 447237
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[patent_title] => 'Circuit board'
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/964284 | Circuit board | Oct 11, 2004 | Issued |
Array
(
[id] => 7167901
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/959214 | Circuit board having deposit holes | Oct 6, 2004 | Abandoned |
Array
(
[id] => 7153168
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/711795 | UNBENDING PRINTED CIRCUIT BOARD | Oct 5, 2004 | Abandoned |
Array
(
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[rel_patent_id] =>[rel_patent_doc_number] =>) 10/959711 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Oct 4, 2004 | Issued |
Array
(
[id] => 5138469
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[firstpage_image] =>[orig_patent_app_number] => 10572556
[rel_patent_id] =>[rel_patent_doc_number] =>) 10/572556 | Connecting sheet | Sep 27, 2004 | Issued |