Search

Bryan Bui

Examiner (ID: 6052, Phone: (571)272-2271 , Office: P/2865 )

Most Active Art Unit
2863
Art Unit(s)
2414, 2764, 2863, 2857, 2865
Total Applications
2284
Issued Applications
2047
Pending Applications
88
Abandoned Applications
146

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 20093215 [patent_doc_number] => 20250223151 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-07-10 [patent_title] => SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE [patent_app_type] => utility [patent_app_number] => 19/007580 [patent_app_country] => US [patent_app_date] => 2025-01-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 12894 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -26 [patent_words_short_claim] => 45 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19007580 [rel_patent_id] =>[rel_patent_doc_number] =>)
19/007580
SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE Jan 1, 2025 Pending
Array ( [id] => 20311980 [patent_doc_number] => 20250329609 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-10-23 [patent_title] => COOLING CHANNEL SHAPE WITH SUBSTANTIALLY CONSTANT CROSS SECTIONAL AREA [patent_app_type] => utility [patent_app_number] => 18/898541 [patent_app_country] => US [patent_app_date] => 2024-09-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 14835 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18898541 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/898541
Cooling channel shape with substantially constant cross sectional area Sep 25, 2024 Issued
Array ( [id] => 19951306 [patent_doc_number] => 12322677 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2025-06-03 [patent_title] => Fluid channel geometry optimizations to improve cooling efficiency [patent_app_type] => utility [patent_app_number] => 18/784639 [patent_app_country] => US [patent_app_date] => 2024-07-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 19 [patent_figures_cnt] => 19 [patent_no_of_words] => 13802 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 288 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18784639 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/784639
Fluid channel geometry optimizations to improve cooling efficiency Jul 24, 2024 Issued
Array ( [id] => 19394852 [patent_doc_number] => 20240284722 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-22 [patent_title] => DISPLAY PANEL [patent_app_type] => utility [patent_app_number] => 18/473249 [patent_app_country] => US [patent_app_date] => 2023-09-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5641 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -19 [patent_words_short_claim] => 217 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18473249 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/473249
DISPLAY PANEL Sep 23, 2023 Pending
Array ( [id] => 18958962 [patent_doc_number] => 20240047289 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/356762 [patent_app_country] => US [patent_app_date] => 2023-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5200 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 188 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18356762 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/356762
MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME Jul 20, 2023 Pending
Array ( [id] => 19364202 [patent_doc_number] => 20240266236 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-08 [patent_title] => ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME [patent_app_type] => utility [patent_app_number] => 18/355400 [patent_app_country] => US [patent_app_date] => 2023-07-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4446 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -12 [patent_words_short_claim] => 78 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355400 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/355400
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME Jul 18, 2023 Pending
Array ( [id] => 18905881 [patent_doc_number] => 20240021366 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-18 [patent_title] => ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS [patent_app_type] => utility [patent_app_number] => 18/353863 [patent_app_country] => US [patent_app_date] => 2023-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4091 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 70 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353863 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/353863
ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS Jul 16, 2023 Pending
Array ( [id] => 19688119 [patent_doc_number] => 20250006664 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL [patent_app_type] => utility [patent_app_number] => 18/217008 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 10902 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 133 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217008 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/217008
THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL Jun 29, 2023 Pending
Array ( [id] => 19688028 [patent_doc_number] => 20250006573 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2025-01-02 [patent_title] => OPEN CAVITY SENSOR [patent_app_type] => utility [patent_app_number] => 18/345186 [patent_app_country] => US [patent_app_date] => 2023-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3623 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 97 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18345186 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/345186
OPEN CAVITY SENSOR Jun 29, 2023 Pending
Array ( [id] => 18883001 [patent_doc_number] => 20240006370 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-01-04 [patent_title] => CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/213960 [patent_app_country] => US [patent_app_date] => 2023-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 4536 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 138 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213960 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/213960
CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF Jun 25, 2023 Pending
