
Bryan Bui
Examiner (ID: 6052, Phone: (571)272-2271 , Office: P/2865 )
| Most Active Art Unit | 2863 |
| Art Unit(s) | 2414, 2764, 2863, 2857, 2865 |
| Total Applications | 2284 |
| Issued Applications | 2047 |
| Pending Applications | 88 |
| Abandoned Applications | 146 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 20093215
[patent_doc_number] => 20250223151
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-07-10
[patent_title] => SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE
[patent_app_type] => utility
[patent_app_number] => 19/007580
[patent_app_country] => US
[patent_app_date] => 2025-01-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12894
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -26
[patent_words_short_claim] => 45
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 19007580
[rel_patent_id] =>[rel_patent_doc_number] =>) 19/007580 | SEMICONDUCTOR DEVICE AND AIRFLOW GENERATING PACKAGE | Jan 1, 2025 | Pending |
Array
(
[id] => 20311980
[patent_doc_number] => 20250329609
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-10-23
[patent_title] => COOLING CHANNEL SHAPE WITH SUBSTANTIALLY CONSTANT CROSS SECTIONAL AREA
[patent_app_type] => utility
[patent_app_number] => 18/898541
[patent_app_country] => US
[patent_app_date] => 2024-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 14835
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18898541
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/898541 | Cooling channel shape with substantially constant cross sectional area | Sep 25, 2024 | Issued |
Array
(
[id] => 19951306
[patent_doc_number] => 12322677
[patent_country] => US
[patent_kind] => B1
[patent_issue_date] => 2025-06-03
[patent_title] => Fluid channel geometry optimizations to improve cooling efficiency
[patent_app_type] => utility
[patent_app_number] => 18/784639
[patent_app_country] => US
[patent_app_date] => 2024-07-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 19
[patent_figures_cnt] => 19
[patent_no_of_words] => 13802
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 2
[patent_words_short_claim] => 288
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18784639
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/784639 | Fluid channel geometry optimizations to improve cooling efficiency | Jul 24, 2024 | Issued |
Array
(
[id] => 19394852
[patent_doc_number] => 20240284722
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-22
[patent_title] => DISPLAY PANEL
[patent_app_type] => utility
[patent_app_number] => 18/473249
[patent_app_country] => US
[patent_app_date] => 2023-09-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5641
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 217
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18473249
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/473249 | DISPLAY PANEL | Sep 23, 2023 | Pending |
Array
(
[id] => 18958962
[patent_doc_number] => 20240047289
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-08
[patent_title] => MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/356762
[patent_app_country] => US
[patent_app_date] => 2023-07-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5200
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 188
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18356762
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/356762 | MOLDED POWER SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING THE SAME | Jul 20, 2023 | Pending |
Array
(
[id] => 19364202
[patent_doc_number] => 20240266236
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-08
[patent_title] => ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/355400
[patent_app_country] => US
[patent_app_date] => 2023-07-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4446
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -12
[patent_words_short_claim] => 78
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18355400
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/355400 | ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME | Jul 18, 2023 | Pending |
Array
(
[id] => 18905881
[patent_doc_number] => 20240021366
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-18
[patent_title] => ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS
[patent_app_type] => utility
[patent_app_number] => 18/353863
[patent_app_country] => US
[patent_app_date] => 2023-07-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4091
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18353863
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/353863 | ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS | Jul 16, 2023 | Pending |
Array
(
[id] => 19688119
[patent_doc_number] => 20250006664
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-01-02
[patent_title] => THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
[patent_app_type] => utility
[patent_app_number] => 18/217008
[patent_app_country] => US
[patent_app_date] => 2023-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10902
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 133
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18217008
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/217008 | THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL | Jun 29, 2023 | Pending |
Array
(
[id] => 19688028
[patent_doc_number] => 20250006573
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2025-01-02
[patent_title] => OPEN CAVITY SENSOR
[patent_app_type] => utility
[patent_app_number] => 18/345186
[patent_app_country] => US
[patent_app_date] => 2023-06-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3623
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 97
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18345186
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/345186 | OPEN CAVITY SENSOR | Jun 29, 2023 | Pending |
Array
(
[id] => 18883001
[patent_doc_number] => 20240006370
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-04
[patent_title] => CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/213960
[patent_app_country] => US
[patent_app_date] => 2023-06-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4536
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -11
[patent_words_short_claim] => 138
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18213960
