Calvin Lee

Array ( [id] => 13485253 [patent_doc_number] => 20180294169 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-10-11 [patent_title] => STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL [patent_app_type] => utility [patent_app_number] => 16/002843 [patent_app_country] => US [patent_app_date] => 2018-06-07 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5374 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 77 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16002843 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13451919 [patent_doc_number] => 20180277502 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-09-27 [patent_title] => METHOD AND APPARATUS FOR BACK-BIASED SWITCH TRANSISTORS [patent_app_type] => utility [patent_app_number] => 15/988916 [patent_app_country] => US [patent_app_date] => 2018-05-24 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6731 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -10 [patent_words_short_claim] => 80 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15988916 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 14859197 [patent_doc_number] => 10418333 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-09-17 [patent_title] => Waveguide along shielded side wall [patent_app_type] => utility [patent_app_number] => 15/985978 [patent_app_country] => US [patent_app_date] => 2018-05-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 8 [patent_figures_cnt] => 8 [patent_no_of_words] => 5065 [patent_no_of_claims] => 15 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 119 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15985978 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 14267657 [patent_doc_number] => 10283399 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-05-07 [patent_title] => Sensor array with anti-diffusion region(s) to extend shelf life [patent_app_type] => utility [patent_app_number] => 15/984751 [patent_app_country] => US [patent_app_date] => 2018-05-21 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 3 [patent_figures_cnt] => 12 [patent_no_of_words] => 5821 [patent_no_of_claims] => 18 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 315 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15984751 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13420119 [patent_doc_number] => 20180261602 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-09-13 [patent_title] => Memory Devices which include Memory Arrays [patent_app_type] => utility [patent_app_number] => 15/975598 [patent_app_country] => US [patent_app_date] => 2018-05-09 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 6085 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15975598 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15139397 [patent_doc_number] => 10483184 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-11-19 [patent_title] => Recursive metal embedded chip assembly [patent_app_type] => utility [patent_app_number] => 15/951875 [patent_app_country] => US [patent_app_date] => 2018-04-12 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 11 [patent_figures_cnt] => 13 [patent_no_of_words] => 4160 [patent_no_of_claims] => 34 [patent_no_of_ind_claims] => 4 [patent_words_short_claim] => 91 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15951875 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13893471 [patent_doc_number] => 10199288 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-05 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one side-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective side-to-side short, corner short, and via open test areas [patent_app_type] => utility [patent_app_number] => 15/942483 [patent_app_country] => US [patent_app_date] => 2018-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 314 [patent_no_of_words] => 45506 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15942483 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13893473 [patent_doc_number] => 10199289 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-05 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one chamfer short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective chamfer short, corner short, and via open test areas [patent_app_type] => utility [patent_app_number] => 15/942485 [patent_app_country] => US [patent_app_date] => 2018-03-31 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 314 [patent_no_of_words] => 45513 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15942485 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 14263065 [patent_doc_number] => 10281091 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2019-05-07 [patent_title] => High efficiency LEDs and LED lamps [patent_app_type] => utility [patent_app_number] => 15/938336 [patent_app_country] => US [patent_app_date] => 2018-03-28 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 28 [patent_figures_cnt] => 80 [patent_no_of_words] => 61355 [patent_no_of_claims] => 24 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 106 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15938336 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13893463 [patent_doc_number] => 10199284 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-05 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and chamfer short test areas [patent_app_type] => utility [patent_app_number] => 15/936825 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 314 [patent_no_of_words] => 45511 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15936825 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13893465 [patent_doc_number] => 10199285 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-05 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakages, and at least one via respective tip-to-tip short, side-to-side short, and via open test areas [patent_app_type] => utility [patent_app_number] => 15/937356 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 314 [patent_no_of_words] => 45512 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15937356 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16944270 [patent_doc_number] => 11056521 [patent_country] => US [patent_kind] => B2 [patent_issue_date] => 2021-07-06 [patent_title] => Imaging device and image sensor [patent_app_type] => utility [patent_app_number] => 16/476437 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 14 [patent_figures_cnt] => 14 [patent_no_of_words] => 18382 [patent_no_of_claims] => 17 [patent_no_of_ind_claims] => 2 [patent_words_short_claim] => 114 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16476437 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13950665 [patent_doc_number] => 10211111 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-19 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas [patent_app_type] => utility [patent_app_number] => 15/936934 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 314 [patent_no_of_words] => 45506 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15936934 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13950667 [patent_doc_number] => 10211112 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-19 [patent_title] => Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas [patent_app_type] => utility [patent_app_number] => 15/936759 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 315 [patent_no_of_words] => 45516 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15936759 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13893481 [patent_doc_number] => 10199293 [patent_country] => US [patent_kind] => B1 [patent_issue_date] => 2019-02-05 [patent_title] => Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas [patent_app_type] => utility [patent_app_number] => 15/937182 [patent_app_country] => US [patent_app_date] => 2018-03-27 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 209 [patent_figures_cnt] => 313 [patent_no_of_words] => 45506 [patent_no_of_claims] => 20 [patent_no_of_ind_claims] => 1 [patent_words_short_claim] => 295 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => patent [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15937182 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15369983 [patent_doc_number] => 20200020756 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-01-16 [patent_title] => ACTIVE MATRIX SUBSTRATE AND METHOD FOR PRODUCING SAME [patent_app_type] => utility [patent_app_number] => 16/496969 [patent_app_country] => US [patent_app_date] => 2018-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 18365 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -13 [patent_words_short_claim] => 231 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16496969 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 13320737 [patent_doc_number] => 20180211906 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2018-07-26 [patent_title] => DISPLAY DEVICE [patent_app_type] => utility [patent_app_number] => 15/924812 [patent_app_country] => US [patent_app_date] => 2018-03-19 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 5756 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -17 [patent_words_short_claim] => 105 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 15924812 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15443343 [patent_doc_number] => 20200035855 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-01-30 [patent_title] => Method for Transferring Semiconductor Bodies and Semiconductor Chip [patent_app_type] => utility [patent_app_number] => 16/488571 [patent_app_country] => US [patent_app_date] => 2018-03-06 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 7826 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -11 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16488571 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 15462587 [patent_doc_number] => 20200044118 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-02-06 [patent_title] => Optoelectronic Component and Method for Producing an Optoelectronic Component [patent_app_type] => utility [patent_app_number] => 16/488548 [patent_app_country] => US [patent_app_date] => 2018-03-05 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 3570 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -14 [patent_words_short_claim] => 2 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16488548 [rel_patent_id] =>[rel_patent_doc_number] =>)

Array ( [id] => 16210609 [patent_doc_number] => 20200243599 [patent_country] => US [patent_kind] => A1 [patent_issue_date] => 2020-07-30 [patent_title] => LIGHT EMITTING TRANSDUCER [patent_app_type] => utility [patent_app_number] => 16/488505 [patent_app_country] => US [patent_app_date] => 2018-02-22 [patent_effective_date] => 0000-00-00 [patent_drawing_sheets_cnt] => 0 [patent_figures_cnt] => 0 [patent_no_of_words] => 16188 [patent_no_of_claims] => 0 [patent_no_of_ind_claims] => -46 [patent_words_short_claim] => 139 [patent_maintenance] => 1 [patent_no_of_assignments] => 0 [patent_current_assignee] =>[type] => publication [pdf_file] =>[firstpage_image] =>[orig_patent_app_number] => 16488505 [rel_patent_id] =>[rel_patent_doc_number] =>)