
Bryan Bui
Examiner (ID: 6052, Phone: (571)272-2271 , Office: P/2865 )
| Most Active Art Unit | 2863 |
| Art Unit(s) | 2414, 2764, 2863, 2857, 2865 |
| Total Applications | 2284 |
| Issued Applications | 2047 |
| Pending Applications | 88 |
| Abandoned Applications | 146 |
Applications
| Application number | Title of the application | Filing Date | Status |
|---|---|---|---|
Array
(
[id] => 19364228
[patent_doc_number] => 20240266262
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-08-08
[patent_title] => CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR
[patent_app_type] => utility
[patent_app_number] => 18/106779
[patent_app_country] => US
[patent_app_date] => 2023-02-07
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4851
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 115
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18106779
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/106779 | CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR | Feb 6, 2023 | Pending |
Array
(
[id] => 18959011
[patent_doc_number] => 20240047338
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-08
[patent_title] => Integrated Circuit Packages and Methods of Forming the Same
[patent_app_type] => utility
[patent_app_number] => 18/151261
[patent_app_country] => US
[patent_app_date] => 2023-01-06
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11558
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 99
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18151261
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/151261 | Integrated Circuit Packages and Methods of Forming the Same | Jan 5, 2023 | Pending |
Array
(
[id] => 20748214
[patent_doc_number] => 12648153
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-06-02
[patent_title] => Semiconductor device packages and methods of formation
[patent_app_type] => utility
[patent_app_number] => 18/150569
[patent_app_country] => US
[patent_app_date] => 2023-01-05
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 61
[patent_figures_cnt] => 61
[patent_no_of_words] => 12758
[patent_no_of_claims] => 20
[patent_no_of_ind_claims] => 3
[patent_words_short_claim] => 132
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18150569
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/150569 | SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION | Jan 4, 2023 | Issued |
Array
(
[id] => 19285744
[patent_doc_number] => 20240222221
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-07-04
[patent_title] => MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL CONDUCTIVITY AND LOW INTERNAL CONTACT RESISTANCE
[patent_app_type] => utility
[patent_app_number] => 18/149617
[patent_app_country] => US
[patent_app_date] => 2023-01-03
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4279
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 56
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18149617
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/149617 | MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL CONDUCTIVITY AND LOW INTERNAL CONTACT RESISTANCE | Jan 2, 2023 | Pending |
Array
(
[id] => 18696331
[patent_doc_number] => 20230326768
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-10-12
[patent_title] => METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 18/146283
[patent_app_country] => US
[patent_app_date] => 2022-12-23
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10605
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -6
[patent_words_short_claim] => 75
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18146283
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/146283 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Dec 22, 2022 | Abandoned |
Array
(
[id] => 19252812
[patent_doc_number] => 20240203809
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-06-20
[patent_title] => ELECTRONIC DEVICE INCLUDING RIGID DIELECTRIC LID AND OVERLAYING THERMOSET POLYMER LAYER AND RELATED METHODS
[patent_app_type] => utility
[patent_app_number] => 18/085173
[patent_app_country] => US
[patent_app_date] => 2022-12-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 1814
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 88
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 18085173
[rel_patent_id] =>[rel_patent_doc_number] =>) 18/085173 | ELECTRONIC DEVICE INCLUDING RIGID DIELECTRIC LID AND OVERLAYING THERMOSET POLYMER LAYER AND RELATED METHODS | Dec 19, 2022 | Pending |
Array
(
[id] => 18363737
[patent_doc_number] => 20230145328
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-05-11
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/984496
[patent_app_country] => US
[patent_app_date] => 2022-11-10
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 7578
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 295
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17984496
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/984496 | SEMICONDUCTOR DEVICE | Nov 9, 2022 | Pending |
Array
(
[id] => 18440039
[patent_doc_number] => 20230187334
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-15
[patent_title] => SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/974814
[patent_app_country] => US
[patent_app_date] => 2022-10-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 8452
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -13
[patent_words_short_claim] => 148
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17974814
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/974814 | SEMICONDUCTOR DEVICE | Oct 26, 2022 | Pending |
Array
(
[id] => 18600240
[patent_doc_number] => 20230275041
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-08-31
[patent_title] => IMAGE SENSOR
[patent_app_type] => utility
[patent_app_number] => 17/973702
[patent_app_country] => US
[patent_app_date] => 2022-10-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 11683
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 143
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17973702
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/973702 | IMAGE SENSOR | Oct 25, 2022 | Pending |
Array
(
[id] => 20649796
[patent_doc_number] => 12604760
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2026-04-14
[patent_title] => Semiconductor module and method for manufacturing semiconductor module
[patent_app_type] => utility
[patent_app_number] => 17/972215
[patent_app_country] => US
[patent_app_date] => 2022-10-24
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 9
[patent_figures_cnt] => 9
[patent_no_of_words] => 13771
[patent_no_of_claims] => 18
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 198
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17972215
