Brian Sattizahn

Array ( [id] => 6471466 [patent_doc_number] => 20020023778 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-28 [patent_title] => 'Printed wiring board having via and method of manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/899156 [patent_app_country] => US [patent_app_date] => 2001-07-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 11035 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 195 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0023/20020023778.pdf [firstpage_image] =>[orig_patent_app_number] => 09899156 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7612558 [patent_doc_number] => 06903278 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2005-06-07 [patent_title] => 'Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate' [patent_app_type] => utility [patent_app_number] => 09/893466 [patent_app_country] => US [patent_app_date] => 2001-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 17 [patent_no_of_words] => 4868 [patent_no_of_claims] => 27 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/903/06903278.pdf [firstpage_image] =>[orig_patent_app_number] => 09893466 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1089840 [patent_doc_number] => 06828508 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-12-07 [patent_title] => 'Oxide high-temperature superconductor wire and method of producing the same' [patent_app_type] => B1 [patent_app_number] => 09/869376 [patent_app_country] => US [patent_app_date] => 2001-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 6016 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 10 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/828/06828508.pdf [firstpage_image] =>[orig_patent_app_number] => 09869376 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6333634 [patent_doc_number] => 20020033411 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-03-21 [patent_title] => 'Method and apparatus for flex circuit reflow attachment' [patent_app_type] => new [patent_app_number] => 09/893800 [patent_app_country] => US [patent_app_date] => 2001-06-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 7 [patent_no_of_words] => 5844 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 33 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0033/20020033411.pdf [firstpage_image] =>[orig_patent_app_number] => 09893800 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1339698 [patent_doc_number] => 06593535 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-07-15 [patent_title] => 'Direct inner layer interconnect for a high speed printed circuit board' [patent_app_type] => B2 [patent_app_number] => 09/892045 [patent_app_country] => US [patent_app_date] => 2001-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 9 [patent_no_of_words] => 6006 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 98 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/593/06593535.pdf [firstpage_image] =>[orig_patent_app_number] => 09892045 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1217664 [patent_doc_number] => 06706972 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-03-16 [patent_title] => 'Electronic assembly comprising a sole plate forming a heat sink' [patent_app_type] => B1 [patent_app_number] => 09/806062 [patent_app_country] => US [patent_app_date] => 2001-06-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 5 [patent_no_of_words] => 1943 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 159 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/706/06706972.pdf [firstpage_image] =>[orig_patent_app_number] => 09806062 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1420375 [patent_doc_number] => 06509530 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-01-21 [patent_title] => 'Via intersect pad for electronic components and methods of manufacture' [patent_app_type] => B2 [patent_app_number] => 09/887597 [patent_app_country] => US [patent_app_date] => 2001-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 15 [patent_no_of_words] => 6748 [patent_no_of_claims] => 22 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/509/06509530.pdf [firstpage_image] =>[orig_patent_app_number] => 09887597 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6315355 [patent_doc_number] => 20020195268 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-26 [patent_title] => 'THICK FILM CIRCUIT CONNECTION' [patent_app_type] => new [patent_app_number] => 09/886853 [patent_app_country] => US [patent_app_date] => 2001-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 832 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 54 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0195/20020195268.pdf [firstpage_image] =>[orig_patent_app_number] => 09886853 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1420971 [patent_doc_number] => 06518508 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-02-11 [patent_title] => 'Ag-pre-plated lead frame for semiconductor package' [patent_app_type] => B2 [patent_app_number] => 09/878341 [patent_app_country] => US [patent_app_date] => 2001-06-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 11 [patent_no_of_words] => 7433 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 96 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/518/06518508.pdf [firstpage_image] =>[orig_patent_app_number] => 09878341 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6379768 [patent_doc_number] => 20020179331 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-12-05 [patent_title] => 'Printed wiring board interposer sub-assembly and