Brian Sattizahn

Array ( [id] => 1309030 [patent_doc_number] => 06617518 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-09 [patent_title] => 'Enhanced flex cable' [patent_app_type] => B2 [patent_app_number] => 09/985345 [patent_app_country] => US [patent_app_date] => 2001-11-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 10 [patent_no_of_words] => 6044 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 61 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/617/06617518.pdf [firstpage_image] =>[orig_patent_app_number] => 09985345 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6614293 [patent_doc_number] => 20020064676 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-05-30 [patent_title] => 'Tin whisker-free printed circuit board' [patent_app_type] => new [patent_app_number] => 10/002714 [patent_app_country] => US [patent_app_date] => 2001-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 11201 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 67 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0064/20020064676.pdf [firstpage_image] =>[orig_patent_app_number] => 10002714 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6867219 [patent_doc_number] => 20030079908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-05-01 [patent_title] => 'Hole grid array package and socket technology' [patent_app_type] => new [patent_app_number] => 09/985126 [patent_app_country] => US [patent_app_date] => 2001-11-01 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2313 [patent_no_of_claims] => 30 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 34 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0079/20030079908.pdf [firstpage_image] =>[orig_patent_app_number] => 09985126 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5899957 [patent_doc_number] => 20020139573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-03 [patent_title] => 'Design for constructing an input circuit to receive and process an electrical signal' [patent_app_type] => new [patent_app_number] => 10/001668 [patent_app_country] => US [patent_app_date] => 2001-10-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 2355 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 23 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0139/20020139573.pdf [firstpage_image] =>[orig_patent_app_number] => 10001668 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1290909 [patent_doc_number] => 06633005 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-10-14 [patent_title] => 'Multilayer RF amplifier module' [patent_app_type] => B2 [patent_app_number] => 10/041863 [patent_app_country] => US [patent_app_date] => 2001-10-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 0 [patent_no_of_words] => 5202 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 99 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/633/06633005.pdf [firstpage_image] =>[orig_patent_app_number] => 10041863 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1224889 [patent_doc_number] => 06700074 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-03-02 [patent_title] => 'Electrical component housing structures and their method of manufacture' [patent_app_type] => B2 [patent_app_number] => 10/012796 [patent_app_country] => US [patent_app_date] => 2001-10-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 3 [patent_no_of_words] => 5851 [patent_no_of_claims] => 9 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 125 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/700/06700074.pdf [firstpage_image] =>[orig_patent_app_number] => 10012796 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6471471 [patent_doc_number] => 20020023779 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-28 [patent_title] => 'Pre-patterned substrate layers for being personalized as needed' [patent_app_type] => new [patent_app_number] => 09/982221 [patent_app_country] => US [patent_app_date] => 2001-10-18 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2036 [patent_no_of_claims] => 28 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 20 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20020023779.pdf [firstpage_image] =>[orig_patent_app_number] => 09982221 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6236608 [patent_doc_number] => 20020043396 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-18 [patent_title] => 'Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof' [patent_app_type] => new [patent_app_number] => 09/973822 [patent_app_country] => US [patent_app_date] => 2001-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 6802 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0043/20020043396.pdf [firstpage_image] =>[orig_patent_app_number] => 09973822 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1529063 [patent_doc_number] => 06479760 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-11-12 [patent_title] => 'Printed wiring board for semiconductor plastic package' [patent_app_type] => B2 [patent_app_number] => 09/973688 [patent_app_country] => US [patent_app_date] => 2001-10-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 9882 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 207 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/479/06479760.pdf [firstpage_image] =>[orig_patent_app_number] => 09973688 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6815721 [patent_doc_number] => 20030066679 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-04-10 [patent_title] => 'Electrical circuit and method of formation' [patent_app_type] => new [patent_app_number] => 09/973294 [patent_app_country] => US [patent_app_date] => 2001-10-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 5084 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 112 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0066/20030066679.pdf [firstpage_image] =>[orig_patent_app_number] => 09973294 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5987241 [patent_doc_number] => 20020098985 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-07-25 [patent_title] => 'Superconducting cable' [patent_app_type] => new [patent_app_number] => 09/970653 [patent_app_country] => US [patent_app_date] => 2001-10-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5519 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0098/20020098985.pdf [firstpage_image] =>[orig_patent_app_number] => 09970653 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1083209 [patent_doc_number] => 06833510 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-12-21 [patent_title] => 'Semiconductor packages and methods for making the same' [patent_app_type] => B2 [patent_app_number] => 09/971872 [patent_app_country] => US [patent_app_date] => 2001-10-04 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 4411 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/833/06833510.pdf [firstpage_image] =>[orig_patent_app_number] => 09971872 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1189636 [patent_doc_number] => 06734371 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2004-05-11 [patent_title] => 'Soldered heat sink anchor and method of use' [patent_app_type] => B2 [patent_app_number] => 09/964812 [patent_app_country] => US [patent_app_date] => 2001-09-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 3657 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/734/06734371.pdf [firstpage_image] =>[orig_patent_app_number] => 09964812 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6718221 [patent_doc_number] => 20030051908 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-03-20 [patent_title] => 'Dram module package' [patent_app_type] => new [patent_app_number] => 09/967714 [patent_app_country] => US [patent_app_date] => 2001-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2353 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20030051908.pdf [firstpage_image] =>[orig_patent_app_number] => 09967714 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1327343 [patent_doc_number] => 06603080 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-08-05 [patent_title] => 'Circuit board having ferrite powder containing layer' [patent_app_type] => B2 [patent_app_number] => 09/966553 [patent_app_country] => US [patent_app_date] => 2001-09-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 13 [patent_no_of_words] => 5235 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 120 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/603/06603080.pdf [firstpage_image] =>[orig_patent_app_number] => 09966553 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6488643 [patent_doc_number] => 20020189853 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-19 [patent_title] => 'BGA substrate with direct heat dissipating structure' [patent_app_type] => new [patent_app_number] => 09/957372 [patent_app_country] => US [patent_app_date] => 2001-09-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 3832 [patent_no_of_claims] => 25 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 130 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0189/20020189853.pdf [firstpage_image] =>[orig_patent_app_number] => 09957372 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6713383 [patent_doc_number] => 20030024730 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-02-06 [patent_title] => 'Filaments for composite oxide superconductors' [patent_app_type] => new [patent_app_number] => 09/954123 [patent_app_country] => US [patent_app_date] => 2001-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9538 [patent_no_of_claims] => 78 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0024/20030024730.pdf [firstpage_image] =>[orig_patent_app_number] => 09954123 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6463457 [patent_doc_number] => 20020150673 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-10-17 [patent_title] => 'Printed wiring boards and methods for making them' [patent_app_type] => new [patent_app_number] => 09/954486 [patent_app_country] => US [patent_app_date] => 2001-09-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 9063 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0150/20020150673.pdf [firstpage_image] =>[orig_patent_app_number] => 09954486 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 5812683 [patent_doc_number] => 20020038721 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-04-04 [patent_title] => 'Wiring circuit board having bumps and method of producing same' [patent_app_type] => new [patent_app_number] => 09/951611 [patent_app_country] => US [patent_app_date] => 2001-09-14 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4500 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 36 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0038/20020038721.pdf [firstpage_image] =>[orig_patent_app_number] => 09951611 [rel_patent_id] =>[rel_patent_doc_number] =>)