Array ( [id] => 19662113 [patent_doc_number] => 20240429178 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-12-26 [patent_title] => MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES [patent_app_type] => utility [patent_app_number] => 18/211669 [patent_app_country] => US [patent_app_date] => 2023-06-20 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6654 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 57 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18211669 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/211669
MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES Jun 19, 2023 Pending
Array ( [id] => 19054764 [patent_doc_number] => 20240096733 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-03-21 [patent_title] => PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME [patent_app_type] => utility [patent_app_number] => 18/323484 [patent_app_country] => US [patent_app_date] => 2023-05-25 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6653 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 171 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323484 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/323484
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME May 24, 2023 Pending
Array ( [id] => 18789436 [patent_doc_number] => 20230378102 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-11-23 [patent_title] => Switch Arrangement [patent_app_type] => utility [patent_app_number] => 18/320703 [patent_app_country] => US [patent_app_date] => 2023-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1643 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 157 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18320703 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/320703
Switch Arrangement May 18, 2023 Pending
Array ( [id] => 18833825 [patent_doc_number] => 20230402352 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-14 [patent_title] => LEAD FRAME AND ELECTRONIC COMPONENT [patent_app_type] => utility [patent_app_number] => 18/318893 [patent_app_country] => US [patent_app_date] => 2023-05-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 8575 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 134 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318893 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/318893
LEAD FRAME AND ELECTRONIC COMPONENT May 16, 2023 Pending
Array ( [id] => 20612869 [patent_doc_number] => 12588490 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2026-03-24 [patent_title] => Semiconductor structure comprising power deliver network structure [patent_app_type] => utility [patent_app_number] => 18/317117 [patent_app_country] => US [patent_app_date] => 2023-05-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 1074 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 359 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317117 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/317117
Semiconductor structure comprising power deliver network structure May 14, 2023 Issued
Array ( [id] => 19575226 [patent_doc_number] => 20240379518 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-11-14 [patent_title] => INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT ASSEMBLIES [patent_app_type] => utility [patent_app_number] => 18/313526 [patent_app_country] => US [patent_app_date] => 2023-05-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5384 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -21 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313526 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/313526
Interposer for implementing flip-chip dies in wirebonded circuit assemblies May 7, 2023 Issued
Array ( [id] => 18821143 [patent_doc_number] => 20230395484 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2023-12-07 [patent_title] => ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF [patent_app_type] => utility [patent_app_number] => 18/311230 [patent_app_country] => US [patent_app_date] => 2023-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6459 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -15 [patent_words_short_claim] => 42 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18311230 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/311230
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF May 1, 2023 Pending
Array ( [id] => 18958965 [patent_doc_number] => 20240047292 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-08 [patent_title] => SEMICONDUCTOR PACKAGE [patent_app_type] => utility [patent_app_number] => 18/140343 [patent_app_country] => US [patent_app_date] => 2023-04-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7902 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 72 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18140343 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/140343
SEMICONDUCTOR PACKAGE Apr 26, 2023 Pending
Array ( [id] => 18991108 [patent_doc_number] => 20240063077 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-02-22 [patent_title] => SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE [patent_app_type] => utility [patent_app_number] => 18/137809 [patent_app_country] => US [patent_app_date] => 2023-04-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7122 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18137809 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/137809
SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE Apr 20, 2023 Pending
Array ( [id] => 19384721 [patent_doc_number] => 20240274591 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2024-08-15 [patent_title] => SEMICONDUCTOR DEVICE WITH COMMUNICATION RING [patent_app_type] => utility [patent_app_number] => 18/110318 [patent_app_country] => US [patent_app_date] => 2023-02-15 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 1944 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -18 [patent_words_short_claim] => 73 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18110318 [rel_patent_id] =>[rel_patent_doc_number] =>)
18/110318
SEMICONDUCTOR DEVICE WITH COMMUNICATION RING Feb 14, 2023 Pending
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