method' [patent_app_type] => new [patent_app_number] => 09/871556 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 4580 [patent_no_of_claims] => 42 [patent_no_of_ind_claims] => 8 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0179/20020179331.pdf [firstpage_image] =>[orig_patent_app_number] => 09871556 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6920142 [patent_doc_number] => 20010027842 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-10-11 [patent_title] => 'Method for filling high aspect ratio via holes in electronic substrates and the resulting holes' [patent_app_type] => new [patent_app_number] => 09/871555 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 6571 [patent_no_of_claims] => 23 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 71 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0027/20010027842.pdf [firstpage_image] =>[orig_patent_app_number] => 09871555 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 6565260 [patent_doc_number] => 20020014351 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2002-02-07 [patent_title] => 'Module-mounting motherboard device' [patent_app_type] => new [patent_app_number] => 09/870893 [patent_app_country] => US [patent_app_date] => 2001-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2775 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 68 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0014/20020014351.pdf [firstpage_image] =>[orig_patent_app_number] => 09870893 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1309066 [patent_doc_number] => 06617522 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-09-09 [patent_title] => 'Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics' [patent_app_type] => B2 [patent_app_number] => 09/870039 [patent_app_country] => US [patent_app_date] => 2001-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 1 [patent_figures_cnt] => 1 [patent_no_of_words] => 3131 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/617/06617522.pdf [firstpage_image] =>[orig_patent_app_number] => 09870039 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1476036 [patent_doc_number] => 06388201 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2002-05-14 [patent_title] => 'Wired circuit board' [patent_app_type] => B2 [patent_app_number] => 09/866813 [patent_app_country] => US [patent_app_date] => 2001-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 13 [patent_no_of_words] => 10338 [patent_no_of_claims] => 3 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 90 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/388/06388201.pdf [firstpage_image] =>[orig_patent_app_number] => 09866813 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1313585 [patent_doc_number] => 06613986 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-09-02 [patent_title] => 'Multilayer build-up wiring board' [patent_app_type] => B1 [patent_app_number] => 09/787321 [patent_app_country] => US [patent_app_date] => 2001-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 43 [patent_figures_cnt] => 107 [patent_no_of_words] => 23220 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/613/06613986.pdf [firstpage_image] =>[orig_patent_app_number] => 09787321 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1384569 [patent_doc_number] => 06555756 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2003-04-29 [patent_title] => 'Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof' [patent_app_type] => B2 [patent_app_number] => 09/855671 [patent_app_country] => US [patent_app_date] => 2001-05-16 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 22 [patent_no_of_words] => 7109 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 204 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/555/06555756.pdf [firstpage_image] =>[orig_patent_app_number] => 09855671 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7634487 [patent_doc_number] => 06657133 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-02 [patent_title] => 'Ball grid array chip capacitor structure' [patent_app_type] => B1 [patent_app_number] => 09/858763 [patent_app_country] => US [patent_app_date] => 2001-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 11 [patent_no_of_words] => 2606 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 4 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/657/06657133.pdf [firstpage_image] =>[orig_patent_app_number] => 09858763 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1596662 [patent_doc_number] => 06384341 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-05-07 [patent_title] => 'Differential connector footprint for a multi-layer circuit board' [patent_app_type] => B1 [patent_app_number] => 09/845907 [patent_app_country] => US [patent_app_date] => 2001-04-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 5012 [patent_no_of_claims] => 40 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 62 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/384/06384341.pdf [firstpage_image] =>[orig_patent_app_number] => 09845907 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 1158627 [patent_doc_number] => 06762366 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2004-07-13 [patent_title] => 'Ball assignment for ball grid array package' [patent_app_type] => B1 [patent_app_number] => 09/844530 [patent_app_country] => US [patent_app_date] => 2001-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 5885 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/762/06762366.pdf [firstpage_image] =>[orig_patent_app_number] => 09844530 [rel_patent_id] =>[rel_patent_doc_number] =>)