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Brian Sattizahn

Examiner (ID: 8831)

Most Active Art Unit
2762
Art Unit(s)
2762
Total Applications
32
Issued Applications
31
Pending Applications
1
Abandoned Applications
0

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 1486445 [patent_doc_number] => 06365843 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-02 [patent_title] => 'Multilayer printed wiring board' [patent_app_type] => B1 [patent_app_number] => 09/582665 [patent_app_country] => US [patent_app_date] => 2000-06-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 23 [patent_figures_cnt] => 13 [patent_no_of_words] => 17368 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 75 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/365/06365843.pdf [firstpage_image] =>[orig_patent_app_number] => 09582665 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/582665
Multilayer printed wiring board Jun 28, 2000 Issued
09/603840 CONNECTION STRUCTURE Jun 25, 2000 Abandoned
Array ( [id] => 1587472 [patent_doc_number] => 06359234 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-19 [patent_title] => 'Package substrate for mounting semiconductor chip with low impedance and semiconductor device having the same' [patent_app_type] => B1 [patent_app_number] => 09/602064 [patent_app_country] => US [patent_app_date] => 2000-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 5430 [patent_no_of_claims] => 13 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 168 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/359/06359234.pdf [firstpage_image] =>[orig_patent_app_number] => 09602064 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/602064
Package substrate for mounting semiconductor chip with low impedance and semiconductor device having the same Jun 22, 2000 Issued
Array ( [id] => 1579869 [patent_doc_number] => 06448510 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-09-10 [patent_title] => 'Substrate for electronic packaging, pin jig fixture' [patent_app_type] => B1 [patent_app_number] => 09/424179 [patent_app_country] => US [patent_app_date] => 2000-06-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 15 [patent_no_of_words] => 2151 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 58 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/448/06448510.pdf [firstpage_image] =>[orig_patent_app_number] => 09424179 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/424179
Substrate for electronic packaging, pin jig fixture Jun 21, 2000 Issued
Array ( [id] => 4340062 [patent_doc_number] => 06333470 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-25 [patent_title] => 'Assembly for chip(s) with magnetic head(s) and method for making same' [patent_app_type] => 1 [patent_app_number] => 9/529376 [patent_app_country] => US [patent_app_date] => 2000-06-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 2233 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 220 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/333/06333470.pdf [firstpage_image] =>[orig_patent_app_number] => 529376 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/529376
Assembly for chip(s) with magnetic head(s) and method for making same Jun 20, 2000 Issued
Array ( [id] => 1562832 [patent_doc_number] => 06362437 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-03-26 [patent_title] => 'Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same' [patent_app_type] => B1 [patent_app_number] => 09/597899 [patent_app_country] => US [patent_app_date] => 2000-06-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 7 [patent_no_of_words] => 3999 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 146 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/362/06362437.pdf [firstpage_image] =>[orig_patent_app_number] => 09597899 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/597899
Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same Jun 18, 2000 Issued
09/594781 Electronic circuit device and method of production of the same Jun 15, 2000 Abandoned
Array ( [id] => 1566045 [patent_doc_number] => 06339197 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-01-15 [patent_title] => 'Multilayer printed circuit board and the manufacturing method' [patent_app_type] => B1 [patent_app_number] => 09/579270 [patent_app_country] => US [patent_app_date] => 2000-05-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 32 [patent_no_of_words] => 12163 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/339/06339197.pdf [firstpage_image] =>[orig_patent_app_number] => 09579270 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/579270
Multilayer printed circuit board and the manufacturing method May 25, 2000 Issued
Array ( [id] => 4384232 [patent_doc_number] => 06303876 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-10-16 [patent_title] => 'LSI package structure' [patent_app_type] => 1 [patent_app_number] => 9/570570 [patent_app_country] => US [patent_app_date] => 2000-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 3 [patent_no_of_words] => 1686 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 103 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/303/06303876.pdf [firstpage_image] =>[orig_patent_app_number] => 570570 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/570570
LSI package structure May 11, 2000 Issued
Array ( [id] => 1529070 [patent_doc_number] => 06479763 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-11-12 [patent_title] => 'CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART' [patent_app_type] => B1 [patent_app_number] => 09/530466 [patent_app_country] => US [patent_app_date] => 2000-04-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 19 [patent_no_of_words] => 11083 [patent_no_of_claims] => 39 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 27 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/479/06479763.pdf [firstpage_image] =>[orig_patent_app_number] => 09530466 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/530466
CONDUCTIVE PASTE, CONDUCTIVE STRUCTURE USING THE SAME, ELECTRONIC PART, MODULE, CIRCUIT BOARD, METHOD FOR ELECTRICAL CONNECTION, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC PART Apr 27, 2000 Issued
