Caleb E. Henry

Array ( [id] => 12038849 [patent_doc_number] => 09817079 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-11-14 [patent_title] => 'Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet' [patent_app_type] => utility [patent_app_number] => 14/336305 [patent_app_country] => US [patent_app_date] => 2014-07-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 16 [patent_no_of_words] => 2948 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 162 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14336305 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9995830 [patent_doc_number] => 09040425 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-05-26 [patent_title] => 'Methods of forming printable integrated circuit devices and devices formed thereby' [patent_app_type] => utility [patent_app_number] => 14/334179 [patent_app_country] => US [patent_app_date] => 2014-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 12 [patent_figures_cnt] => 29 [patent_no_of_words] => 5671 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 143 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14334179 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10472531 [patent_doc_number] => 20150357548 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-10 [patent_title] => 'METHOD FOR FORMING A THERMOELECTRIC FILM HAVING A MICRO GROOVE' [patent_app_type] => utility [patent_app_number] => 14/334447 [patent_app_country] => US [patent_app_date] => 2014-07-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 5 [patent_no_of_words] => 2206 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14334447 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10809508 [patent_doc_number] => 20160155666 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-06-02 [patent_title] => 'Providing A Chip Die With Electrically Conductive Elements' [patent_app_type] => utility [patent_app_number] => 14/903525 [patent_app_country] => US [patent_app_date] => 2014-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 17 [patent_figures_cnt] => 17 [patent_no_of_words] => 10704 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14903525 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10817881 [patent_doc_number] => 20160164045 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-06-09 [patent_title] => 'LIGHT EXTRACTION SUBSTRATE FOR ORGANIC LIGHT EMITTING DEVICE, FABRICATION METHOD THEREFOR AND ORGANIC LIGHT EMITTING DEVICE INCLUDING SAME' [patent_app_type] => utility [patent_app_number] => 14/903438 [patent_app_country] => US [patent_app_date] => 2014-07-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 5679 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14903438 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10053632 [patent_doc_number] => 09093518 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-07-28 [patent_title] => 'Singulation of wafers having wafer-level underfill' [patent_app_type] => utility [patent_app_number] => 14/320390 [patent_app_country] => US [patent_app_date] => 2014-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 7 [patent_no_of_words] => 6985 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 94 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14320390 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10131991 [patent_doc_number] => 09165832 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-10-20 [patent_title] => 'Method of die singulation using laser ablation and induction of internal defects with a laser' [patent_app_type] => utility [patent_app_number] => 14/320419 [patent_app_country] => US [patent_app_date] => 2014-06-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 27 [patent_no_of_words] => 7173 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 100 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14320419 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10777185 [patent_doc_number] => 20160123341 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-05-05 [patent_title] => 'CORRECTED RPM CALCULATION METHOD FOR COMPRESSOR, CONTROL METHOD FOR COMPRESSOR, AND DEVICES FOR IMPLEMENTING THESE METHODS' [patent_app_type] => utility [patent_app_number] => 14/889296 [patent_app_country] => US [patent_app_date] => 2014-06-26 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 10918 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14889296 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10358394 [patent_doc_number] => 20150243399 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-27 [patent_title] => 'CONDUCTIVE FILM, METHOD FOR PRODUCING THE SAME AND ARRAY SUBSTRATE COMPRISING THE SAME' [patent_app_type] => utility [patent_app_number] => 14/313502 [patent_app_country] => US [patent_app_date] => 2014-06-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 2 [patent_no_of_words] => 3810 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14313502 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10486915 [patent_doc_number] => 20150371935 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-24 [patent_title] => 'EMBEDDED CHIP PACKAGING TECHNOLOGY' [patent_app_type] => utility [patent_app_number] => 14/311431 [patent_app_country] => US [patent_app_date] => 2014-06-23 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 5502 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14311431 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10479371 [patent_doc_number] => 20150364388 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-17 [patent_title] => 'AUTO-CORRECTION OF MALFUNCTIONING THERMAL CONTROL ELEMENT IN A TEMPERATURE CONTROL PLATE OF A SEMICONDUCTOR SUBSTRATE SUPPORT ASSEMBLY' [patent_app_type] => utility [patent_app_number] => 14/307062 [patent_app_country] => US [patent_app_date] => 2014-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 10 [patent_no_of_words] => 7330 [patent_no_of_claims] => 26 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14307062 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10132063 [patent_doc_number] => 09165904 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-10-20 [patent_title] => 'Insulated wire bonding with EFO before second bond' [patent_app_type] => utility [patent_app_number] => 14/306254 [patent_app_country] => US [patent_app_date] => 2014-06-17 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 2 [patent_figures_cnt] => 6 [patent_no_of_words] => 2229 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 126 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14306254 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 9957887 [patent_doc_number] => 09006091 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-04-14 [patent_title] => 'Method of forming semiconductor device having metal gate' [patent_app_type] => utility [patent_app_number] => 14/302047 [patent_app_country] => US [patent_app_date] => 2014-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 3395 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14302047 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10132343 [patent_doc_number] => 09166188 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-10-20 [patent_title] => 'Organic light emitting diode device' [patent_app_type] => utility [patent_app_number] => 14/300399 [patent_app_country] => US [patent_app_date] => 2014-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 1611 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14300399 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10469048 [patent_doc_number] => 20150354064 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-10 [patent_title] => 'ELECTROLESS PLATING WITH AT LEAST TWO BORANE REDUCING AGENTS' [patent_app_type] => utility [patent_app_number] => 14/297352 [patent_app_country] => US [patent_app_date] => 2014-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2023 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14297352 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10463757 [patent_doc_number] => 20150348772 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-03 [patent_title] => 'Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates' [patent_app_type] => utility [patent_app_number] => 14/294006 [patent_app_country] => US [patent_app_date] => 2014-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 11398 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14294006 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10463883 [patent_doc_number] => 20150348898 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-03 [patent_title] => 'APPARATUS AND METHOD FOR PLACING STRESSORS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES' [patent_app_type] => utility [patent_app_number] => 14/292886 [patent_app_country] => US [patent_app_date] => 2014-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 12003 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14292886 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10537731 [patent_doc_number] => 09263366 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-16 [patent_title] => 'Liquid cooling of semiconductor chips utilizing small scale structures' [patent_app_type] => utility [patent_app_number] => 14/291087 [patent_app_country] => US [patent_app_date] => 2014-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 37 [patent_no_of_words] => 6072 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 271 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14291087 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 11701787 [patent_doc_number] => 09691713 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-06-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/888098 [patent_app_country] => US [patent_app_date] => 2014-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 5454 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14888098 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 10597618 [patent_doc_number] => 09318715 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Hole transport composition without luminance quenching' [patent_app_type] => utility [patent_app_number] => 14/284089 [patent_app_country] => US [patent_app_date] => 2014-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 12037 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14284089 [rel_patent_id] =>[rel_patent_doc_number] =>)