Search

Caleb E. Henry

Examiner (ID: 13871, Phone: (571)270-5370 , Office: P/2894 )

Most Active Art Unit
2894
Art Unit(s)
2818, 2894
Total Applications
1607
Issued Applications
1337
Pending Applications
112
Abandoned Applications
182

Applications

Application numberTitle of the applicationFiling DateStatus
Array ( [id] => 9957887 [patent_doc_number] => 09006091 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-04-14 [patent_title] => 'Method of forming semiconductor device having metal gate' [patent_app_type] => utility [patent_app_number] => 14/302047 [patent_app_country] => US [patent_app_date] => 2014-06-11 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 3395 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 201 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14302047 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/302047
Method of forming semiconductor device having metal gate Jun 10, 2014 Issued
Array ( [id] => 10132343 [patent_doc_number] => 09166188 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2015-10-20 [patent_title] => 'Organic light emitting diode device' [patent_app_type] => utility [patent_app_number] => 14/300399 [patent_app_country] => US [patent_app_date] => 2014-06-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 5 [patent_figures_cnt] => 8 [patent_no_of_words] => 1611 [patent_no_of_claims] => 8 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 196 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14300399 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/300399
Organic light emitting diode device Jun 9, 2014 Issued
Array ( [id] => 10469048 [patent_doc_number] => 20150354064 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-10 [patent_title] => 'ELECTROLESS PLATING WITH AT LEAST TWO BORANE REDUCING AGENTS' [patent_app_type] => utility [patent_app_number] => 14/297352 [patent_app_country] => US [patent_app_date] => 2014-06-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 2023 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 6 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14297352 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/297352
Electroless plating solution with at least two borane containing reducing agents Jun 4, 2014 Issued
Array ( [id] => 10463757 [patent_doc_number] => 20150348772 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-03 [patent_title] => 'Metallization Of The Wafer Edge For Optimized Electroplating Performance On Resistive Substrates' [patent_app_type] => utility [patent_app_number] => 14/294006 [patent_app_country] => US [patent_app_date] => 2014-06-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 11398 [patent_no_of_claims] => 32 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14294006 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/294006
Metallization of the wafer edge for optimized electroplating performance on resistive substrates Jun 1, 2014 Issued
Array ( [id] => 10463883 [patent_doc_number] => 20150348898 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-12-03 [patent_title] => 'APPARATUS AND METHOD FOR PLACING STRESSORS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES' [patent_app_type] => utility [patent_app_number] => 14/292886 [patent_app_country] => US [patent_app_date] => 2014-05-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 18 [patent_figures_cnt] => 18 [patent_no_of_words] => 12003 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14292886 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/292886
Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures May 30, 2014 Issued
Array ( [id] => 10537731 [patent_doc_number] => 09263366 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-02-16 [patent_title] => 'Liquid cooling of semiconductor chips utilizing small scale structures' [patent_app_type] => utility [patent_app_number] => 14/291087 [patent_app_country] => US [patent_app_date] => 2014-05-30 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 10 [patent_figures_cnt] => 37 [patent_no_of_words] => 6072 [patent_no_of_claims] => 11 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 271 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14291087 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/291087
Liquid cooling of semiconductor chips utilizing small scale structures May 29, 2014 Issued
Array ( [id] => 11701787 [patent_doc_number] => 09691713 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-06-27 [patent_title] => 'Semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/888098 [patent_app_country] => US [patent_app_date] => 2014-05-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 16 [patent_no_of_words] => 5454 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 205 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14888098 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/888098
Semiconductor device May 28, 2014 Issued
Array ( [id] => 10597618 [patent_doc_number] => 09318715 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-04-19 [patent_title] => 'Hole transport composition without luminance quenching' [patent_app_type] => utility [patent_app_number] => 14/284089 [patent_app_country] => US [patent_app_date] => 2014-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 4 [patent_no_of_words] => 12037 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 41 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14284089 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/284089
Hole transport composition without luminance quenching May 20, 2014 Issued
Array ( [id] => 10624419 [patent_doc_number] => 09343369 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2016-05-17 [patent_title] => 'Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems' [patent_app_type] => utility [patent_app_number] => 14/280731 [patent_app_country] => US [patent_app_date] => 2014-05-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 5606 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 108 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14280731 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/280731
Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems May 18, 2014 Issued
Array ( [id] => 11100706 [patent_doc_number] => 20160297676 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-10-13 [patent_title] => 'Method For Applying A Structured Coating To A Component' [patent_app_type] => utility [patent_app_number] => 14/970749 [patent_app_country] => US [patent_app_date] => 2014-05-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 9025 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14970749 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/970749
Method for applying a structured coating to a component May 11, 2014 Issued