Array ( [id] => 4332199 [patent_doc_number] => 06320137 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-11-20 [patent_title] => 'Flexible circuit with coverplate layer and overlapping protective layer' [patent_app_type] => 1 [patent_app_number] => 9/547090 [patent_app_country] => US [patent_app_date] => 2000-04-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 5326 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/320/06320137.pdf [firstpage_image] =>[orig_patent_app_number] => 547090 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/547090
Flexible circuit with coverplate layer and overlapping protective layer Apr 10, 2000 Issued
Array ( [id] => 6643602 [patent_doc_number] => 20030007332 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2003-01-09 [patent_title] => 'Insulating resin composition for multilayer printed-wiring board' [patent_app_type] => new [patent_app_number] => 09/539864 [patent_app_country] => US [patent_app_date] => 2000-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 3 [patent_no_of_words] => 5601 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 60 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0007/20030007332.pdf [firstpage_image] =>[orig_patent_app_number] => 09539864 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/539864
Insulating resin composition for multilayer printed-wiring board Mar 30, 2000 Issued
Array ( [id] => 1447789 [patent_doc_number] => 06369331 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-04-09 [patent_title] => 'Printed circuit board for semiconductor package and method of making same' [patent_app_type] => B1 [patent_app_number] => 09/536992 [patent_app_country] => US [patent_app_date] => 2000-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 7 [patent_no_of_words] => 2878 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/369/06369331.pdf [firstpage_image] =>[orig_patent_app_number] => 09536992 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/536992
Printed circuit board for semiconductor package and method of making same Mar 28, 2000 Issued
Array ( [id] => 1254020 [patent_doc_number] => 06670556 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-12-30 [patent_title] => 'Printed circuit board unit with detachment mechanism for electronic component' [patent_app_type] => B1 [patent_app_number] => 09/536993 [patent_app_country] => US [patent_app_date] => 2000-03-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 20 [patent_no_of_words] => 4459 [patent_no_of_claims] => 2 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 93 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/670/06670556.pdf [firstpage_image] =>[orig_patent_app_number] => 09536993 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/536993
Printed circuit board unit with detachment mechanism for electronic component Mar 28, 2000 Issued
Array ( [id] => 4275799 [patent_doc_number] => 06246013 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-06-12 [patent_title] => 'Surface mounting structure and surface mount type electronic component included therein' [patent_app_type] => 1 [patent_app_number] => 9/536973 [patent_app_country] => US [patent_app_date] => 2000-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 11 [patent_no_of_words] => 3747 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 113 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/246/06246013.pdf [firstpage_image] =>[orig_patent_app_number] => 536973 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/536973
Surface mounting structure and surface mount type electronic component included therein Mar 27, 2000 Issued
Array ( [id] => 4375198 [patent_doc_number] => 06288345 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-09-11 [patent_title] => 'Compact z-axis DC and control signals routing substrate' [patent_app_type] => 1 [patent_app_number] => 9/532264 [patent_app_country] => US [patent_app_date] => 2000-03-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 6 [patent_no_of_words] => 1776 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/288/06288345.pdf [firstpage_image] =>[orig_patent_app_number] => 532264 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/532264
Compact z-axis DC and control signals routing substrate Mar 21, 2000 Issued
Array ( [id] => 1552418 [patent_doc_number] => 06399896 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-06-04 [patent_title] => 'Circuit package having low modulus, conformal mounting pads' [patent_app_type] => B1 [patent_app_number] => 09/525379 [patent_app_country] => US [patent_app_date] => 2000-03-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 4304 [patent_no_of_claims] => 12 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 48 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/399/06399896.pdf [firstpage_image] =>[orig_patent_app_number] => 09525379 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/525379
Circuit package having low modulus, conformal mounting pads Mar 14, 2000 Issued
Array ( [id] => 4340021 [patent_doc_number] => 06333467 [patent_country] => US [patent_kind] => NA [patent_issue_date] => 2001-12-25 [patent_title] => 'Flexible printed wiring board' [patent_app_type] => 1 [patent_app_number] => 9/517060 [patent_app_country] => US [patent_app_date] => 2000-03-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 10 [patent_no_of_words] => 2332 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 129 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/333/06333467.pdf [firstpage_image] =>[orig_patent_app_number] => 517060 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/517060
Flexible printed wiring board Mar 1, 2000 Issued
09/486556 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT Feb 28, 2000 Abandoned
Array ( [id] => 1455044 [patent_doc_number] => 06462284 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2002-10-08 [patent_title] => 'Semiconductor device and method of manufacture thereof' [patent_app_type] => B1 [patent_app_number] => 09/486317 [patent_app_country] => US [patent_app_date] => 2000-02-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 5648 [patent_no_of_claims] => 29 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 104 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/462/06462284.pdf [firstpage_image] =>[orig_patent_app_number] => 09486317 [rel_patent_id] =>[rel_patent_doc_number] =>)
09/486317
Semiconductor device and method of manufacture thereof Feb 24, 2000 Issued
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