Application number | Title of the application | Filing Date | Status |
---|
Array
(
[id] => 7645364
[patent_doc_number] => 06472607
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-10-29
[patent_title] => 'Electronic circuit board with known flow soldering warp direction'
[patent_app_type] => B1
[patent_app_number] => 09/506929
[patent_app_country] => US
[patent_app_date] => 2000-02-18
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[firstpage_image] =>[orig_patent_app_number] => 09506929
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/506929 | Electronic circuit board with known flow soldering warp direction | Feb 17, 2000 | Issued |
Array
(
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[patent_doc_number] => 06441316
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module'
[patent_app_type] => B1
[patent_app_number] => 09/504712
[patent_app_country] => US
[patent_app_date] => 2000-02-16
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[firstpage_image] =>[orig_patent_app_number] => 09504712
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/504712 | Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module | Feb 15, 2000 | Issued |
Array
(
[id] => 4323718
[patent_doc_number] => 06248960
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-06-19
[patent_title] => 'Ceramics substrate with electronic circuit and its manufacturing method'
[patent_app_type] => 1
[patent_app_number] => 9/501683
[patent_app_country] => US
[patent_app_date] => 2000-02-10
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[firstpage_image] =>[orig_patent_app_number] => 501683
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Array
(
[id] => 1441792
[patent_doc_number] => 06335491
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-01-01
[patent_title] => 'Interposer for semiconductor package assembly'
[patent_app_type] => B1
[patent_app_number] => 09/499801
[patent_app_country] => US
[patent_app_date] => 2000-02-08
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 09499801
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Array
(
[id] => 1562831
[patent_doc_number] => 06362436
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-03-26
[patent_title] => 'Printed wiring board for semiconductor plastic package'
[patent_app_type] => B1
[patent_app_number] => 09/498482
[patent_app_country] => US
[patent_app_date] => 2000-02-04
[patent_effective_date] => 0000-00-00
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[pdf_file] => patents/06/362/06362436.pdf
[firstpage_image] =>[orig_patent_app_number] => 09498482
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/498482 | Printed wiring board for semiconductor plastic package | Feb 3, 2000 | Issued |
Array
(
[id] => 4281001
[patent_doc_number] => 06281450
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-08-28
[patent_title] => 'Substrate for mounting semiconductor chips'
[patent_app_type] => 1
[patent_app_number] => 9/446674
[patent_app_country] => US
[patent_app_date] => 1999-12-27
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[firstpage_image] =>[orig_patent_app_number] => 446674
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/446674 | Substrate for mounting semiconductor chips | Dec 26, 1999 | Issued |
Array
(
[id] => 7639924
[patent_doc_number] => 06395992
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-05-28
[patent_title] => 'Three-dimensional wiring board and electric insulating member for wiring board'
[patent_app_type] => B1
[patent_app_number] => 09/449654
[patent_app_country] => US
[patent_app_date] => 1999-11-30
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[pdf_file] => patents/06/395/06395992.pdf
[firstpage_image] =>[orig_patent_app_number] => 09449654
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/449654 | Three-dimensional wiring board and electric insulating member for wiring board | Nov 29, 1999 | Issued |
Array
(
[id] => 1515871
[patent_doc_number] => 06420658
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-07-16
[patent_title] => 'Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder'
[patent_app_type] => B1
[patent_app_number] => 09/450504
[patent_app_country] => US
[patent_app_date] => 1999-11-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 12
[patent_no_of_words] => 2507
[patent_no_of_claims] => 6
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[patent_words_short_claim] => 114
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[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/420/06420658.pdf
[firstpage_image] =>[orig_patent_app_number] => 09450504
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/450504 | Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder | Nov 29, 1999 | Issued |
09/424567 | PROCESS FOR CONNECTING AN INTEGRATED CIRCUIT TO A CSP AND RESULTANT CHIP PACKAGE ASSEMBLY | Nov 23, 1999 | Abandoned |
Array
(
[id] => 1508965
[patent_doc_number] => 06441313
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2002-08-27
[patent_title] => 'Printed circuit board employing lossy power distribution network to reduce power plane resonances'
[patent_app_type] => B1
[patent_app_number] => 09/447513
[patent_app_country] => US
[patent_app_date] => 1999-11-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 16
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[patent_no_of_words] => 5323
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[patent_current_assignee] =>[type] => patent
[pdf_file] => patents/06/441/06441313.pdf
[firstpage_image] =>[orig_patent_app_number] => 09447513
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/447513 | Printed circuit board employing lossy power distribution network to reduce power plane resonances | Nov 22, 1999 | Issued |
Array
(
[id] => 4316704
[patent_doc_number] => 06316731
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-11-13
[patent_title] => 'Method of forming a printed wiring board with compensation scales'
[patent_app_type] => 1
[patent_app_number] => 9/442382
[patent_app_country] => US
[patent_app_date] => 1999-11-17
[patent_effective_date] => 0000-00-00
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[firstpage_image] =>[orig_patent_app_number] => 442382
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/442382 | Method of forming a printed wiring board with compensation scales | Nov 16, 1999 | Issued |
Array
(
[id] => 4340085
[patent_doc_number] => 06333471
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-25
[patent_title] => 'Sheet metal component for double pattern conduction and printed circuit board'
[patent_app_type] => 1
[patent_app_number] => 9/441203
[patent_app_country] => US
[patent_app_date] => 1999-11-16
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[pdf_file] => patents/06/333/06333471.pdf
[firstpage_image] =>[orig_patent_app_number] => 441203
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/441203 | Sheet metal component for double pattern conduction and printed circuit board | Nov 15, 1999 | Issued |
09/437882 | CURRENT CARRYING STRUCTURE USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL | Nov 9, 1999 | Abandoned |
Array
(
[id] => 4325371
[patent_doc_number] => 06331678
[patent_country] => US
[patent_kind] => NA
[patent_issue_date] => 2001-12-18
[patent_title] => 'Reduction of blistering and delamination of high-temperature devices with metal film'
[patent_app_type] => 1
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Array
(
[id] => 1587467
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[patent_kind] => B1
[patent_issue_date] => 2002-03-19
[patent_title] => 'Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof'
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[patent_app_country] => US
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/426758 | Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof | Oct 25, 1999 | Issued |
Array
(
[id] => 1524702
[patent_doc_number] => 06353189
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[patent_kind] => B1
[patent_issue_date] => 2002-03-05
[patent_title] => 'Wiring board, wiring board fabrication method, and semiconductor package'
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[patent_app_number] => 09/403223
[patent_app_country] => US
[patent_app_date] => 1999-10-15
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/403223 | Wiring board, wiring board fabrication method, and semiconductor package | Oct 14, 1999 | Issued |
Array
(
[id] => 4375165
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[patent_kind] => NA
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[firstpage_image] =>[orig_patent_app_number] => 414818
[rel_patent_id] =>[rel_patent_doc_number] =>) 09/414818 | Printed circuit board | Oct 7, 1999 | Issued |
Array
(
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[patent_kind] => NA
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[rel_patent_id] =>[rel_patent_doc_number] =>) 09/413147 | Multilayer print circuit board and the production method of the multilayer print circuit board | Oct 5, 1999 | Issued |
Array
(
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Array
(
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