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/972215 | Semiconductor module and method for manufacturing semiconductor module | Oct 23, 2022 | Issued |
Array
(
[id] => 19071156
[patent_doc_number] => 20240105582
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-28
[patent_title] => LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS
[patent_app_type] => utility
[patent_app_number] => 17/955262
[patent_app_country] => US
[patent_app_date] => 2022-09-28
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 12992
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 92
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17955262
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/955262 | LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS | Sep 27, 2022 | Pending |
Array
(
[id] => 18148715
[patent_doc_number] => 20230022572
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-01-26
[patent_title] => PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY
[patent_app_type] => utility
[patent_app_number] => 17/954122
[patent_app_country] => US
[patent_app_date] => 2022-09-27
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4960
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -18
[patent_words_short_claim] => 2
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17954122
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/954122 | PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY | Sep 26, 2022 | Pending |
Array
(
[id] => 19071154
[patent_doc_number] => 20240105580
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-28
[patent_title] => SURFACE FINISH WITH METAL DOME
[patent_app_type] => utility
[patent_app_number] => 17/953213
[patent_app_country] => US
[patent_app_date] => 2022-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 9006
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 44
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17953213
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/953213 | SURFACE FINISH WITH METAL DOME | Sep 25, 2022 | Pending |
Array
(
[id] => 18473129
[patent_doc_number] => 20230207417
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-06-29
[patent_title] => SEMICONDUCTOR PACKAGE
[patent_app_type] => utility
[patent_app_number] => 17/952841
[patent_app_country] => US
[patent_app_date] => 2022-09-26
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 5585
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 108
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17952841
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/952841 | SEMICONDUCTOR PACKAGE | Sep 25, 2022 | Pending |
Array
(
[id] => 19054817
[patent_doc_number] => 20240096786
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-03-21
[patent_title] => SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT
[patent_app_type] => utility
[patent_app_number] => 17/934195
[patent_app_country] => US
[patent_app_date] => 2022-09-21
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3618
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -17
[patent_words_short_claim] => 63
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17934195
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/934195 | SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT | Sep 20, 2022 | Pending |
Array
(
[id] => 18927819
[patent_doc_number] => 20240030823
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-01-25
[patent_title] => PACKAGE APPLIED TO A FLYBACK POWER CONVERTER
[patent_app_type] => utility
[patent_app_number] => 17/949177
[patent_app_country] => US
[patent_app_date] => 2022-09-20
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 2111
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -16
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17949177
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/949177 | PACKAGE APPLIED TO A FLYBACK POWER CONVERTER | Sep 19, 2022 | Pending |
Array
(
[id] => 18297047
[patent_doc_number] => 20230106733
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-04-06
[patent_title] => SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
[patent_app_type] => utility
[patent_app_number] => 17/946501
[patent_app_country] => US
[patent_app_date] => 2022-09-16
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 10094
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -8
[patent_words_short_claim] => 163
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17946501
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/946501 | Semiconductor device and method for manufacturing semiconductor device | Sep 15, 2022 | Issued |
Array
(
[id] => 18975259
[patent_doc_number] => 20240055351
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2024-02-15
[patent_title] => INTERCONNECT STRUCTURE
[patent_app_type] => utility
[patent_app_number] => 17/943224
[patent_app_country] => US
[patent_app_date] => 2022-09-13
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 3198
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -19
[patent_words_short_claim] => 51
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17943224
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/943224 | Interconnect structure | Sep 12, 2022 | Issued |
Array
(
[id] => 20229264
[patent_doc_number] => 12417919
[patent_country] => US
[patent_kind] => B2
[patent_issue_date] => 2025-09-16
[patent_title] => Method for producing a superconducting vanadium silicide on a silicon layer
[patent_app_type] => utility
[patent_app_number] => 17/823654
[patent_app_country] => US
[patent_app_date] => 2022-08-31
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 3
[patent_figures_cnt] => 11
[patent_no_of_words] => 0
[patent_no_of_claims] => 10
[patent_no_of_ind_claims] => 1
[patent_words_short_claim] => 152
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => patent
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17823654
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/823654 | Method for producing a superconducting vanadium silicide on a silicon layer | Aug 30, 2022 | Issued |
Array
(
[id] => 18221735
[patent_doc_number] => 20230060729
[patent_country] => US
[patent_kind] => A1
[patent_issue_date] => 2023-03-02
[patent_title] => POWER DEVICE AND POWER MODULE
[patent_app_type] => utility
[patent_app_number] => 17/823515
[patent_app_country] => US
[patent_app_date] => 2022-08-30
[patent_effective_date] => 0000-00-00
[patent_drawing_sheets_cnt] => 0
[patent_figures_cnt] => 0
[patent_no_of_words] => 4712
[patent_no_of_claims] => 0
[patent_no_of_ind_claims] => -15
[patent_words_short_claim] => 70
[patent_maintenance] => 1
[patent_no_of_assignments] => 0
[patent_current_assignee] =>[type] => publication
[pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 17823515
[rel_patent_id] =>[rel_patent_doc_number] =>) 17/823515 | POWER DEVICE AND POWER MODULE | Aug 29, 2022 | Pending |