Bruce Edward Snow

Array ( [id] => 1397083 [patent_doc_number] => 06531386 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2003-03-11 [patent_title] => 'Method to fabricate dish-free copper interconnects' [patent_app_type] => B1 [patent_app_number] => 10/072107 [patent_app_country] => US [patent_app_date] => 2002-02-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 8 [patent_no_of_words] => 2017 [patent_no_of_claims] => 45 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 176 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] => patents/06/531/06531386.pdf [firstpage_image] =>[orig_patent_app_number] => 10072107 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 7014568 [patent_doc_number] => 20010051414 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2001-12-13 [patent_title] => 'Semiconductor integrated circuit and method for manufacturing the same' [patent_app_type] => new [patent_app_number] => 09/922074 [patent_app_country] => US [patent_app_date] => 2001-08-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 25 [patent_figures_cnt] => 25 [patent_no_of_words] => 10852 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 160 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] => publications/A1/0051/20010051414.pdf [firstpage_image] =>[orig_patent_app_number] => 09922074 [rel_patent_id] =>[rel_patent_doc_number] =>)