Array ( [id] => 9671138 [patent_doc_number] => 20140235001 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-21 [patent_title] => 'Reflective Layer for Light-Emitting Diodes' [patent_app_type] => utility [patent_app_number] => 14/267964 [patent_app_country] => US [patent_app_date] => 2014-05-02 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 6 [patent_figures_cnt] => 6 [patent_no_of_words] => 3937 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14267964 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/267964
Method of forming light-generating device including reflective layer May 1, 2014 Issued
Array ( [id] => 10858129 [patent_doc_number] => 08884333 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2014-11-11 [patent_title] => 'Nitride semiconductor device' [patent_app_type] => utility [patent_app_number] => 14/265192 [patent_app_country] => US [patent_app_date] => 2014-04-29 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 17 [patent_no_of_words] => 4610 [patent_no_of_claims] => 7 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 181 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14265192 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/265192
Nitride semiconductor device Apr 28, 2014 Issued
Array ( [id] => 10195927 [patent_doc_number] => 09224842 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2015-12-29 [patent_title] => 'Patterning multiple, dense features in a semiconductor device using a memorization layer' [patent_app_type] => utility [patent_app_number] => 14/258488 [patent_app_country] => US [patent_app_date] => 2014-04-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 7 [patent_figures_cnt] => 14 [patent_no_of_words] => 4310 [patent_no_of_claims] => 16 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 155 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14258488 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/258488
Patterning multiple, dense features in a semiconductor device using a memorization layer Apr 21, 2014 Issued
Array ( [id] => 9642654 [patent_doc_number] => 20140220765 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-08-07 [patent_title] => 'METHOD FOR SEPARATING SUPPORT SUBSTRATE FROM SOLID-PHASE BONDED WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE' [patent_app_type] => utility [patent_app_number] => 14/249480 [patent_app_country] => US [patent_app_date] => 2014-04-10 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 9 [patent_figures_cnt] => 9 [patent_no_of_words] => 9201 [patent_no_of_claims] => 14 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14249480 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/249480
Wafer support system and method for separating support substrate from solid-phase bonded wafer and method for manufacturing semiconductor device Apr 9, 2014 Issued
Array ( [id] => 11000365 [patent_doc_number] => 20160197312 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2016-07-07 [patent_title] => 'ELEMENT MANUFACTURING METHOD AND ELEMENT MANUFACTURING APPARATUS' [patent_app_type] => utility [patent_app_number] => 14/777794 [patent_app_country] => US [patent_app_date] => 2014-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 15 [patent_figures_cnt] => 15 [patent_no_of_words] => 22320 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14777794 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/777794
Element manufacturing method and element manufacturing apparatus utilizing differential pressure for covering a substrate Mar 27, 2014 Issued
Array ( [id] => 10336767 [patent_doc_number] => 20150221772 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-06 [patent_title] => 'MOLECULAR PRECURSOR COMPOUNDS FOR ABIZO ZINC-GROUP 13 MIXED OXIDE MATERIALS' [patent_app_type] => utility [patent_app_number] => 14/174738 [patent_app_country] => US [patent_app_date] => 2014-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 18168 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14174738 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/174738
MOLECULAR PRECURSOR COMPOUNDS FOR ABIZO ZINC-GROUP 13 MIXED OXIDE MATERIALS Feb 5, 2014 Abandoned
Array ( [id] => 10336766 [patent_doc_number] => 20150221771 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2015-08-06 [patent_title] => 'MOLECULAR PRECURSOR COMPOUNDS FOR ABGZO ZINC-GROUP 13 MIXED OXIDE MATERIALS' [patent_app_type] => utility [patent_app_number] => 14/174692 [patent_app_country] => US [patent_app_date] => 2014-02-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 4 [patent_figures_cnt] => 4 [patent_no_of_words] => 17442 [patent_no_of_claims] => 35 [patent_no_of_ind_claims] => 5 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14174692 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/174692
MOLECULAR PRECURSOR COMPOUNDS FOR ABGZO ZINC-GROUP 13 MIXED OXIDE MATERIALS Feb 5, 2014 Abandoned
Array ( [id] => 9518391 [patent_doc_number] => 20140154883 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-06-05 [patent_title] => 'TUNGSTEN NUCLEATION PROCESS TO ENABLE LOW RESISTIVITY TUNGSTEN FEATURE FILL' [patent_app_type] => utility [patent_app_number] => 14/173733 [patent_app_country] => US [patent_app_date] => 2014-02-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 11 [patent_no_of_words] => 10216 [patent_no_of_claims] => 19 [patent_no_of_ind_claims] => 3 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14173733 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/173733
Tungsten deposition process using germanium-containing reducing agent Feb 4, 2014 Issued
Array ( [id] => 9463458 [patent_doc_number] => 20140127885 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2014-05-08 [patent_title] => 'SEMICONDUCTOR DIE SINGULATION METHOD' [patent_app_type] => utility [patent_app_number] => 14/153940 [patent_app_country] => US [patent_app_date] => 2014-01-13 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 16 [patent_figures_cnt] => 16 [patent_no_of_words] => 8093 [patent_no_of_claims] => 21 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 0 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14153940 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/153940
Heated carrier substrate semiconductor die singulation method Jan 12, 2014 Issued
Array ( [id] => 11578715 [patent_doc_number] => 09633985 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2017-04-25 [patent_title] => 'First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof' [patent_app_type] => utility [patent_app_number] => 14/901483 [patent_app_country] => US [patent_app_date] => 2014-01-08 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 85 [patent_no_of_words] => 10649 [patent_no_of_claims] => 10 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 1064 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 14901483 [rel_patent_id] =>[rel_patent_doc_number] =>)
14/901483
First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereof Jan 7, 2014 Issued
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