Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 1486445
[patent_doc_number] => 06365843
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-02
[patent_title] => 'Multilayer printed wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/582665
[patent_app_country] => US
[patent_app_date] => 2000-06-29
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[pdf_file] => patents/06/365/06365843.pdf
[firstpage_image] =>[orig_patent_app_number] => 09582665
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/582665 | Multilayer printed wiring board | Jun 28, 2000 | Issued |
09/603840 | CONNECTION STRUCTURE | Jun 25, 2000 | Abandoned |
Array
(
[id] => 1587472
[patent_doc_number] => 06359234
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Package substrate for mounting semiconductor chip with low impedance and semiconductor device having the same'
[patent_app_type] => B1
[patent_app_number] => 09/602064
[patent_app_country] => US
[patent_app_date] => 2000-06-23
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[pdf_file] => patents/06/359/06359234.pdf
[firstpage_image] =>[orig_patent_app_number] => 09602064
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/602064 | Package substrate for mounting semiconductor chip with low impedance and semiconductor device having the same | Jun 22, 2000 | Issued |
Array
(
[id] => 1579869
[patent_doc_number] => 06448510
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-09-10
[patent_title] => 'Substrate for electronic packaging, pin jig fixture'
[patent_app_type] => B1
[patent_app_number] => 09/424179
[patent_app_country] => US
[patent_app_date] => 2000-06-22
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09424179
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/424179 | Substrate for electronic packaging, pin jig fixture | Jun 21, 2000 | Issued |
Array
(
[id] => 4340062
[patent_doc_number] => 06333470
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-25
[patent_title] => 'Assembly for chip(s) with magnetic head(s) and method for making same'
[patent_app_type] => 1
[patent_app_number] => 9/529376
[patent_app_country] => US
[patent_app_date] => 2000-06-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 5
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/529376 | Assembly for chip(s) with magnetic head(s) and method for making same | Jun 20, 2000 | Issued |
Array
(
[id] => 1562832
[patent_doc_number] => 06362437
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-26
[patent_title] => 'Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same'
[patent_app_type] => B1
[patent_app_number] => 09/597899
[patent_app_country] => US
[patent_app_date] => 2000-06-19
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/597899 | Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same | Jun 18, 2000 | Issued |
09/594781 | Electronic circuit device and method of production of the same | Jun 15, 2000 | Abandoned |
Array
(
[id] => 1566045
[patent_doc_number] => 06339197
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-15
[patent_title] => 'Multilayer printed circuit board and the manufacturing method'
[patent_app_type] => B1
[patent_app_number] => 09/579270
[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/579270 | Multilayer printed circuit board and the manufacturing method | May 25, 2000 | Issued |
Array
(
[id] => 4384232
[patent_doc_number] => 06303876
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-10-16
[patent_title] => 'LSI package structure'
[patent_app_type] => 1
[patent_app_number] => 9/570570
[patent_app_country] => US
[patent_app_date] => 2000-05-12
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[firstpage_image] =>[orig_patent_app_number] => 570570
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/570570 | LSI package structure | May 11, 2000 | Issued |
Array
(
[id] => 1529070
[patent_doc_number] => 06479763
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-11-12
[patent_title] => 'CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART'
[patent_app_type] => B1
[patent_app_number] => 09/530466
[patent_app_country] => US
[patent_app_date] => 2000-04-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 12
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[patent_no_of_words] => 11083
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/479/06479763.pdf
[firstpage_image] =>[orig_patent_app_number] => 09530466
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/530466 | CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART | Apr 27, 2000 | Issued |
Array
(
[id] => 4332199
[patent_doc_number] => 06320137
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-20
[patent_title] => 'Flexible circuit with coverplate layer and overlapping protective layer'
[patent_app_type] => 1
[patent_app_number] => 9/547090
[patent_app_country] => US
[patent_app_date] => 2000-04-11
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[pdf_file] => patents/06/320/06320137.pdf
[firstpage_image] =>[orig_patent_app_number] => 547090
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/547090 | Flexible circuit with coverplate layer and overlapping protective layer | Apr 10, 2000 | Issued |
Array
(
[id] => 6643602
[patent_doc_number] => 20030007332
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2003-01-09
[patent_title] => 'Insulating resin composition for multilayer printed-wiring board'
[patent_app_type] => new
[patent_app_number] => 09/539864
[patent_app_country] => US
[patent_app_date] => 2000-03-31
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[firstpage_image] =>[orig_patent_app_number] => 09539864
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/539864 | Insulating resin composition for multilayer printed-wiring board | Mar 30, 2000 | Issued |
Array
(
[id] => 1447789
[patent_doc_number] => 06369331
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-04-09
[patent_title] => 'Printed circuit board for semiconductor package and method of making same'
[patent_app_type] => B1
[patent_app_number] => 09/536992
[patent_app_country] => US
[patent_app_date] => 2000-03-29
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[firstpage_image] =>[orig_patent_app_number] => 09536992
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/536992 | Printed circuit board for semiconductor package and method of making same | Mar 28, 2000 | Issued |
Array
(
[id] => 1254020
[patent_doc_number] => 06670556
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2003-12-30
[patent_title] => 'Printed circuit board unit with detachment mechanism for electronic component'
[patent_app_type] => B1
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[firstpage_image] =>[orig_patent_app_number] => 09536993
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/536993 | Printed circuit board unit with detachment mechanism for electronic component | Mar 28, 2000 | Issued |
Array
(
[id] => 4275799
[patent_doc_number] => 06246013
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-12
[patent_title] => 'Surface mounting structure and surface mount type electronic component included therein'
[patent_app_type] => 1
[patent_app_number] => 9/536973
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/536973 | Surface mounting structure and surface mount type electronic component included therein | Mar 27, 2000 | Issued |
Array
(
[id] => 4375198
[patent_doc_number] => 06288345
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-09-11
[patent_title] => 'Compact z-axis DC and control signals routing substrate'
[patent_app_type] => 1
[patent_app_number] => 9/532264
[patent_app_country] => US
[patent_app_date] => 2000-03-22
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[firstpage_image] =>[orig_patent_app_number] => 532264
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/532264 | Compact z-axis DC and control signals routing substrate | Mar 21, 2000 | Issued |
Array
(
[id] => 1552418
[patent_doc_number] => 06399896
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-06-04
[patent_title] => 'Circuit package having low modulus, conformal mounting pads'
[patent_app_type] => B1
[patent_app_number] => 09/525379
[patent_app_country] => US
[patent_app_date] => 2000-03-15
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[firstpage_image] =>[orig_patent_app_number] => 09525379
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/525379 | Circuit package having low modulus, conformal mounting pads | Mar 14, 2000 | Issued |
Array
(
[id] => 4340021
[patent_doc_number] => 06333467
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-25
[patent_title] => 'Flexible printed wiring board'
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[firstpage_image] =>[orig_patent_app_number] => 517060
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/517060 | Flexible printed wiring board | Mar 1, 2000 | Issued |
09/486556 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT | Feb 28, 2000 | Abandoned |
Array
(
[id] => 1455044
[patent_doc_number] => 06462284
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-08
[patent_title] => 'Semiconductor device and method of manufacture thereof'
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[patent_app_number] => 09/486317
[patent_app_country] => US
[patent_app_date] => 2000-02-25
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[firstpage_image] =>[orig_patent_app_number] => 09486317
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/486317 | Semiconductor device and method of manufacture thereof | Feb 24, 2000 | Issued |