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/213960 | CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF | Jun 25, 2023 | Pending |
Array
(
[id] => 19662113
[patent_doc_number] => 20240429178
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-12-26
[patent_title] => MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
[patent_app_type] => utility
[patent_app_number] => 18/211669
[patent_app_country] => US
[patent_app_date] => 2023-06-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6654
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 57
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18211669
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/211669 | MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES | Jun 19, 2023 | Pending |
Array
(
[id] => 19054764
[patent_doc_number] => 20240096733
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-21
[patent_title] => PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
[patent_app_type] => utility
[patent_app_number] => 18/323484
[patent_app_country] => US
[patent_app_date] => 2023-05-25
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6653
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -14
[patent_words_short_claim] => 171
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18323484
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/323484 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | May 24, 2023 | Pending |
Array
(
[id] => 18789436
[patent_doc_number] => 20230378102
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-11-23
[patent_title] => Switch Arrangement
[patent_app_type] => utility
[patent_app_number] => 18/320703
[patent_app_country] => US
[patent_app_date] => 2023-05-19
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1643
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 157
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18320703
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/320703 | Switch Arrangement | May 18, 2023 | Pending |
Array
(
[id] => 18833825
[patent_doc_number] => 20230402352
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-14
[patent_title] => LEAD FRAME AND ELECTRONIC COMPONENT
[patent_app_type] => utility
[patent_app_number] => 18/318893
[patent_app_country] => US
[patent_app_date] => 2023-05-17
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8575
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -10
[patent_words_short_claim] => 134
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18318893
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/318893 | LEAD FRAME AND ELECTRONIC COMPONENT | May 16, 2023 | Pending |
Array
(
[id] => 20612869
[patent_doc_number] => 12588490
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-03-24
[patent_title] => Semiconductor structure comprising power deliver network structure
[patent_app_type] => utility
[patent_app_number] => 18/317117
[patent_app_country] => US
[patent_app_date] => 2023-05-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 8
[patent_figures_cnt] => 8
[patent_no_of_words] => 1074
[patent_no_of_claims] => 16
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 359
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18317117
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/317117 | Semiconductor structure comprising power deliver network structure | May 14, 2023 | Issued |
Array
(
[id] => 19575226
[patent_doc_number] => 20240379518
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-11-14
[patent_title] => INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT ASSEMBLIES
[patent_app_type] => utility
[patent_app_number] => 18/313526
[patent_app_country] => US
[patent_app_date] => 2023-05-08
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5384
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -21
[patent_words_short_claim] => 162
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18313526
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/313526 | Interposer for implementing flip-chip dies in wirebonded circuit assemblies | May 7, 2023 | Issued |
Array
(
[id] => 18821143
[patent_doc_number] => 20230395484
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-12-07
[patent_title] => ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
[patent_app_type] => utility
[patent_app_number] => 18/311230
[patent_app_country] => US
[patent_app_date] => 2023-05-02
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 6459
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 42
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18311230
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/311230 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | May 1, 2023 | Pending |
Array
(
[id] => 18958965
[patent_doc_number] => 20240047292
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-08
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 18/140343
[patent_app_country] => US
[patent_app_date] => 2023-04-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7902
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 72
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18140343
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/140343 | SEMICONDUCTOR PACKAGE | Apr 26, 2023 | Pending |
Array
(
[id] => 18991108
[patent_doc_number] => 20240063077
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-22
[patent_title] => SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 18/137809
[patent_app_country] => US
[patent_app_date] => 2023-04-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7122
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 80
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18137809
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/137809 | SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE | Apr 20, 2023 | Pending |
Array
(
[id] => 19384721
[patent_doc_number] => 20240274591
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-15
[patent_title] => SEMICONDUCTOR DEVICE WITH COMMUNICATION RING
[patent_app_type] => utility
[patent_app_number] => 18/110318
[patent_app_country] => US
[patent_app_date] => 2023-02-15
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1944
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 73
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18110318
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/110318 | SEMICONDUCTOR DEVICE WITH COMMUNICATION RING | Feb 14, 2023 | Pending |